JP4701008B2 - ジンバル機構を備えた転写装置 - Google Patents

ジンバル機構を備えた転写装置 Download PDF

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Publication number
JP4701008B2
JP4701008B2 JP2005153003A JP2005153003A JP4701008B2 JP 4701008 B2 JP4701008 B2 JP 4701008B2 JP 2005153003 A JP2005153003 A JP 2005153003A JP 2005153003 A JP2005153003 A JP 2005153003A JP 4701008 B2 JP4701008 B2 JP 4701008B2
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JP
Japan
Prior art keywords
gimbal
gimbal mechanism
transfer device
mold
movable body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005153003A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006326992A (ja
JP2006326992A5 (enExample
Inventor
光典 小久保
健太郎 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP2005153003A priority Critical patent/JP4701008B2/ja
Priority to TW095118311A priority patent/TWI307314B/zh
Priority to US11/439,291 priority patent/US7448862B2/en
Priority to KR1020060046427A priority patent/KR100764295B1/ko
Priority to DE102006024390.0A priority patent/DE102006024390B4/de
Publication of JP2006326992A publication Critical patent/JP2006326992A/ja
Publication of JP2006326992A5 publication Critical patent/JP2006326992A5/ja
Application granted granted Critical
Publication of JP4701008B2 publication Critical patent/JP4701008B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Micromachines (AREA)
JP2005153003A 2005-05-25 2005-05-25 ジンバル機構を備えた転写装置 Expired - Lifetime JP4701008B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005153003A JP4701008B2 (ja) 2005-05-25 2005-05-25 ジンバル機構を備えた転写装置
TW095118311A TWI307314B (en) 2005-05-25 2006-05-23 Transcript apparatus
US11/439,291 US7448862B2 (en) 2005-05-25 2006-05-24 Transcript apparatus
KR1020060046427A KR100764295B1 (ko) 2005-05-25 2006-05-24 전사 장치
DE102006024390.0A DE102006024390B4 (de) 2005-05-25 2006-05-24 Übertragungsvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005153003A JP4701008B2 (ja) 2005-05-25 2005-05-25 ジンバル機構を備えた転写装置

Publications (3)

Publication Number Publication Date
JP2006326992A JP2006326992A (ja) 2006-12-07
JP2006326992A5 JP2006326992A5 (enExample) 2008-05-08
JP4701008B2 true JP4701008B2 (ja) 2011-06-15

Family

ID=37387904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005153003A Expired - Lifetime JP4701008B2 (ja) 2005-05-25 2005-05-25 ジンバル機構を備えた転写装置

Country Status (5)

Country Link
US (1) US7448862B2 (enExample)
JP (1) JP4701008B2 (enExample)
KR (1) KR100764295B1 (enExample)
DE (1) DE102006024390B4 (enExample)
TW (1) TWI307314B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7648354B2 (en) * 2005-04-28 2010-01-19 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
JP5267174B2 (ja) * 2009-02-03 2013-08-21 ソニー株式会社 光造形装置及び造形ベース
JP4597254B1 (ja) * 2009-10-16 2010-12-15 株式会社ユアビジネス 回動体の回動構造
CN109501225B (zh) * 2018-12-31 2024-08-13 焦作飞鸿安全玻璃有限公司 一种注塑产品表面金属效果处理装置
US11567417B2 (en) * 2021-01-20 2023-01-31 Applied Materials, Inc. Anti-slippery stamp landing ring
CN115872353B (zh) * 2022-12-06 2025-07-29 华中光电技术研究所(中国船舶集团有限公司第七一七研究所) 一种石英谐振梁芯片贴片装置和方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2151202A5 (enExample) * 1971-08-25 1973-04-13 Lunetiers
US4316712A (en) * 1980-11-10 1982-02-23 Medendorp Roger L Press and actuator therefor
US4878826A (en) * 1987-12-07 1989-11-07 Wendt Michael L Apparatus for thermoforming plastic materials
EP0339616B1 (en) * 1988-04-27 1997-01-08 Dainippon Ink And Chemicals, Inc. Apparatus for manufacturing optical information recording medium
US4969812A (en) * 1989-05-30 1990-11-13 Brown Gaylord W Fluid pressure operated apparatus for mounting a differential pressure mold on a platen
JP3230833B2 (ja) * 1992-03-27 2001-11-19 日立テクノエンジニアリング株式会社 ホットプレス
JPH11314231A (ja) * 1998-03-06 1999-11-16 Toshiba Corp 光学部品製造方法及びその装置
DE19819761C2 (de) * 1998-05-04 2000-05-31 Jenoptik Jena Gmbh Einrichtung zur Trennung eines geformten Substrates von einem Prägewerkzeug
DE19925175C1 (de) * 1999-05-27 2000-05-25 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Übertragung von Mikrostrukturen
JP3558936B2 (ja) * 1999-11-10 2004-08-25 日本電信電話株式会社 薄膜形成装置
US6364648B1 (en) * 1999-12-21 2002-04-02 Johnson & Johnson Vision Care, Inc. Four axis casting fixture
US6808443B2 (en) * 2000-07-01 2004-10-26 Lam Research Corporation Projected gimbal point drive
JP2002251802A (ja) * 2001-02-23 2002-09-06 Sony Corp ディスク状記録媒体の製造方法及び金型装置
JP3679767B2 (ja) * 2002-02-26 2005-08-03 キヤノン株式会社 ステージ位置決め装置及びその制御方法、露光装置、半導体デバイスの製造方法
JP4395704B2 (ja) * 2002-05-17 2010-01-13 コニカミノルタホールディングス株式会社 成形装置
JP3472963B1 (ja) * 2002-05-30 2003-12-02 ミカドテクノス株式会社 高温用真空プレス装置
JP2004034300A (ja) 2002-06-28 2004-02-05 Elionix Kk 微小型押成形装置
MY144124A (en) * 2002-07-11 2011-08-15 Molecular Imprints Inc Step and repeat imprint lithography systems
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
JP3783054B2 (ja) * 2002-10-24 2006-06-07 独立行政法人産業技術総合研究所 アクティブダブルジョイント式加圧機構
JP4220282B2 (ja) 2003-03-20 2009-02-04 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
JP4340086B2 (ja) * 2003-03-20 2009-10-07 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
TW568349U (en) * 2003-05-02 2003-12-21 Ind Tech Res Inst Parallelism adjusting device for nano-transferring
JP2004358857A (ja) 2003-06-06 2004-12-24 Meiki Co Ltd 微細な凹凸面を有する樹脂成形品の成形装置
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
JP4313109B2 (ja) * 2003-08-01 2009-08-12 明昌機工株式会社 高精度プレス機
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
US7140861B2 (en) * 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US7059198B2 (en) * 2004-08-17 2006-06-13 Amitkumar N. Dharia Apparatus to determine ability of plastic material to be shaped by thermoforming process
JP4500183B2 (ja) 2005-02-25 2010-07-14 東芝機械株式会社 転写装置
JP4700996B2 (ja) * 2005-04-19 2011-06-15 東芝機械株式会社 転写装置

Also Published As

Publication number Publication date
US7448862B2 (en) 2008-11-11
KR20060121743A (ko) 2006-11-29
TW200711852A (en) 2007-04-01
JP2006326992A (ja) 2006-12-07
DE102006024390B4 (de) 2016-12-29
US20060269645A1 (en) 2006-11-30
TWI307314B (en) 2009-03-11
DE102006024390A1 (de) 2006-11-30
KR100764295B1 (ko) 2007-10-05

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