TWI307314B - Transcript apparatus - Google Patents
Transcript apparatus Download PDFInfo
- Publication number
- TWI307314B TWI307314B TW095118311A TW95118311A TWI307314B TW I307314 B TWI307314 B TW I307314B TW 095118311 A TW095118311 A TW 095118311A TW 95118311 A TW95118311 A TW 95118311A TW I307314 B TWI307314 B TW I307314B
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- transfer device
- movable body
- balance member
- balance
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005153003A JP4701008B2 (ja) | 2005-05-25 | 2005-05-25 | ジンバル機構を備えた転写装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200711852A TW200711852A (en) | 2007-04-01 |
| TWI307314B true TWI307314B (en) | 2009-03-11 |
Family
ID=37387904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095118311A TWI307314B (en) | 2005-05-25 | 2006-05-23 | Transcript apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7448862B2 (enExample) |
| JP (1) | JP4701008B2 (enExample) |
| KR (1) | KR100764295B1 (enExample) |
| DE (1) | DE102006024390B4 (enExample) |
| TW (1) | TWI307314B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7648354B2 (en) * | 2005-04-28 | 2010-01-19 | Toshiba Kikai Kabushiki Kaisha | Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus |
| JP5517423B2 (ja) * | 2008-08-26 | 2014-06-11 | キヤノン株式会社 | インプリント装置及びインプリント方法 |
| JP5267174B2 (ja) * | 2009-02-03 | 2013-08-21 | ソニー株式会社 | 光造形装置及び造形ベース |
| JP4597254B1 (ja) * | 2009-10-16 | 2010-12-15 | 株式会社ユアビジネス | 回動体の回動構造 |
| CN109501225B (zh) * | 2018-12-31 | 2024-08-13 | 焦作飞鸿安全玻璃有限公司 | 一种注塑产品表面金属效果处理装置 |
| US11567417B2 (en) * | 2021-01-20 | 2023-01-31 | Applied Materials, Inc. | Anti-slippery stamp landing ring |
| CN115872353B (zh) * | 2022-12-06 | 2025-07-29 | 华中光电技术研究所(中国船舶集团有限公司第七一七研究所) | 一种石英谐振梁芯片贴片装置和方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2151202A5 (enExample) * | 1971-08-25 | 1973-04-13 | Lunetiers | |
| US4316712A (en) * | 1980-11-10 | 1982-02-23 | Medendorp Roger L | Press and actuator therefor |
| US4878826A (en) * | 1987-12-07 | 1989-11-07 | Wendt Michael L | Apparatus for thermoforming plastic materials |
| EP0339616B1 (en) * | 1988-04-27 | 1997-01-08 | Dainippon Ink And Chemicals, Inc. | Apparatus for manufacturing optical information recording medium |
| US4969812A (en) * | 1989-05-30 | 1990-11-13 | Brown Gaylord W | Fluid pressure operated apparatus for mounting a differential pressure mold on a platen |
| JP3230833B2 (ja) * | 1992-03-27 | 2001-11-19 | 日立テクノエンジニアリング株式会社 | ホットプレス |
| JPH11314231A (ja) * | 1998-03-06 | 1999-11-16 | Toshiba Corp | 光学部品製造方法及びその装置 |
| DE19819761C2 (de) * | 1998-05-04 | 2000-05-31 | Jenoptik Jena Gmbh | Einrichtung zur Trennung eines geformten Substrates von einem Prägewerkzeug |
| DE19925175C1 (de) * | 1999-05-27 | 2000-05-25 | Jenoptik Jena Gmbh | Einrichtung und Verfahren zur Übertragung von Mikrostrukturen |
| JP3558936B2 (ja) * | 1999-11-10 | 2004-08-25 | 日本電信電話株式会社 | 薄膜形成装置 |
| US6364648B1 (en) * | 1999-12-21 | 2002-04-02 | Johnson & Johnson Vision Care, Inc. | Four axis casting fixture |
| US6808443B2 (en) * | 2000-07-01 | 2004-10-26 | Lam Research Corporation | Projected gimbal point drive |
| JP2002251802A (ja) * | 2001-02-23 | 2002-09-06 | Sony Corp | ディスク状記録媒体の製造方法及び金型装置 |
| JP3679767B2 (ja) * | 2002-02-26 | 2005-08-03 | キヤノン株式会社 | ステージ位置決め装置及びその制御方法、露光装置、半導体デバイスの製造方法 |
| JP4395704B2 (ja) * | 2002-05-17 | 2010-01-13 | コニカミノルタホールディングス株式会社 | 成形装置 |
| JP3472963B1 (ja) * | 2002-05-30 | 2003-12-02 | ミカドテクノス株式会社 | 高温用真空プレス装置 |
| JP2004034300A (ja) | 2002-06-28 | 2004-02-05 | Elionix Kk | 微小型押成形装置 |
| MY144124A (en) * | 2002-07-11 | 2011-08-15 | Molecular Imprints Inc | Step and repeat imprint lithography systems |
| US7070405B2 (en) * | 2002-08-01 | 2006-07-04 | Molecular Imprints, Inc. | Alignment systems for imprint lithography |
| JP3783054B2 (ja) * | 2002-10-24 | 2006-06-07 | 独立行政法人産業技術総合研究所 | アクティブダブルジョイント式加圧機構 |
| JP4220282B2 (ja) | 2003-03-20 | 2009-02-04 | 株式会社日立製作所 | ナノプリント装置、及び微細構造転写方法 |
| JP4340086B2 (ja) * | 2003-03-20 | 2009-10-07 | 株式会社日立製作所 | ナノプリント用スタンパ、及び微細構造転写方法 |
| TW568349U (en) * | 2003-05-02 | 2003-12-21 | Ind Tech Res Inst | Parallelism adjusting device for nano-transferring |
| JP2004358857A (ja) | 2003-06-06 | 2004-12-24 | Meiki Co Ltd | 微細な凹凸面を有する樹脂成形品の成形装置 |
| US7150622B2 (en) * | 2003-07-09 | 2006-12-19 | Molecular Imprints, Inc. | Systems for magnification and distortion correction for imprint lithography processes |
| JP4313109B2 (ja) * | 2003-08-01 | 2009-08-12 | 明昌機工株式会社 | 高精度プレス機 |
| JP2005101201A (ja) * | 2003-09-24 | 2005-04-14 | Canon Inc | ナノインプリント装置 |
| US7140861B2 (en) * | 2004-04-27 | 2006-11-28 | Molecular Imprints, Inc. | Compliant hard template for UV imprinting |
| US7059198B2 (en) * | 2004-08-17 | 2006-06-13 | Amitkumar N. Dharia | Apparatus to determine ability of plastic material to be shaped by thermoforming process |
| JP4500183B2 (ja) | 2005-02-25 | 2010-07-14 | 東芝機械株式会社 | 転写装置 |
| JP4700996B2 (ja) * | 2005-04-19 | 2011-06-15 | 東芝機械株式会社 | 転写装置 |
-
2005
- 2005-05-25 JP JP2005153003A patent/JP4701008B2/ja not_active Expired - Lifetime
-
2006
- 2006-05-23 TW TW095118311A patent/TWI307314B/zh active
- 2006-05-24 US US11/439,291 patent/US7448862B2/en not_active Expired - Fee Related
- 2006-05-24 DE DE102006024390.0A patent/DE102006024390B4/de active Active
- 2006-05-24 KR KR1020060046427A patent/KR100764295B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US7448862B2 (en) | 2008-11-11 |
| KR20060121743A (ko) | 2006-11-29 |
| TW200711852A (en) | 2007-04-01 |
| JP2006326992A (ja) | 2006-12-07 |
| DE102006024390B4 (de) | 2016-12-29 |
| JP4701008B2 (ja) | 2011-06-15 |
| US20060269645A1 (en) | 2006-11-30 |
| DE102006024390A1 (de) | 2006-11-30 |
| KR100764295B1 (ko) | 2007-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8318074B2 (en) | Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus | |
| JP4500183B2 (ja) | 転写装置 | |
| TWI307314B (en) | Transcript apparatus | |
| US7465162B2 (en) | Transcript apparatus | |
| TWI307313B (en) | Transcript apparatus | |
| JP2006326992A5 (enExample) | ||
| JP2009286067A (ja) | 転写装置、プレス装置および位置姿勢調整機構 | |
| JP4732801B2 (ja) | ジンバル機構を備えた転写装置及び同装置を用いた転写方法 | |
| JP4729337B2 (ja) | ジンバル機構を備えた転写装置及び同装置を用いる転写方法 | |
| JP4854313B2 (ja) | 転写装置における制御装置 | |
| JP2006326991A5 (enExample) | ||
| JP4732800B2 (ja) | ジンバル機構を備えた転写装置及び同装置を用いた転写方法 | |
| JP5328869B2 (ja) | 転写用の型の製造方法 | |
| JP2006305930A5 (enExample) | ||
| JP4966586B2 (ja) | 転写装置 | |
| JP2006326980A5 (enExample) | ||
| JP4857050B2 (ja) | ジンバル機構を備えた転写装置 | |
| JP5258955B2 (ja) | 転写装置 | |
| JP7161309B2 (ja) | ステージ装置、リソグラフィ装置、および物品の製造方法 | |
| JP5328885B2 (ja) | 転写装置 | |
| JP2008000945A (ja) | 転写用の型 | |
| JP2020202270A (ja) | 膜形成装置および物品製造方法 | |
| JP2021184441A (ja) | モールド、インプリント装置、および物品製造方法 | |
| WO2010082300A1 (ja) | 転写装置 |