KR100764295B1 - 전사 장치 - Google Patents

전사 장치 Download PDF

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Publication number
KR100764295B1
KR100764295B1 KR1020060046427A KR20060046427A KR100764295B1 KR 100764295 B1 KR100764295 B1 KR 100764295B1 KR 1020060046427 A KR1020060046427 A KR 1020060046427A KR 20060046427 A KR20060046427 A KR 20060046427A KR 100764295 B1 KR100764295 B1 KR 100764295B1
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KR
South Korea
Prior art keywords
die
ultraviolet
movable body
gimbal
gimbal member
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KR1020060046427A
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English (en)
Korean (ko)
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KR20060121743A (ko
Inventor
미쯔노리 고꾸보
겐따로 이시바시
Original Assignee
도시바 기카이 가부시키가이샤
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Publication of KR20060121743A publication Critical patent/KR20060121743A/ko
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Micromachines (AREA)
KR1020060046427A 2005-05-25 2006-05-24 전사 장치 Active KR100764295B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005153003A JP4701008B2 (ja) 2005-05-25 2005-05-25 ジンバル機構を備えた転写装置
JPJP-P-2005-00153003 2005-05-25

Publications (2)

Publication Number Publication Date
KR20060121743A KR20060121743A (ko) 2006-11-29
KR100764295B1 true KR100764295B1 (ko) 2007-10-05

Family

ID=37387904

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060046427A Active KR100764295B1 (ko) 2005-05-25 2006-05-24 전사 장치

Country Status (5)

Country Link
US (1) US7448862B2 (enExample)
JP (1) JP4701008B2 (enExample)
KR (1) KR100764295B1 (enExample)
DE (1) DE102006024390B4 (enExample)
TW (1) TWI307314B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7648354B2 (en) * 2005-04-28 2010-01-19 Toshiba Kikai Kabushiki Kaisha Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
JP5267174B2 (ja) * 2009-02-03 2013-08-21 ソニー株式会社 光造形装置及び造形ベース
JP4597254B1 (ja) * 2009-10-16 2010-12-15 株式会社ユアビジネス 回動体の回動構造
CN109501225B (zh) * 2018-12-31 2024-08-13 焦作飞鸿安全玻璃有限公司 一种注塑产品表面金属效果处理装置
US11567417B2 (en) * 2021-01-20 2023-01-31 Applied Materials, Inc. Anti-slippery stamp landing ring
CN115872353B (zh) * 2022-12-06 2025-07-29 华中光电技术研究所(中国船舶集团有限公司第七一七研究所) 一种石英谐振梁芯片贴片装置和方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030070854A (ko) * 2002-02-26 2003-09-02 캐논 가부시끼가이샤 스테이지 위치결정장치 및 그 제어방법, 노광장치, 반도체디바이스의 제조방법

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FR2151202A5 (enExample) * 1971-08-25 1973-04-13 Lunetiers
US4316712A (en) * 1980-11-10 1982-02-23 Medendorp Roger L Press and actuator therefor
US4878826A (en) * 1987-12-07 1989-11-07 Wendt Michael L Apparatus for thermoforming plastic materials
EP0339616B1 (en) * 1988-04-27 1997-01-08 Dainippon Ink And Chemicals, Inc. Apparatus for manufacturing optical information recording medium
US4969812A (en) * 1989-05-30 1990-11-13 Brown Gaylord W Fluid pressure operated apparatus for mounting a differential pressure mold on a platen
JP3230833B2 (ja) * 1992-03-27 2001-11-19 日立テクノエンジニアリング株式会社 ホットプレス
JPH11314231A (ja) * 1998-03-06 1999-11-16 Toshiba Corp 光学部品製造方法及びその装置
DE19819761C2 (de) * 1998-05-04 2000-05-31 Jenoptik Jena Gmbh Einrichtung zur Trennung eines geformten Substrates von einem Prägewerkzeug
DE19925175C1 (de) * 1999-05-27 2000-05-25 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Übertragung von Mikrostrukturen
JP3558936B2 (ja) * 1999-11-10 2004-08-25 日本電信電話株式会社 薄膜形成装置
US6364648B1 (en) * 1999-12-21 2002-04-02 Johnson & Johnson Vision Care, Inc. Four axis casting fixture
US6808443B2 (en) * 2000-07-01 2004-10-26 Lam Research Corporation Projected gimbal point drive
JP2002251802A (ja) * 2001-02-23 2002-09-06 Sony Corp ディスク状記録媒体の製造方法及び金型装置
JP4395704B2 (ja) * 2002-05-17 2010-01-13 コニカミノルタホールディングス株式会社 成形装置
JP3472963B1 (ja) * 2002-05-30 2003-12-02 ミカドテクノス株式会社 高温用真空プレス装置
JP2004034300A (ja) 2002-06-28 2004-02-05 Elionix Kk 微小型押成形装置
MY144124A (en) * 2002-07-11 2011-08-15 Molecular Imprints Inc Step and repeat imprint lithography systems
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
JP3783054B2 (ja) * 2002-10-24 2006-06-07 独立行政法人産業技術総合研究所 アクティブダブルジョイント式加圧機構
JP4220282B2 (ja) 2003-03-20 2009-02-04 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
JP4340086B2 (ja) * 2003-03-20 2009-10-07 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
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JP4313109B2 (ja) * 2003-08-01 2009-08-12 明昌機工株式会社 高精度プレス機
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
US7140861B2 (en) * 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US7059198B2 (en) * 2004-08-17 2006-06-13 Amitkumar N. Dharia Apparatus to determine ability of plastic material to be shaped by thermoforming process
JP4500183B2 (ja) 2005-02-25 2010-07-14 東芝機械株式会社 転写装置
JP4700996B2 (ja) * 2005-04-19 2011-06-15 東芝機械株式会社 転写装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030070854A (ko) * 2002-02-26 2003-09-02 캐논 가부시끼가이샤 스테이지 위치결정장치 및 그 제어방법, 노광장치, 반도체디바이스의 제조방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
공개특허공보 특2003-0070854호

Also Published As

Publication number Publication date
US7448862B2 (en) 2008-11-11
KR20060121743A (ko) 2006-11-29
TW200711852A (en) 2007-04-01
JP2006326992A (ja) 2006-12-07
DE102006024390B4 (de) 2016-12-29
JP4701008B2 (ja) 2011-06-15
US20060269645A1 (en) 2006-11-30
TWI307314B (en) 2009-03-11
DE102006024390A1 (de) 2006-11-30

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