JP4688874B2 - フォトレジスト現像液、および該現像液を用いた基板の製造方法 - Google Patents

フォトレジスト現像液、および該現像液を用いた基板の製造方法 Download PDF

Info

Publication number
JP4688874B2
JP4688874B2 JP2007521294A JP2007521294A JP4688874B2 JP 4688874 B2 JP4688874 B2 JP 4688874B2 JP 2007521294 A JP2007521294 A JP 2007521294A JP 2007521294 A JP2007521294 A JP 2007521294A JP 4688874 B2 JP4688874 B2 JP 4688874B2
Authority
JP
Japan
Prior art keywords
photoresist
developer
carbon atoms
mass
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007521294A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006134902A1 (ja
Inventor
俊吉 尾前
誠司 東野
俊明 大谷
康隆 名塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Priority to JP2007521294A priority Critical patent/JP4688874B2/ja
Publication of JPWO2006134902A1 publication Critical patent/JPWO2006134902A1/ja
Application granted granted Critical
Publication of JP4688874B2 publication Critical patent/JP4688874B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2007521294A 2005-06-13 2006-06-13 フォトレジスト現像液、および該現像液を用いた基板の製造方法 Expired - Fee Related JP4688874B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007521294A JP4688874B2 (ja) 2005-06-13 2006-06-13 フォトレジスト現像液、および該現像液を用いた基板の製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005172952 2005-06-13
JP2005172952 2005-06-13
JP2005189438 2005-06-29
JP2005189438 2005-06-29
JP2007521294A JP4688874B2 (ja) 2005-06-13 2006-06-13 フォトレジスト現像液、および該現像液を用いた基板の製造方法
PCT/JP2006/311814 WO2006134902A1 (ja) 2005-06-13 2006-06-13 フォトレジスト現像液、および該現像液を用いた基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2006134902A1 JPWO2006134902A1 (ja) 2009-01-08
JP4688874B2 true JP4688874B2 (ja) 2011-05-25

Family

ID=37532260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007521294A Expired - Fee Related JP4688874B2 (ja) 2005-06-13 2006-06-13 フォトレジスト現像液、および該現像液を用いた基板の製造方法

Country Status (7)

Country Link
US (1) US8808976B2 (enExample)
JP (1) JP4688874B2 (enExample)
KR (1) KR100993516B1 (enExample)
CN (1) CN101213493B (enExample)
SG (1) SG138212A1 (enExample)
TW (1) TWI391793B (enExample)
WO (1) WO2006134902A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5053592B2 (ja) * 2006-08-10 2012-10-17 関東化学株式会社 ポジ型レジスト処理液組成物及び現像液
CN101657761B (zh) * 2007-05-16 2012-07-04 株式会社德山 光刻胶显影液
JP4853537B2 (ja) * 2009-03-13 2012-01-11 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP5099054B2 (ja) * 2009-03-13 2012-12-12 東京エレクトロン株式会社 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体
SG11201500235XA (en) * 2012-07-16 2015-02-27 Basf Se Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices
KR102378341B1 (ko) * 2015-06-11 2022-03-24 주식회사 이엔에프테크놀로지 포토레지스트 현상액
US9612536B2 (en) * 2015-08-31 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Developer for lithography
US20250044686A1 (en) * 2023-08-04 2025-02-06 Samsung Sdi Co., Ltd. Method of forming patterns

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003131396A (ja) * 2001-10-25 2003-05-09 Mitsubishi Chemicals Corp 感光性画像形成材の画像形成方法
JP2004354402A (ja) * 2003-03-31 2004-12-16 Fuji Photo Film Co Ltd 感熱性平版印刷版用現像液及び平版印刷版の製版方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628023A (en) * 1981-04-10 1986-12-09 Shipley Company Inc. Metal ion free photoresist developer composition with lower alkyl quaternary ammonium hydrozide as alkalai agent and a quaternary ammonium compound as surfactant
JP2670711B2 (ja) * 1990-05-29 1997-10-29 富士写真フイルム株式会社 ネガ型感光性樹脂組成物用現像液
JP2589408B2 (ja) 1990-11-30 1997-03-12 東京応化工業株式会社 レジスト用現像液組成物
JP3225599B2 (ja) 1992-06-03 2001-11-05 ジェイエスアール株式会社 ネガ型フォトレジスト膜の現像方法
JPH063549A (ja) 1992-06-22 1994-01-14 Sumitomo Electric Ind Ltd 光導波路及び光ファイバの結合方法
JPH07120935A (ja) 1993-10-25 1995-05-12 Japan Synthetic Rubber Co Ltd 感放射線性組成物用アルカリ性現像液
US6455234B1 (en) 1999-05-04 2002-09-24 Air Products And Chemicals, Inc. Acetylenic diol ethylene oxide/propylene oxide adducts and their use in photoresist developers
JP2002169299A (ja) * 2000-09-21 2002-06-14 Tokuyama Corp フォトレジスト現像液
JP2003167329A (ja) * 2001-09-20 2003-06-13 Mitsubishi Chemicals Corp 平版印刷版の作製方法
JP2003107742A (ja) * 2001-09-27 2003-04-09 Fuji Photo Film Co Ltd 印刷版の製版方法及びそれに用いる現像液
JP2004133433A (ja) * 2002-09-20 2004-04-30 Fuji Photo Film Co Ltd 平版印刷版の製版方法
JP4440600B2 (ja) 2003-10-31 2010-03-24 Azエレクトロニックマテリアルズ株式会社 厚膜および超厚膜対応化学増幅型感光性樹脂組成物
JP2006154569A (ja) * 2004-11-30 2006-06-15 Tokyo Ohka Kogyo Co Ltd レジストパターンおよび導体パターンの製造方法
CN1828429A (zh) * 2005-02-28 2006-09-06 明德国际仓储贸易(上海)有限公司 显影液组成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003131396A (ja) * 2001-10-25 2003-05-09 Mitsubishi Chemicals Corp 感光性画像形成材の画像形成方法
JP2004354402A (ja) * 2003-03-31 2004-12-16 Fuji Photo Film Co Ltd 感熱性平版印刷版用現像液及び平版印刷版の製版方法

Also Published As

Publication number Publication date
JPWO2006134902A1 (ja) 2009-01-08
TWI391793B (zh) 2013-04-01
KR20080016843A (ko) 2008-02-22
US8808976B2 (en) 2014-08-19
WO2006134902A1 (ja) 2006-12-21
TW200715072A (en) 2007-04-16
KR100993516B1 (ko) 2010-11-10
US20090130606A1 (en) 2009-05-21
SG138212A1 (enExample) 2008-01-28
CN101213493A (zh) 2008-07-02
CN101213493B (zh) 2011-08-24

Similar Documents

Publication Publication Date Title
JP3410403B2 (ja) ホトレジスト用剥離液およびこれを用いたホトレジスト剥離方法
EP1043629B1 (en) Photoresist stripping composition and process for stripping photoresist
KR101084454B1 (ko) 포토레지스트 현상액
US20050176259A1 (en) Method for removing photoresist
KR100429920B1 (ko) 포토레지스트용 박리액 및 이것을 사용한 포토레지스트 박리방법
JP7291704B2 (ja) 洗浄方法
KR100785383B1 (ko) 포토레지스트 현상액
US20070272282A1 (en) Composition for Removing Photoresist and Method for Removing Photoresist
KR20110007828A (ko) 구리 또는 구리합금 배선용 박리액 조성물
KR100993516B1 (ko) 포토레지스트 현상액, 및 그 현상액을 사용한 기판의 제조방법
CN115280244B (zh) 基板的清洗方法
JP3868686B2 (ja) ディフェクトの発生を抑えたホトレジストパターンの形成方法およびディフェクト低減用現像液
JP7577906B2 (ja) フォトレジスト除去用ストリッパー組成物およびこれを用いたフォトレジストの剥離方法
JP6824719B2 (ja) ネガ型樹脂マスク剥離用洗浄剤組成物
US7037852B2 (en) Composition for stripping photoresist and method of preparing the same
JP2007200944A (ja) 基板洗浄液
JP4165209B2 (ja) レジスト剥離剤
TW201425279A (zh) 用於製造積體電路裝置、光學裝置、微機械及機械精密裝置之組成物
JP2019112498A (ja) 樹脂マスク剥離洗浄方法
KR20100125270A (ko) 마이크로전자 기재 세정용 조성물
EP0364895B1 (en) Positive type photoresist developer
KR20230109148A (ko) 수지 마스크 박리용 세정제 조성물
JP2026500162A (ja) 電子機器製造水溶液、レジストパターンの製造方法およびデバイスの製造方法
KR20250137630A (ko) 전자 기기 제조 수용액, 레지스트 패턴의 제조 방법 및 디바이스의 제조 방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081111

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20101101

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110118

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110215

R150 Certificate of patent or registration of utility model

Ref document number: 4688874

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140225

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees