JP4636496B2 - 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク - Google Patents

導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク Download PDF

Info

Publication number
JP4636496B2
JP4636496B2 JP2004513389A JP2004513389A JP4636496B2 JP 4636496 B2 JP4636496 B2 JP 4636496B2 JP 2004513389 A JP2004513389 A JP 2004513389A JP 2004513389 A JP2004513389 A JP 2004513389A JP 4636496 B2 JP4636496 B2 JP 4636496B2
Authority
JP
Japan
Prior art keywords
water
emulsion
transparent
metal
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004513389A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005530005A (ja
JP2005530005A5 (enExample
Inventor
ガーバー，アーケディ
ラ ヴェガ，フェルナンド デ
マッツナー，エイナット
Original Assignee
シーマ ナノテック イスラエル リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シーマ ナノテック イスラエル リミテッド filed Critical シーマ ナノテック イスラエル リミテッド
Publication of JP2005530005A publication Critical patent/JP2005530005A/ja
Publication of JP2005530005A5 publication Critical patent/JP2005530005A5/ja
Application granted granted Critical
Publication of JP4636496B2 publication Critical patent/JP4636496B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/38—Paints containing free metal not provided for above in groups C09D5/00 - C09D5/36
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/12—Braided wires or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Powder Metallurgy (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP2004513389A 2002-06-13 2003-06-12 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク Expired - Fee Related JP4636496B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38791902P 2002-06-13 2002-06-13
PCT/IL2003/000502 WO2003106573A1 (en) 2002-06-13 2003-06-12 A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby

Publications (3)

Publication Number Publication Date
JP2005530005A JP2005530005A (ja) 2005-10-06
JP2005530005A5 JP2005530005A5 (enExample) 2006-08-03
JP4636496B2 true JP4636496B2 (ja) 2011-02-23

Family

ID=29736385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004513389A Expired - Fee Related JP4636496B2 (ja) 2002-06-13 2003-06-12 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク

Country Status (9)

Country Link
EP (2) EP2154212A1 (enExample)
JP (1) JP4636496B2 (enExample)
KR (2) KR101321255B1 (enExample)
CN (1) CN1322075C (enExample)
AT (1) ATE450581T1 (enExample)
AU (1) AU2003241128A1 (enExample)
DE (1) DE60330344D1 (enExample)
ES (1) ES2336779T3 (enExample)
WO (1) WO2003106573A1 (enExample)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2280865C (en) 1997-02-24 2008-08-12 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0300529D0 (en) * 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
KR20070085253A (ko) * 2004-09-14 2007-08-27 시마 나노 테크 이스라엘 리미티드 잉크젯 인쇄가능한 조성물
CN100593219C (zh) * 2004-10-08 2010-03-03 东丽株式会社 导电性薄膜
DE102004051019A1 (de) * 2004-10-20 2006-04-27 Mhm Holding Gmbh Trocknungsverfahren und -vorrichtung und dazu gehörige thermisch trocknende oder vernetzende Druckfarbe oder Lack
US20060130700A1 (en) * 2004-12-16 2006-06-22 Reinartz Nicole M Silver-containing inkjet ink
JP5007020B2 (ja) * 2004-12-20 2012-08-22 株式会社アルバック 金属薄膜の形成方法及び金属薄膜
JP4799881B2 (ja) * 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
WO2006076611A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
ATE434024T1 (de) * 2005-02-28 2009-07-15 Samsung Sdi Germany Gmbh Metallische tinte und substrat für eine anzeige und deren fertigungsmethode
JP5009907B2 (ja) * 2005-06-10 2012-08-29 シーマ ナノ テック イスラエル リミティド 向上透明導電性被膜及びそれらを作製する方法
US7935540B2 (en) 2005-07-14 2011-05-03 3M Innovative Properties Company Water-soluble polymeric substrate having metallic nanoparticle coating
EP1947701A3 (en) 2005-08-12 2009-05-06 Cambrios Technologies Corporation Nanowires-based transparent conductors
EP1965438A3 (en) 2005-08-12 2009-05-13 Cambrios Technologies Corporation Nanowires-based transparent conductors
JP2007146117A (ja) 2005-11-04 2007-06-14 Mitsui Mining & Smelting Co Ltd ニッケルインク及びそのニッケルインクで形成した導体膜
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
JP4918790B2 (ja) * 2006-02-28 2012-04-18 旭硝子株式会社 透明導電膜の製造方法、透明導電膜および塗布液
JP5065613B2 (ja) * 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
KR100860446B1 (ko) * 2006-04-12 2008-09-25 주식회사 엘지화학 금속 나노 입자의 분산 보조제 및 이를 포함하는 금속 나노잉크
JP4967437B2 (ja) * 2006-04-27 2012-07-04 旭硝子株式会社 透明導電膜の製造方法および透明導電膜
WO2007136382A1 (en) * 2006-05-24 2007-11-29 E.I. Du Pont De Nemours And Company Conductive inkjet ink formulation
RU2297471C1 (ru) * 2006-05-30 2007-04-20 Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт стали и сплавов" (технологический университет) Способ получения проводящих нанокомпозитных покрытий, содержащих металл в кремний-углеродной матрице
JP2008041445A (ja) * 2006-08-07 2008-02-21 Asahi Glass Co Ltd 透明導電膜の製造方法および透明導電膜
GB2454132B (en) * 2006-08-24 2011-11-23 Ngimat Co Optical coating
KR100833869B1 (ko) * 2006-10-10 2008-06-02 삼성전기주식회사 내마이그레이션 잉크 조성물 및 이를 이용하여 제조된전도성 배선
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
CN102324462B (zh) 2006-10-12 2015-07-01 凯博瑞奥斯技术公司 基于纳米线的透明导体及其应用
US7568251B2 (en) 2006-12-28 2009-08-04 Kimberly-Clark Worldwide, Inc. Process for dyeing a textile web
KR101375047B1 (ko) * 2006-12-29 2014-03-26 엘지디스플레이 주식회사 표시장치 제조방법
CA2680201A1 (en) * 2007-03-01 2008-09-25 Pchem Associates, Inc. Shielding based on metallic nanoparticle compositions and devices and methods thereof
US20090321364A1 (en) 2007-04-20 2009-12-31 Cambrios Technologies Corporation Systems and methods for filtering nanowires
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
CN101945975A (zh) * 2007-12-20 2011-01-12 西玛耐诺技术以色列有限公司 微结构化的材料及其制备方法
KR101234881B1 (ko) * 2007-12-20 2013-02-20 시마 나노 테크 이스라엘 리미티드 나노입자로 형성된 투명한 전극을 갖는 광전지 소자
US8383011B2 (en) 2008-01-30 2013-02-26 Basf Se Conductive inks with metallo-organic modifiers
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
US7736546B2 (en) 2008-01-30 2010-06-15 Basf Se Glass frits
TWI401205B (zh) * 2008-01-31 2013-07-11 Ind Tech Res Inst 利用光熱效應製作應用基板的方法
JP2011515510A (ja) * 2008-02-26 2011-05-19 カンブリオス テクノロジーズ コーポレイション 導電性特徴をスクリーン印刷するための方法および組成物
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
JP2009277466A (ja) * 2008-05-14 2009-11-26 Konica Minolta Holdings Inc 透明導電性フィルム及びその製造方法
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US8846182B2 (en) 2008-07-04 2014-09-30 Toda Kogyo Corporation Process for producing transparent conductive transfer plate, transparent conductive transfer plate, process for producing transparent conductive substrate using the transparent conductive transfer plate, transparent conductive substrate, and molded product using the transparent conductive substrate
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
JP2010159350A (ja) * 2009-01-08 2010-07-22 Sumitomo Rubber Ind Ltd インキ組成物およびそれを用いた凹版オフセット印刷法
JP5545796B2 (ja) * 2009-02-09 2014-07-09 戸田工業株式会社 透明導電性基板、色素増感型太陽電池用透明導電性基板及び透明導電性基板の製造方法
JP5740389B2 (ja) 2009-03-27 2015-06-24 アプライド・ナノテック・ホールディングス・インコーポレーテッド 光焼結及び／またはレーザー焼結を強化するためのバッファ層
JP2010251475A (ja) * 2009-04-14 2010-11-04 Toda Kogyo Corp 透明樹脂箔及びその製造方法、並びに該透明樹脂箔を用いた電磁波シールド材
WO2010119838A1 (ja) * 2009-04-14 2010-10-21 戸田工業株式会社 透明樹脂箔及びその製造方法、並びに該透明樹脂箔を用いた電磁波シールド材
JP5606687B2 (ja) * 2009-04-14 2014-10-15 戸田工業株式会社 透明樹脂箔の製造方法、並びに該透明樹脂箔を用いた電磁波シールド材の製造方法
BRPI1010855A2 (pt) * 2009-06-12 2016-04-05 Lord Corp método para proteção de um substrato contra interferência eletromagnética
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
TWI508922B (zh) * 2009-12-07 2015-11-21 Univ Duke 生長銅奈米線之組成物及方法
JP5727766B2 (ja) * 2009-12-10 2015-06-03 理想科学工業株式会社 導電性エマルジョンインク及びそれを用いた導電性薄膜の形成方法
WO2011087913A1 (en) * 2010-01-14 2011-07-21 The Regents Of The University Of California A universal solution for growing thin films of electrically conductive nanostructures
CN102834472B (zh) 2010-02-05 2015-04-22 凯博瑞奥斯技术公司 光敏墨组合物和透明导体以及它们的使用方法
JP2013521615A (ja) * 2010-03-05 2013-06-10 ケアストリーム ヘルス インク 透明導電性膜、物品、および方法
KR101487342B1 (ko) * 2010-07-30 2015-01-30 주식회사 잉크테크 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막
JP2013544917A (ja) * 2010-10-22 2013-12-19 カンブリオス テクノロジーズ コーポレイション ナノワイヤーインク組成物およびその印刷
KR101260956B1 (ko) * 2011-02-25 2013-05-06 한화케미칼 주식회사 오프셋 또는 리버스­오프셋 인쇄용 전도성 잉크 조성물
WO2012118582A1 (en) * 2011-02-28 2012-09-07 Nthdegree Technologies Worldwide Inc. Metallic nanofiber ink, substantially transparent conductor, and fabrication method
CN102917530B (zh) * 2011-08-01 2016-01-06 富士康(昆山)电脑接插件有限公司 具有导电线路的玻璃板及其制造方法
TW201325335A (zh) * 2011-10-29 2013-06-16 Cima Nanotech Israel Ltd 經圖案化基材上之導電網路
TWI584485B (zh) * 2011-10-29 2017-05-21 西瑪奈米技術以色列有限公司 於基材上對齊的網路
KR20140109965A (ko) * 2011-12-21 2014-09-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화
WO2013096664A1 (en) * 2011-12-23 2013-06-27 The Board Of Trustees Of The University Of Illinois Ink composition for making a conductive silver structure
CN103073943B (zh) * 2012-01-19 2014-09-17 中国科学院上海硅酸盐研究所 一种二氧化钒智能温控涂层
TWI648751B (zh) * 2012-02-28 2019-01-21 以色列商客利福薄膜技術有限公司 在彈性基材上之透明導電塗層
CN102723126B (zh) * 2012-05-09 2015-10-21 南昌欧菲光科技有限公司 一种基于随机网格的图形化透明导电薄膜
JP5934576B2 (ja) * 2012-05-18 2016-06-15 三菱製紙株式会社 導電性部材の製造方法
GB2516570A (en) * 2012-05-18 2015-01-28 Unipixel Displays Inc Forming conductive patterns using ink comprising metal nanoparticles and nanowires
TWI623597B (zh) * 2012-08-16 2018-05-11 西瑪奈米技術以色列有限公司 用於製造透明導電塗層之乳液
US10329444B2 (en) * 2012-12-28 2019-06-25 Printed Energy Pty Ltd Nickel inks and oxidation resistant and conductive coatings
KR101270803B1 (ko) * 2013-03-18 2013-06-05 단국대학교 산학협력단 금속 전극의 제조방법
CN103540927B (zh) * 2013-09-29 2015-07-15 山东科技大学 一种银功能涂层原位制备方法
KR102237001B1 (ko) * 2013-12-31 2021-04-07 삼성에스디아이 주식회사 투명전극용 금속 잉크 및 그 제조방법
CN103753939B (zh) * 2014-01-17 2015-11-11 苏州斯贝孚光电科技有限公司 淋涂纳米金属油墨制备薄膜的方法
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
CN103992041A (zh) * 2014-04-30 2014-08-20 天津宝兴威科技有限公司 一种纳米金属网格透明导电玻璃的制造方法
US10227465B2 (en) 2014-08-07 2019-03-12 Sabic Global Technologies B.V. Conductive multilayer sheet for thermal forming applications
US9985344B2 (en) * 2014-12-23 2018-05-29 Te Connectivity Corporation Electronic article and process of producing an electronic article
KR101879055B1 (ko) * 2016-06-29 2018-07-18 한양대학교 에리카산학협력단 나노 구조체 네트워크 및 그 제조 방법
WO2018004092A1 (ko) 2016-06-29 2018-01-04 한양대학교에리카산학협력단 나노 구조체 네트워크 및 그 제조 방법
WO2018045388A1 (en) * 2016-09-05 2018-03-08 NanoSD Inc. See-through plastic chamber insulators
RU2651837C1 (ru) * 2017-03-21 2018-04-24 Олег Андреевич Стрелецкий Способ нанесения антиадгезивного, биосовместимого и бактериостатичного покрытия на основе углерода на металлические, полимерные и текстильные изделия медицинского назначения
CN106954347B (zh) * 2017-04-21 2019-10-01 北京石油化工学院 光打印制备纳米银线电路板的方法
KR102008447B1 (ko) * 2017-06-09 2019-08-07 건국대학교 산학협력단 투명전도성 필름 제조장치 및 제조방법
JP2019065229A (ja) * 2017-10-04 2019-04-25 コニカミノルタ株式会社 混合液の製造方法、混合液を製造するシステム、インク組成物、画像形成方法および画像形成物
EP3692593B1 (en) * 2017-10-05 2023-05-10 Eastman Kodak Company Transparent antenna
CN109801736A (zh) * 2017-11-16 2019-05-24 吴宏伟 透明导电溶液及其制备方法
CN108001062A (zh) * 2017-12-05 2018-05-08 华南理工大学 一种修复大面积高均匀性喷墨打印薄膜表面起伏过大的方法
CN108384064B (zh) * 2018-02-05 2020-11-03 广西大学 一种蔗渣基纳米抗菌保鲜膜及其制备方法
CN109135427A (zh) * 2018-08-24 2019-01-04 天津大学 生物可吸收导电油墨及其制备方法、烧结方法
CN109887638B (zh) * 2019-01-14 2021-02-23 上海大学 纳米银颗粒与镀银碳化硅颗粒混合的多尺度纳米银浆及其制备方法
US20220244644A1 (en) 2019-07-16 2022-08-04 Agfa-Gevaert Nv A Method of Manufacturing a Transparent Conductive Film
JP7305272B2 (ja) * 2019-09-09 2023-07-10 石原ケミカル株式会社 導電膜形成方法
CN111225328B (zh) * 2020-01-22 2021-01-29 头领科技（昆山）有限公司 静电扬声器振膜及静电扬声器
KR102231494B1 (ko) * 2020-10-13 2021-03-23 유시욱 투명 잉크 조성물 및 이를 포함하는 인쇄 기판
CN112768113B (zh) * 2020-12-31 2023-06-27 合肥工业大学 一种响应性纳米复合聚合物导电薄膜的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL106958A (en) 1993-09-09 1996-06-18 Ultrafine Techn Ltd Method of producing high-purity ultra-fine metal powder
JP2955985B2 (ja) * 1994-08-31 1999-10-04 ナノパウダース インダストリーズ（イスラエル）リミテッド 高純度超微粒金属粉を製造する方法
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
JPH09286936A (ja) * 1996-04-22 1997-11-04 Sumitomo Metal Mining Co Ltd 透明導電膜形成用塗布液、これを用いた透明導電膜及びその形成方法
JP3356966B2 (ja) * 1997-07-02 2002-12-16 住友大阪セメント株式会社 透明導電膜とその製造方法および表示装置
JP3266066B2 (ja) * 1997-09-05 2002-03-18 三菱マテリアル株式会社 保存安定性に優れた金属微粒子含有導電膜形成用組成物
US6012658A (en) 1998-09-22 2000-01-11 Nanopowders Industries Ltd Method of producing metal flakes, particularly silver flakes of high purity
JP2001325831A (ja) * 2000-05-12 2001-11-22 Bando Chem Ind Ltd 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜
JP2002088277A (ja) * 2000-09-13 2002-03-27 Fuji Photo Film Co Ltd 水分散系透明導電膜形成用塗料
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
IL161622A0 (en) * 2001-11-01 2004-09-27 Yissum Res Dev Co Ink jet inks containing metal nanoparticles
JP2003288812A (ja) * 2001-12-29 2003-10-10 Samsung Electronics Co Ltd 金属ナノ粒子クラスターインクおよびこれを用いた金属パターン形成方法

Also Published As

Publication number Publication date
ES2336779T3 (es) 2010-04-16
JP2005530005A (ja) 2005-10-06
EP1521811B1 (en) 2009-12-02
DE60330344D1 (de) 2010-01-14
KR20110049923A (ko) 2011-05-12
CN1668712A (zh) 2005-09-14
KR101043307B1 (ko) 2011-06-22
KR20060012542A (ko) 2006-02-08
AU2003241128A1 (en) 2003-12-31
EP1521811A1 (en) 2005-04-13
KR101321255B1 (ko) 2013-10-28
HK1083223A1 (en) 2006-06-30
CN1322075C (zh) 2007-06-20
WO2003106573A1 (en) 2003-12-24
ATE450581T1 (de) 2009-12-15
EP2154212A1 (en) 2010-02-17

Similar Documents

Publication Publication Date Title
JP4636496B2 (ja) 導電性及び透明性を有するナノ被覆物及びナノインクの製造方法、並びにこの製造方法により製造されるナノ粉末被覆物及びインク
US7736693B2 (en) Nano-powder-based coating and ink compositions
US7566360B2 (en) Nano-powder-based coating and ink compositions
US7601406B2 (en) Nano-powder-based coating and ink compositions
CN1671805B (zh) 烧结温度低的导电纳米油墨及其制备方法
JP5009907B2 (ja) 向上透明導電性被膜及びそれらを作製する方法
US8999204B2 (en) Conductive ink composition, method for manufacturing the same, and method for manufacturing conductive thin layer using the same
DE102017203069B4 (de) Tintenzusammensetzung, Verfahren zu deren Herstellung und Druckverfahren
DE102011076749A1 (de) Silbernanopartikelzusammensetzung, umfassend Lösungsmittel mit spezifischen Hansen-Löslichkeitsparametern
KR100905399B1 (ko) 우수한 전도성과 유리 및 세라믹 기판과의 접착력 향상을위한 금속 나노입자와 나노 글래스 프릿을 포함하는 전도성잉크 조성물
JP2005530005A5 (enExample)
JP2005531679A5 (enExample)
KR20130050906A (ko) 저온 소결성 은 나노 입자 조성물 및 상기 조성물을 이용하여 형성된 전자 물품
KR102035115B1 (ko) 도전성 피막 복합체 및 그 제조방법
EP2045028A1 (en) Metal nanoparticles, method for producing the same, aqueous dispersion, method for manufacturing printed wiring or electrode, and printed wiring board or device
TWI694469B (zh) 導電圖型形成用組成物及導電圖型形成方法
EP3456791B1 (en) Molecular organic reactive inks for conductive metal printing using photoinitiators
HK1083223B (en) A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby
HK1083516A (en) Low sintering temperatures conductive nano-inks and a method for producing the same

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060609

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060609

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101102

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101117

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131203

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees