JP4629154B1 - 電子材料用銅合金及びその製造方法 - Google Patents
電子材料用銅合金及びその製造方法 Download PDFInfo
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- JP4629154B1 JP4629154B1 JP2010066397A JP2010066397A JP4629154B1 JP 4629154 B1 JP4629154 B1 JP 4629154B1 JP 2010066397 A JP2010066397 A JP 2010066397A JP 2010066397 A JP2010066397 A JP 2010066397A JP 4629154 B1 JP4629154 B1 JP 4629154B1
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- grain size
- copper alloy
- crystal grains
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 53
- 239000012776 electronic material Substances 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 claims abstract description 73
- 239000013078 crystal Substances 0.000 claims abstract description 63
- 239000002344 surface layer Substances 0.000 claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 44
- 239000002245 particle Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910000906 Bronze Inorganic materials 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000010974 bronze Substances 0.000 claims description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 6
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000008119 colloidal silica Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 239000010949 copper Substances 0.000 description 15
- 239000000203 mixture Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 238000005554 pickling Methods 0.000 description 10
- 239000012535 impurity Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010066397A JP4629154B1 (ja) | 2010-03-23 | 2010-03-23 | 電子材料用銅合金及びその製造方法 |
| TW100109511A TWI429763B (zh) | 2010-03-23 | 2011-03-21 | Copper alloy for electronic materials and method for manufacturing the same |
| KR1020127020755A KR101335201B1 (ko) | 2010-03-23 | 2011-03-23 | 전자 재료용 구리 합금 및 그 제조 방법 |
| MX2012010887A MX2012010887A (es) | 2010-03-23 | 2011-03-23 | Aleacion de cobre para material electronico y metodo de manufactura del mismo. |
| CN201180015302.0A CN102803574B (zh) | 2010-03-23 | 2011-03-23 | 电子材料用铜合金及其制备方法 |
| EP11759455.6A EP2551384A4 (en) | 2010-03-23 | 2011-03-23 | Copper alloy for electronic material and method of manufacture for same |
| PCT/JP2011/057026 WO2011118650A1 (ja) | 2010-03-23 | 2011-03-23 | 電子材料用銅合金及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010066397A JP4629154B1 (ja) | 2010-03-23 | 2010-03-23 | 電子材料用銅合金及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4629154B1 true JP4629154B1 (ja) | 2011-02-09 |
| JP2011195927A JP2011195927A (ja) | 2011-10-06 |
Family
ID=43638543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010066397A Active JP4629154B1 (ja) | 2010-03-23 | 2010-03-23 | 電子材料用銅合金及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2551384A4 (ko) |
| JP (1) | JP4629154B1 (ko) |
| KR (1) | KR101335201B1 (ko) |
| CN (1) | CN102803574B (ko) |
| MX (1) | MX2012010887A (ko) |
| TW (1) | TWI429763B (ko) |
| WO (1) | WO2011118650A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103429388A (zh) * | 2011-03-28 | 2013-12-04 | Jx日矿日石金属株式会社 | Co-Si系铜合金板 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5961371B2 (ja) * | 2011-12-06 | 2016-08-02 | Ｊｘ金属株式会社 | Ｎｉ−Ｃｏ−Ｓｉ系銅合金板 |
| JP6141708B2 (ja) * | 2013-07-09 | 2017-06-07 | 三菱伸銅株式会社 | 光沢度に優れためっき付き銅合金板 |
| JP6085536B2 (ja) * | 2013-08-05 | 2017-02-22 | 株式会社Ｓｈカッパープロダクツ | 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール |
| WO2015022916A1 (ja) | 2013-08-14 | 2015-02-19 | 三菱レイヨン株式会社 | ナノインプリント用モールドの製造方法、および反射防止物品 |
| JP6320759B2 (ja) * | 2014-01-06 | 2018-05-09 | 三菱伸銅株式会社 | Ｃｕ−Ｆｅ−Ｐ系銅合金板の製造方法 |
| JP6228941B2 (ja) | 2015-01-09 | 2017-11-08 | Ｊｘ金属株式会社 | めっき層を有するチタン銅 |
| KR102503365B1 (ko) * | 2015-09-01 | 2023-02-24 | 후루카와 덴키 고교 가부시키가이샤 | 내열성이 우수한 도금재 및 그 제조방법 |
| JP6271626B2 (ja) * | 2016-03-31 | 2018-01-31 | Ｊｘ金属株式会社 | めっき層を有するチタン銅箔 |
| JP6662685B2 (ja) * | 2016-03-31 | 2020-03-11 | Ｊｘ金属株式会社 | めっき層を有するチタン銅箔 |
| JP2016211078A (ja) * | 2016-07-26 | 2016-12-15 | Ｊｘ金属株式会社 | Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法 |
| JP6793005B2 (ja) * | 2016-10-27 | 2020-12-02 | Ｄｏｗａメタルテック株式会社 | 銅合金板材およびその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356726A (ja) * | 2001-02-20 | 2002-12-13 | Nippon Mining & Metals Co Ltd | 高強度チタン銅合金及びその製造法並びにそれを用いた端子・コネクター |
| JP2007039804A (ja) * | 2005-07-05 | 2007-02-15 | Furukawa Electric Co Ltd:The | 電子機器用銅合金及びその製造方法 |
| JP2008223106A (ja) * | 2007-03-14 | 2008-09-25 | Furukawa Electric Co Ltd:The | ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5516415A (en) * | 1993-11-16 | 1996-05-14 | Ontario Hydro | Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube |
| JP3550482B2 (ja) | 1997-07-09 | 2004-08-04 | 三島光産株式会社 | 連続鋳造に用いる鋳型片のめっき方法 |
| FR2781922B1 (fr) * | 1998-07-31 | 2001-11-23 | Clariant France Sa | Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre |
| JP2006002233A (ja) * | 2004-06-18 | 2006-01-05 | Furukawa Electric Co Ltd:The | 成形加工性に優れた被めっき物 |
| US7946022B2 (en) * | 2005-07-05 | 2011-05-24 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic machinery and tools and method of producing the same |
| CN100560797C (zh) * | 2007-12-28 | 2009-11-18 | 天津大学 | 一种在紫铜表面制备纳米厚度的薄膜表面的方法 |
| WO2009099198A1 (ja) * | 2008-02-08 | 2009-08-13 | The Furukawa Electric Co., Ltd. | 電気電子部品用銅合金材料 |
| CN101509850A (zh) * | 2009-03-20 | 2009-08-19 | 北京科技大学 | 一种制备电铸铜金相样品及显示组织的方法 |
-
2010
- 2010-03-23 JP JP2010066397A patent/JP4629154B1/ja active Active
-
2011
- 2011-03-21 TW TW100109511A patent/TWI429763B/zh active
- 2011-03-23 EP EP11759455.6A patent/EP2551384A4/en not_active Withdrawn
- 2011-03-23 MX MX2012010887A patent/MX2012010887A/es active IP Right Grant
- 2011-03-23 CN CN201180015302.0A patent/CN102803574B/zh active Active
- 2011-03-23 KR KR1020127020755A patent/KR101335201B1/ko active IP Right Grant
- 2011-03-23 WO PCT/JP2011/057026 patent/WO2011118650A1/ja active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356726A (ja) * | 2001-02-20 | 2002-12-13 | Nippon Mining & Metals Co Ltd | 高強度チタン銅合金及びその製造法並びにそれを用いた端子・コネクター |
| JP2007039804A (ja) * | 2005-07-05 | 2007-02-15 | Furukawa Electric Co Ltd:The | 電子機器用銅合金及びその製造方法 |
| JP2008223106A (ja) * | 2007-03-14 | 2008-09-25 | Furukawa Electric Co Ltd:The | ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103429388A (zh) * | 2011-03-28 | 2013-12-04 | Jx日矿日石金属株式会社 | Co-Si系铜合金板 |
| EP2679341A1 (en) * | 2011-03-28 | 2014-01-01 | JX Nippon Mining & Metals Corporation | Co-Si-BASED COPPER ALLOY SHEET |
| EP2679341A4 (en) * | 2011-03-28 | 2014-12-24 | Jx Nippon Mining & Metals Corp | CO-SIZE COPPER ALLOY PLATE |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101335201B1 (ko) | 2013-11-29 |
| TWI429763B (zh) | 2014-03-11 |
| EP2551384A4 (en) | 2017-07-19 |
| JP2011195927A (ja) | 2011-10-06 |
| MX2012010887A (es) | 2012-12-17 |
| WO2011118650A1 (ja) | 2011-09-29 |
| TW201139703A (en) | 2011-11-16 |
| EP2551384A1 (en) | 2013-01-30 |
| CN102803574A (zh) | 2012-11-28 |
| KR20120114341A (ko) | 2012-10-16 |
| CN102803574B (zh) | 2015-09-02 |
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