CN102803574B - 电子材料用铜合金及其制备方法 - Google Patents

电子材料用铜合金及其制备方法 Download PDF

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Publication number
CN102803574B
CN102803574B CN201180015302.0A CN201180015302A CN102803574B CN 102803574 B CN102803574 B CN 102803574B CN 201180015302 A CN201180015302 A CN 201180015302A CN 102803574 B CN102803574 B CN 102803574B
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China
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particle diameter
crystal grain
copper alloy
depth
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Chinese (zh)
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CN102803574A (zh
Inventor
桑垣宽
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201180015302.0A 2010-03-23 2011-03-23 电子材料用铜合金及其制备方法 Active CN102803574B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010066397A JP4629154B1 (ja) 2010-03-23 2010-03-23 電子材料用銅合金及びその製造方法
JP2010-066397 2010-03-23
PCT/JP2011/057026 WO2011118650A1 (ja) 2010-03-23 2011-03-23 電子材料用銅合金及びその製造方法

Publications (2)

Publication Number Publication Date
CN102803574A CN102803574A (zh) 2012-11-28
CN102803574B true CN102803574B (zh) 2015-09-02

Family

ID=43638543

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180015302.0A Active CN102803574B (zh) 2010-03-23 2011-03-23 电子材料用铜合金及其制备方法

Country Status (7)

Country Link
EP (1) EP2551384A4 (ko)
JP (1) JP4629154B1 (ko)
KR (1) KR101335201B1 (ko)
CN (1) CN102803574B (ko)
MX (1) MX2012010887A (ko)
TW (1) TWI429763B (ko)
WO (1) WO2011118650A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4831552B1 (ja) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP5961371B2 (ja) * 2011-12-06 2016-08-02 Ｊｘ金属株式会社 Ｎｉ−Ｃｏ−Ｓｉ系銅合金板
JP6141708B2 (ja) * 2013-07-09 2017-06-07 三菱伸銅株式会社 光沢度に優れためっき付き銅合金板
JP6085536B2 (ja) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール
CN105451967B (zh) * 2013-08-14 2017-11-10 三菱化学株式会社 纳米压印用模具的制造方法以及防反射物品
JP6320759B2 (ja) * 2014-01-06 2018-05-09 三菱伸銅株式会社 Ｃｕ−Ｆｅ−Ｐ系銅合金板の製造方法
JP6228941B2 (ja) * 2015-01-09 2017-11-08 Ｊｘ金属株式会社 めっき層を有するチタン銅
CN107849721B (zh) * 2015-09-01 2020-11-17 古河电气工业株式会社 耐热性优异的镀覆材料及其制造方法
JP6271626B2 (ja) * 2016-03-31 2018-01-31 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
JP6662685B2 (ja) * 2016-03-31 2020-03-11 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
JP2016211078A (ja) * 2016-07-26 2016-12-15 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP6793005B2 (ja) * 2016-10-27 2020-12-02 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1244033A (zh) * 1998-07-31 2000-02-09 科莱恩(法国)公司 铜基材料表层的机械化学抛光方法
CN101213314A (zh) * 2005-07-05 2008-07-02 古河电气工业株式会社 电子设备用铜合金及其制造方法
CN101215698A (zh) * 2007-12-28 2008-07-09 天津大学 一种在紫铜表面制备纳米厚度的薄膜表面的方法
JP2008223106A (ja) * 2007-03-14 2008-09-25 Furukawa Electric Co Ltd:The ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法
CN101509850A (zh) * 2009-03-20 2009-08-19 北京科技大学 一种制备电铸铜金相样品及显示组织的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516415A (en) * 1993-11-16 1996-05-14 Ontario Hydro Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
JP3550482B2 (ja) 1997-07-09 2004-08-04 三島光産株式会社 連続鋳造に用いる鋳型片のめっき方法
JP4001491B2 (ja) * 2001-02-20 2007-10-31 日鉱金属株式会社 高強度チタン銅合金及びその製造法並びにそれを用いた端子・コネクター
JP2006002233A (ja) 2004-06-18 2006-01-05 Furukawa Electric Co Ltd:The 成形加工性に優れた被めっき物
JP2007039804A (ja) * 2005-07-05 2007-02-15 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
WO2009099198A1 (ja) * 2008-02-08 2009-08-13 The Furukawa Electric Co., Ltd. 電気電子部品用銅合金材料

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1244033A (zh) * 1998-07-31 2000-02-09 科莱恩(法国)公司 铜基材料表层的机械化学抛光方法
CN101213314A (zh) * 2005-07-05 2008-07-02 古河电气工业株式会社 电子设备用铜合金及其制造方法
JP2008223106A (ja) * 2007-03-14 2008-09-25 Furukawa Electric Co Ltd:The ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法
CN101215698A (zh) * 2007-12-28 2008-07-09 天津大学 一种在紫铜表面制备纳米厚度的薄膜表面的方法
CN101509850A (zh) * 2009-03-20 2009-08-19 北京科技大学 一种制备电铸铜金相样品及显示组织的方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
吴复宇.10.4研磨材料的发展.《汽车涂装技术》.2006,(第1版),第227页. *

Also Published As

Publication number Publication date
EP2551384A4 (en) 2017-07-19
WO2011118650A1 (ja) 2011-09-29
TW201139703A (en) 2011-11-16
KR101335201B1 (ko) 2013-11-29
TWI429763B (zh) 2014-03-11
EP2551384A1 (en) 2013-01-30
CN102803574A (zh) 2012-11-28
JP2011195927A (ja) 2011-10-06
JP4629154B1 (ja) 2011-02-09
KR20120114341A (ko) 2012-10-16
MX2012010887A (es) 2012-12-17

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CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan, Japan

Patentee after: JX NIPPON MINING & METALS CORPORATION

Address before: Tokyo, Japan, Japan

Patentee before: JX Nippon Mining & Metals Co., Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan, Japan

Patentee after: JX NIPPON MINING & METALS CORPORATION

Address before: Tokyo, Japan, Japan

Patentee before: JX NIPPON MINING & METALS CORPORATION

CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan

Patentee after: JKS Metal Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: JKS Metal Co.,Ltd.