EP2551384A4 - Copper alloy for electronic material and method of manufacture for same - Google Patents
Copper alloy for electronic material and method of manufacture for same Download PDFInfo
- Publication number
- EP2551384A4 EP2551384A4 EP11759455.6A EP11759455A EP2551384A4 EP 2551384 A4 EP2551384 A4 EP 2551384A4 EP 11759455 A EP11759455 A EP 11759455A EP 2551384 A4 EP2551384 A4 EP 2551384A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- manufacture
- same
- copper alloy
- electronic material
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010066397A JP4629154B1 (en) | 2010-03-23 | 2010-03-23 | Copper alloy for electronic materials and manufacturing method thereof |
PCT/JP2011/057026 WO2011118650A1 (en) | 2010-03-23 | 2011-03-23 | Copper alloy for electronic material and method of manufacture for same |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2551384A1 EP2551384A1 (en) | 2013-01-30 |
EP2551384A4 true EP2551384A4 (en) | 2017-07-19 |
Family
ID=43638543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11759455.6A Withdrawn EP2551384A4 (en) | 2010-03-23 | 2011-03-23 | Copper alloy for electronic material and method of manufacture for same |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2551384A4 (en) |
JP (1) | JP4629154B1 (en) |
KR (1) | KR101335201B1 (en) |
CN (1) | CN102803574B (en) |
MX (1) | MX2012010887A (en) |
TW (1) | TWI429763B (en) |
WO (1) | WO2011118650A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4831552B1 (en) * | 2011-03-28 | 2011-12-07 | Jx日鉱日石金属株式会社 | Co-Si copper alloy sheet |
JP5961371B2 (en) * | 2011-12-06 | 2016-08-02 | Jx金属株式会社 | Ni-Co-Si copper alloy sheet |
JP6141708B2 (en) * | 2013-07-09 | 2017-06-07 | 三菱伸銅株式会社 | Plated copper alloy plate with excellent gloss |
JP6085536B2 (en) * | 2013-08-05 | 2017-02-22 | 株式会社Shカッパープロダクツ | Copper strip, plated copper strip, lead frame and LED module |
KR101879827B1 (en) * | 2013-08-14 | 2018-07-18 | 미쯔비시 케미컬 주식회사 | Method for producing mold for nanoimprinting and anti-reflective article |
JP6320759B2 (en) * | 2014-01-06 | 2018-05-09 | 三菱伸銅株式会社 | Method for producing Cu-Fe-P copper alloy sheet |
JP6228941B2 (en) | 2015-01-09 | 2017-11-08 | Jx金属株式会社 | Titanium copper with plating layer |
KR102503365B1 (en) * | 2015-09-01 | 2023-02-24 | 후루카와 덴키 고교 가부시키가이샤 | Plating material with excellent heat resistance and its manufacturing method |
JP6662685B2 (en) * | 2016-03-31 | 2020-03-11 | Jx金属株式会社 | Titanium copper foil with plating layer |
JP6271626B2 (en) * | 2016-03-31 | 2018-01-31 | Jx金属株式会社 | Titanium copper foil with plating layer |
JP2016211078A (en) * | 2016-07-26 | 2016-12-15 | Jx金属株式会社 | Cu-Ni-Si-BASED ALLOY AND MANUFACTURING METHOD THEREFOR |
JP6793005B2 (en) * | 2016-10-27 | 2020-12-02 | Dowaメタルテック株式会社 | Copper alloy plate material and its manufacturing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995014121A1 (en) * | 1993-11-16 | 1995-05-26 | Ontario Hydro | Metal tube having a section with an internal electroplated structural layer |
JP2006002233A (en) * | 2004-06-18 | 2006-01-05 | Furukawa Electric Co Ltd:The | Object to be plated having excellent forming workability |
US20070015001A1 (en) * | 2005-07-05 | 2007-01-18 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic machinery and tools and method of producing the same |
CN101215698A (en) * | 2007-12-28 | 2008-07-09 | 天津大学 | Method for preparing film surface of nanometer-stage thickness on red copper surface |
WO2009099198A1 (en) * | 2008-02-08 | 2009-08-13 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric and electronic components |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3550482B2 (en) | 1997-07-09 | 2004-08-04 | 三島光産株式会社 | Plating method of mold pieces used for continuous casting |
FR2781922B1 (en) * | 1998-07-31 | 2001-11-23 | Clariant France Sa | METHOD FOR THE MECHANICAL CHEMICAL POLISHING OF A LAYER OF A COPPER-BASED MATERIAL |
JP4001491B2 (en) * | 2001-02-20 | 2007-10-31 | 日鉱金属株式会社 | High-strength titanium-copper alloy, manufacturing method thereof, and terminal / connector using the same |
JP2007039804A (en) * | 2005-07-05 | 2007-02-15 | Furukawa Electric Co Ltd:The | Copper alloy for electronic apparatus and method of producing the same |
JP5128152B2 (en) * | 2007-03-14 | 2013-01-23 | 古河電気工業株式会社 | Copper alloy for lead frame excellent in bare bonding property and manufacturing method thereof |
CN101509850A (en) * | 2009-03-20 | 2009-08-19 | 北京科技大学 | Method for preparing electroforming copper metallographical example and display texture |
-
2010
- 2010-03-23 JP JP2010066397A patent/JP4629154B1/en active Active
-
2011
- 2011-03-21 TW TW100109511A patent/TWI429763B/en active
- 2011-03-23 MX MX2012010887A patent/MX2012010887A/en active IP Right Grant
- 2011-03-23 EP EP11759455.6A patent/EP2551384A4/en not_active Withdrawn
- 2011-03-23 CN CN201180015302.0A patent/CN102803574B/en active Active
- 2011-03-23 KR KR1020127020755A patent/KR101335201B1/en active IP Right Grant
- 2011-03-23 WO PCT/JP2011/057026 patent/WO2011118650A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995014121A1 (en) * | 1993-11-16 | 1995-05-26 | Ontario Hydro | Metal tube having a section with an internal electroplated structural layer |
JP2006002233A (en) * | 2004-06-18 | 2006-01-05 | Furukawa Electric Co Ltd:The | Object to be plated having excellent forming workability |
US20070015001A1 (en) * | 2005-07-05 | 2007-01-18 | The Furukawa Electric Co., Ltd. | Copper alloy for electronic machinery and tools and method of producing the same |
CN101215698A (en) * | 2007-12-28 | 2008-07-09 | 天津大学 | Method for preparing film surface of nanometer-stage thickness on red copper surface |
WO2009099198A1 (en) * | 2008-02-08 | 2009-08-13 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric and electronic components |
EP2243847A1 (en) * | 2008-02-08 | 2010-10-27 | The Furukawa Electric Co., Ltd. | Copper alloy material for electric and electronic components |
Non-Patent Citations (1)
Title |
---|
See also references of WO2011118650A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2551384A1 (en) | 2013-01-30 |
TW201139703A (en) | 2011-11-16 |
MX2012010887A (en) | 2012-12-17 |
JP4629154B1 (en) | 2011-02-09 |
KR101335201B1 (en) | 2013-11-29 |
CN102803574B (en) | 2015-09-02 |
JP2011195927A (en) | 2011-10-06 |
KR20120114341A (en) | 2012-10-16 |
CN102803574A (en) | 2012-11-28 |
WO2011118650A1 (en) | 2011-09-29 |
TWI429763B (en) | 2014-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20121023 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/02 20060101ALI20170424BHEP Ipc: C25D 7/00 20060101ALI20170424BHEP Ipc: C22C 9/06 20060101ALI20170424BHEP Ipc: C22C 9/05 20060101ALI20170424BHEP Ipc: C22C 9/04 20060101ALI20170424BHEP Ipc: C22C 9/01 20060101ALI20170424BHEP Ipc: B24B 37/00 20120101ALI20170424BHEP Ipc: C25D 7/06 20060101ALI20170424BHEP Ipc: C22C 9/00 20060101ALI20170424BHEP Ipc: C22C 9/10 20060101ALI20170424BHEP Ipc: C25D 5/34 20060101AFI20170424BHEP |
|
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20170621 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/10 20060101ALI20170613BHEP Ipc: C22C 9/05 20060101ALI20170613BHEP Ipc: C25D 7/00 20060101ALI20170613BHEP Ipc: C22C 9/04 20060101ALI20170613BHEP Ipc: C22C 9/06 20060101ALI20170613BHEP Ipc: B24B 37/00 20120101ALI20170613BHEP Ipc: C22C 9/00 20060101ALI20170613BHEP Ipc: C25D 7/06 20060101ALI20170613BHEP Ipc: C22C 9/01 20060101ALI20170613BHEP Ipc: C25D 5/34 20060101AFI20170613BHEP Ipc: C22C 9/02 20060101ALI20170613BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20180118 |