JP6141708B2 - Plated copper alloy plate with excellent gloss - Google Patents

Description

  The present invention relates to an Ag or Ni-plated copper alloy plate excellent in glossiness suitable for use as a lead frame and a method for producing a Cu-Fe-P-based copper alloy mother plate used for the production thereof.

As a copper alloy plate for lead frames used in semiconductor devices such as IC and LSI, it has a balance of properties such as thermal conductivity, press workability, conductivity, mechanical strength, etc., and Sn, Ag, Ni, etc. on its surface Cu-Fe-P-based copper alloy plates that have been subjected to the plating process are frequently used. In recent optical members such as LED chips using light emitting diodes, the lead frame itself needs to have high glossiness, and in particular, a Cu-Fe-P copper alloy plate having good and uniform plating glossiness is required. ing.
Copper alloy plates are generally manufactured by appropriately combining processes such as casting, hot rolling, cold rolling, buffing treatment, annealing, etc. In the process, the copper alloy plates are subjected to various plastic workings. In this surface layer, a work-affected layer and a plastically deformed layer exhibiting a finer crystal structure than the inside of the copper alloy plate are formed. It is known that the work-affected layer is composed of a Bailby layer (upper layer) and a fine crystal layer (lower layer), and has a great influence on various properties of plating formed on the surface.
In Patent Document 1, the thickness of the work-affected layer existing on the surface layer of the copper alloy is 0.2 μm or less, preferably 0.05 μm or less, thereby preventing abnormal precipitation during plating and improving the plating performance. In addition, by applying a plating on a copper alloy with a thickness of 0.2 μm or less to the surface damaged layer of the surface layer to electronic devices such as lead frames, terminals and connectors, the quality of these products can be improved. It is disclosed that it contributes.
Patent Document 2 discloses a bright nickel plating material having a good appearance, an electronic component using the bright nickel plating material, and a method for producing the bright nickel plating material. , Metal bases such as stainless steel, copper or copper alloy, on which a work-affected layer having a thickness of 0.2 μm or more and a crystal grain size of 0.01 to 0.3 μm is formed by buffing or brush polishing And a nickel plating layer formed on the metal surface.
In patent document 3, in Ni-P-Sn type copper alloy plate after mechanical polishing, the heat resistance peelability of tin plating was improved, Ni: 0.4 to 1.6% (mass%, the same applies hereinafter), Sn: 0.4-1.6%, P: 0.027-0.15%, Fe: 0.005-0.15%, and Zn: 0.1-1.1%, Ni content and P A copper alloy plate having a content ratio Ni / P of less than 15 and the balance being made of copper and unavoidable impurities is disclosed, and the surface of the work-affected layer is made of fine crystal grains whose surface is cleaned by mechanical polishing after heat treatment. The thickness is set to 0.4 μm or less.
In Patent Document 4, Fe is contained in an amount of 0.1% to 3.0% by mass, P is contained in an amount of 0.01% to 0.3% by mass, and the balance is rolled with Cu and inevitable impurities. In the copper alloy plate, it is disclosed that the thickness of the work-affected layer on the surface layer of the copper alloy plate is 100 nm or less to improve the oxide film adhesion of the copper alloy plate.

JP 2007-39804 A JP 2011-214066 A JP 2010-236038 A JP 2012-153950 A

  The Cu-Fe-P copper alloy plate with the conventional Ag plating or Ni plating applied to the surface is not glossy and lacks homogeneity, and when applied to an optical member such as an LED as a lead frame, This has been a major factor in reducing the light extraction efficiency from the optical element.

  In the present invention, the above-mentioned drawbacks are improved, and a plated copper alloy plate for a lead frame having a uniform and good Ag or Ni plating gloss and the production of a Cu-Fe-P-based copper alloy mother plate used for the production thereof. Provide a method.

The inventors of the present invention have provided a work-affected layer formed on the surface of a Cu-Fe-P-based copper alloy base plate having a specific composition, and an Ag plating layer or a Ni plating layer formed on the surface of the work-affected layer. As a result of intensive studies on the relationship with the glossiness, the ratio of the thickness of the work-affected layer, the crystal grain size and the surface roughness {(Rz = maximum height roughness) / (Rq = root mean square roughness)} It was found that an Ag plating layer or a Ni plating layer having a uniform and good glossiness is formed on the surface of the work-affected layer only when each is within an appropriate range.
In addition, the above-mentioned Cu-Fe-P-based copper alloy base plate is manufactured by a finish cold rolling process when manufacturing a copper alloy base plate in a process including melt casting, hot rolling, heat treatment, and finish cold rolling in this order. before or after, the line speed as 3 0 to 1 0 0 mm / min, a wire diameter 0. By mechanically polishing the surface of the copper alloy plate before or after finish cold rolling, with a pressing wire pressure of 5 to 15 KPa and a rotation speed of 500 to 2500 rpm with a rotary wire brush of 4 to 0.6 mm, It has also been found that when the above-mentioned optimum work-affected layer is obtained and Ag plating or Ni plating is applied on the surface thereof, an Ag plating layer or Ni plating layer having a uniform and good glossiness can be obtained.

That is, the plated copper alloy plate having excellent glossiness according to the present invention is Fe: 1.8-2.4 mass%, P: 0.01-0.08 mass%, Zn: 0.1-0.5. It has a composition of mass%, the balance being Cu and inevitable impurities, and using an ion milling system (Hitachi High-Technologies Corporation IM4000), the cross section of the surface of the sample is polished, and the cross section parallel to the rolling direction is scanned by scanning electrons. The thickness of the work-affected layer on the surface measured with a microscope (FE-SEM) was 0.3 to 0.5 μm, the crystal grain size was 0.05 to 0.3 μm, and the work-affected layer A copper alloy base plate having a ratio (Rz / Rq) of the maximum height roughness (Rz) of the surface to the root mean square roughness (Rq) of the surface of 6.6 to 7.9, and the work-affected layer Ag plating layer with glossiness exceeding 570 formed on the surface or glossiness exceeding 250 And a Ni plating layer.
The basic composition of the copper alloy base plate used in the present invention is Fe: 1.8-2.4 mass%, P: 0.01-0.08 mass%, Zn: 0.1-0.5 mass%, The balance consists of Cu and inevitable impurities.
Fe has the effect of improving the strength and heat resistance by forming precipitate particles dispersed in the copper matrix, but if its content is less than 1.5% by mass, the number of precipitates is insufficient. The effect cannot be achieved. On the other hand, when the content exceeds 2.4% by mass, coarse precipitate particles that do not contribute to improvement in strength and heat resistance exist, and the precipitate particles effective in heat resistance are insufficient. . For this reason, the Fe content is preferably in the range of 1.5 to 2.4% by mass, but 1.8 to 2.4% by mass is within the scope of the present invention.
P has the effect of improving the strength and heat resistance by forming precipitate particles dispersed in the copper matrix with Fe, but if the content is less than 0.008% by mass, the number of precipitate particles is insufficient. However, the effect cannot be achieved. On the other hand, if the content exceeds 0.08% by mass, coarse precipitates that do not contribute to improvement in strength and heat resistance exist, and precipitate particles having a size effective for heat resistance are insufficient. At the same time, the conductivity and workability are reduced. For this reason, it is preferable to make content of P into the range of 0.008-0.08 mass%, but 0.01-0.08 mass% is the range of this invention.
Zn has the effect of improving the heat resistance peelability of the solid solution by dissolving in the copper matrix, and if less than 0.01% by mass, the effect cannot be achieved. On the other hand, even if the content exceeds 0.5% by mass, further effects cannot be obtained, and the amount of solid solution in the mother layer increases, resulting in a decrease in conductivity. For this reason, it is preferable to make content of Zn into the range of 0.01-0.5 mass%, but 0.1-0.5 mass% is the range of this invention.

Although it is well known that the work-affected layer formed on the surface of the copper alloy base plate greatly affects the properties of the plating formed on the surface, Fe; 8 to 2.4 mass%, P; 0.0 1 ~0.08 wt%, Zn; 0. In a copper alloy plate having a composition of 1 to 0.5% by mass, the balance being Cu and inevitable impurities, the thickness of the work-affected layer on the surface is 0.00. 3 to 0.5 μm, and the crystal grain size is 0.05 to 0.00. 3 is a [mu] m, the ratio between the maximum height surface roughness of the machining deteriorated layer (Rz) and the root mean square roughness of the surface (Rq) (Rz / Rq) 6. If it is 6 to 7.9 , the plating glossiness of the Ag plating layer or Ni plating layer formed on the surface becomes good, the difference in glossiness between the Goodway direction and Badway direction in the rolling direction is reduced, and the glossiness Homogenization is promoted.
If the thickness of the work-affected layer is less than 0.1 μm, it is difficult in terms of production technology, and if it exceeds 0.5 μm, sufficient glossiness cannot be obtained. In the present invention, the thickness range of the work-affected layer is 0.3 to 0.5 μm. If the crystal grain size is less than 0.05 μm, the homogeneity is poor, and if it exceeds 0.5 μm, sufficient glossiness cannot be obtained. In the present invention, the crystal grain size ranges from 0.05 to 0.3 μm. If the surface roughness ratio (Rz / Rq) is less than 6.5, the homogeneity is poor, and if it exceeds 8.0, sufficient glossiness cannot be obtained. In the present invention, the range of the surface roughness ratio (Rz / Rq) is 6.6 to 7.9.
In the present invention, the thickness and crystal grain size of the work-affected layer on the surface were measured by observing a cross section parallel to the rolling direction of the copper alloy plate by FE-SEM.
For application to LED chips using light emitting diodes, the lead frame itself is required to have a uniform and high glossiness, and as the plating, Ag plating or Ni plating is particularly preferable, but depending on the application, Ni—Au plating may be used. Ni-Pd-Au plating or the like is not problematic.

In the plated copper alloy plate having excellent glossiness according to the present invention, the copper alloy base plate further contains Ni; 0.003 to 0.5 mass% and Sn; 0.003 to 0.5 mass%. Features.
Ni has an effect of improving the strength by solid solution in the matrix, and if it is less than 0.003% by mass, the effect cannot be achieved. On the other hand, if the content exceeds 0.5% by mass, the conductivity is lowered. For this reason, when it contains Ni, it is preferable to set it as the range of 0.003-0.5 mass%.
Sn has the effect of improving the strength by solid solution in the matrix, and if it is less than 0.003 mass%, the effect cannot be achieved. On the other hand, if the content exceeds 0.5% by mass, the conductivity is lowered. For this reason, when it contains Sn, it is preferable to set it as the range of 0.003-0.5 mass%.

In the copper alloy plate with plating excellent in the glossiness of the present invention, the copper alloy base plate further contains at least one of Al, Be, Ca, Cr, Mg and Si, and the total content thereof is It is set to 0.0007-0.5 mass%, It is characterized by the above-mentioned.
These elements have a role of improving various properties of the copper alloy sheet, and are preferably selectively added depending on the application.

The manufacturing method of the Cu-Fe-P-based copper alloy base plate of the present invention is the above-mentioned finishing when manufacturing the copper alloy base plate in a process including melt casting, hot rolling, heat treatment, and finish cold rolling in this order. before or after the cold rolling, a line speed as 3 0 to 1 0 0 mm / min, a wire diameter 0. The surface of the copper alloy plate before or after the finish cold rolling is mechanically polished with a rotary wire brush having a diameter of 4 to 0.6 mm and a pressing pressure of 5 to 15 KPa and a rotation speed of 500 to 2500 rpm. Features.
In the present invention, the work-affected layer formed on the surface of the copper alloy base plate is adjusted by mechanically polishing the surface of the copper alloy plate before or after the finish cold rolling. diameter:. 0 4 ~0.6mm, rotational speed: 500～2500Rpm) using a copper alloy plate before or after the finish cold rolling (line speed: 3 0 to 1 0 pressing the 0 mm / min) surface of And mechanical polishing (pressing pressure: 5 to 15 KPa) to reduce the thickness of the work-affected layer on the surface to 0. 3 to 0.5 μm, and the crystal grain size is 0.05 to 0. The ratio (Rz / Rq) between the surface roughness (Rz) and the surface roughness (Rq) is set to 3 μm. 6 to 7.9 .
The rotary wire brush is preferably a foil type or cup type, and is pressed from the vertical direction, and mechanically polished by reciprocating the rotary wire brush itself in the width direction of the copper alloy plate on the line as necessary. May be.
If any one of the above-mentioned mechanical polishing conditions is out of the range, the intended work-affected layer cannot be obtained.
Further, the pickling treatment may be performed with a pickling solution so as not to affect the work-affected layer formed by this mechanical polishing.

  INDUSTRIAL APPLICABILITY According to the present invention, an Ag or Ni-plated copper alloy plate excellent in glossiness suitable for use as a lead frame and a method for producing a Cu-Fe-P-based copper alloy mother plate used for the production thereof are provided.

It is the cross-sectional schematic of the copper alloy board with Ag or Ni plating excellent in the glossiness of the example of 1 implementation corresponding to this invention.

Hereinafter, embodiments of the present invention will be described in detail.
The plated copper alloy plate 1 having excellent glossiness according to the present invention has Fe: 1.5-2.4 mass%, P: 0.008-0.08 mass%, Zn: 0.01-0.5 mass. %, The balance being Cu and inevitable impurities, the thickness of the work-affected layer 2 on the surface is 0.1 to 0.5 μm, the crystal grain size is 0.05 to 0.5 μm, A copper alloy base plate 3 having a ratio (Rz / Rq) of the maximum height roughness (Rz) of the surface of the altered layer 2 to the root mean square roughness (Rq) of 6.5 to 8.0; It has an Ag plating layer or a Ni plating layer 4 formed on the work-affected layer 2.

[Component composition of copper alloy mother board]
The basic composition of the copper alloy mother board 3 used in the present invention is as follows: Fe: 1.5 to 2.4 mass%, P: 0.008 to 0.08 mass%, Zn: 0.01 to 0.5 mass% The balance is Cu and inevitable impurities.
Fe has the effect of improving the strength and heat resistance by forming precipitate particles dispersed in the copper matrix, but if its content is less than 1.5% by mass, the number of precipitates is insufficient. The effect cannot be achieved. On the other hand, when the content exceeds 2.4% by mass, coarse precipitate particles that do not contribute to improvement in strength and heat resistance exist, and the precipitate particles effective in heat resistance are insufficient. . For this reason, it is preferable to make content of Fe into the range of 1.5-2.4 mass%.
P has the effect of improving the strength and heat resistance by forming precipitate particles dispersed in the copper matrix with Fe, but if the content is less than 0.008% by mass, the number of precipitate particles is insufficient. However, the effect cannot be achieved. On the other hand, if the content exceeds 0.08% by mass, coarse precipitates that do not contribute to improvement in strength and heat resistance exist, and precipitate particles having a size effective for heat resistance are insufficient. At the same time, the conductivity and workability are reduced. For this reason, it is preferable to make content of P into the range of 0.008-0.08 mass%.
Zn has the effect of improving the heat resistance peelability of the solid solution by dissolving in the copper matrix, and if less than 0.01% by mass, the effect cannot be achieved. On the other hand, even if the content exceeds 0.5% by mass, further effects cannot be obtained, and the amount of solid solution in the mother layer increases, resulting in a decrease in conductivity. For this reason, it is preferable to make content of Zn into the range of 0.01-0.5 mass%.
Furthermore, it is preferable to contain Ni; 0.003-0.5 mass% and Sn; 0.003-0.5 mass% with respect to this basic composition.
Ni has an effect of improving the strength by solid solution in the matrix, and if it is less than 0.003% by mass, the effect cannot be achieved. On the other hand, if the content exceeds 0.5% by mass, the conductivity is lowered. For this reason, when it contains Ni, it is preferable to set it as the range of 0.003-0.5 mass%.
Sn has the effect of improving the strength by solid solution in the matrix, and if it is less than 0.003 mass%, the effect cannot be achieved. On the other hand, if the content exceeds 0.5% by mass, the conductivity is lowered. For this reason, when it contains Sn, it is preferable to set it as the range of 0.003-0.5 mass%.
Furthermore, for the above-mentioned basic composition or for the above-mentioned composition containing Ni; 0.003-0.5% by mass and Sn; 0.003-0.5% by mass in this basic composition, It is preferable that at least one of Al, Be, Ca, Cr, Mg and Si is contained, and the total content thereof is set to 0.0007 to 0.5% by mass.
These elements have a role of improving various properties of the copper alloy, and it is preferable to selectively add them depending on the application.

[Processed alteration layer on the surface of copper alloy mother board]
Although it is well known that the work-affected layer 2 formed on the surface of the copper alloy base plate 3 has a great influence on the properties of plating formed on the surface, Fe: 1.5 to 2.4% by mass, P: 0.008 to 0.08 mass%, Zn: 0.01 to 0.5 mass%, and the copper alloy base plate 3 having the balance of Cu and inevitable impurities, the work-affected layer 2 on the surface thereof The thickness is 0.1 to 0.5 μm, the crystal grain size is 0.05 to 0.5 μm, the maximum height roughness (Rz) of the surface of the work-affected layer 2 and the root mean square roughness of the surface When the ratio (Rz / Rq) to (Rq) is 6.5 to 8.0, the plating glossiness of the Ag plating layer or Ni plating layer 4 formed on the surface becomes good, and the Goodway direction in rolling And the difference in glossiness in the Badway direction is reduced, and homogenization of glossiness is promoted The
If the thickness of the work-affected layer 4 is less than 0.1 μm, it is difficult in terms of manufacturing technology, and if it exceeds 0.5 μm, sufficient glossiness cannot be obtained. If the crystal grain size is less than 0.05 μm, the homogeneity is poor, and if it exceeds 0.5 μm, sufficient glossiness cannot be obtained. If the surface roughness ratio (Rz / Rq) is less than 6.5, the homogeneity is poor, and if it exceeds 8.0, sufficient glossiness cannot be obtained.
In the present invention, the thickness and crystal grain size of the work-affected layer 4 were measured by observing a cross section parallel to the rolling direction of the copper alloy base plate 3 by FE-SEM.

[Ag plating layer or Ni plating layer applied to the surface of the work-affected layer]
In application to an LED chip or the like using a light emitting diode, the lead frame itself is required to have a uniform and high glossiness. As the plating, Ag plating or Ni plating is particularly preferable, but depending on the application, Ni—Au There is no problem even with plating, Ni—Pd—Au plating or the like.
The thickness of the Ag plating layer or the Ni plating layer 4 formed on the surface of the work-affected layer 2 is not particularly limited and may be appropriately selected depending on the application. However, in consideration of cost effectiveness, 1 to 5 μm is preferable. is there. Although the plating technique and conditions are not particularly limited, for example, the Ni plating layer 4 is prepared by degreasing and pickling the surface of the copper alloy base plate, followed by a matte Ni plating bath (nickel sulfamate; 60 g / l, boric acid; 40 g / l) is preferably used by performing Ni plating at a liquid temperature of 60 ° C. and a current density of 5 A / dm ² . Further, for example, the Ag plating layer 4 is prepared by degreasing and pickling the surface of the copper alloy base plate, followed by an Ag plating bath (silver cyanide; 50 g / L, cyanide; sodium 100 g / L, potassium carbonate; 10 g / L). It is preferably formed by performing Ag plating at a liquid temperature of 20 ° C. and a current density of 1.0 A / dm ² .

[Copper alloy mother board manufacturing method]
The manufacturing method of the Cu-Fe-P-based copper alloy mother board 3 of the present invention is a method for producing a cold-finished copper alloy mother board in a process including melt casting, hot rolling, heat treatment, and finish cold rolling in this order. Before or after the intermediate rolling, the line speed is set to 20 to 120 mm / min, the pressing pressure is set to 1 to 15 KPa, and the rotation speed is set to 500 to 2500 rpm with a rotating wire brush having a wire diameter of 0.1 to 0.6 mm. The surface of the copper alloy plate before or after the finish cold rolling is mechanically polished.
The work-affected layer 2 formed on the surface of the copper alloy base plate 3 is adjusted by mechanically polishing the surface of the copper alloy plate before or after finish cold rolling, and in particular, a rotary wire brush (wire diameter: The surface of the copper alloy plate (line speed: 20 to 120 mm / min) before or after finish cold rolling is pressed and mechanically polished (0.1 to 0.6 mm, rotation speed: 500 to 2500 rpm). Pressing pressure: 1 to 15 KPa), the thickness of the surface damaged layer 2 is 0.1 to 0.5 μm, the crystal grain size is 0.05 to 0.5 μm, the surface roughness (Rz) and the surface The ratio (Rz / Rq) to the roughness (Rq) can be 6.5 to 8.0.
The rotary wire brush is preferably a foil type or cup type, and is pressed from the vertical direction, and mechanically polished by reciprocating the rotary wire brush itself in the width direction of the copper alloy plate on the line as necessary. May be.
If any one of the above-mentioned mechanical polishing conditions is out of the range, the intended work-affected layer 2 cannot be obtained.
Further, after this mechanical polishing, pickling treatment with a pickling solution may be performed so as not to affect the formed damaged layer 2.
Although it is conceivable to use a polishing roll having an appropriate count instead of a rotating wire brush to form the work-affected layer 2, it is possible to give a larger processing strain to the copper alloy plate than the polishing roll. By using the mold wire brush under appropriate conditions, the intended work-affected layer 2 can be obtained more efficiently.
As an example of the manufacturing method, a raw material having a predetermined composition is melted and cast in a reducing atmosphere by an electric furnace to produce a Cu-Fe-P-based copper alloy ingot, and the ingot is hot-rolled to When the surface of the surface is milled and subjected to solution treatment, cold rolling, aging treatment, and finish cold rolling to produce the Cu-Fe-P-based copper alloy base plate 3, before the finish cold rolling or Later, with a rotating wire brush with a wire speed of 20 to 120 mm / min, a wire diameter of 0.1 to 0.6 mm, a pressing pressure of 1 to 15 KPa, a rotation speed of 500 to 2500 rpm, and finish cold rolling By mechanically polishing the surface of the copper alloy plate before or after, the thickness of the work-affected layer 2 on the surface is 0.1 to 0.5 μm, the crystal grain size is 0.05 to 0.5 μm, Maximum height roughness of surface of work-affected layer 2 The ratio (Rz / Rq) of the roughness (Rz) to the root mean square roughness (Rq) of the surface becomes 6.5 to 8.0, and the Ag or Ni plating layer 4 formed on the work-affected layer 2 Will have a uniform and good plating gloss.

Hereinafter, examples of the present invention will be described in detail including comparative examples.
A copper alloy having the composition shown in Table 1 (% is mass%) (components other than additive elements are Cu and inevitable impurities) is dissolved in a reducing atmosphere in an electric furnace and has a thickness of 30 mm and a width of 100 mm. An ingot having a length of 250 mm was produced. The ingot was heated at 730 ° C. for 1 hour, and then hot-rolled at a rolling rate of 67% to finish a thickness of 10 mm, and the surface thereof was milled with a milling machine until the plate thickness was 8 mm. Next, solution treatment is performed at 920 ° C. for 3 hours, cold-rolled to a sheet thickness of 1.5 mm, aging treatment is performed at 450 to 575 ° C. for 3 to 12 hours, and the processing rate is 70%. After finishing cold rolling, the copper alloy plate flowing on the line was mechanically polished using a rotating wire brush under the conditions shown in Table 1, and a work-affected layer was formed on the surface. Cu-Fe-P-based copper alloy thin plates shown in Examples 1 to 11 and Comparative Examples 1 to 6 having a plate thickness of 0.45 mm were produced.
In this case, the rotary wire brush was a foil type (diameter: 480 mmφ), and the copper alloy plate width was 460 mm.

Samples were cut out from these copper alloy thin plates, and the thickness, crystal grain size, and Rz / Rq of the surface damaged layer were measured for each sample.
The thickness of the work-affected layer on the surface and the crystal grain size were determined by polishing the cross section of the surface of the sample using an ion milling system (Hitachi High-Technologies Corporation IM4000) and scanning the cross section parallel to the rolling direction with a scanning electron microscope (FE-). SEM) was observed and measured.
Rz / Rq was determined by measuring Rz and Rq using a laser microscope (OLS300 manufactured by Olympus Corporation) and calculating the ratio.
These measurement results are shown in Table 2.

Next, after these surfaces were degreased and pickled, using a matte Ni plating bath (nickel sulfamate; 60 g / l, boric acid; 40 g / l), A Ni plating layer having a thickness of 3 μm was formed at 60 ° C. and a current density of 5 A / dm ² .
With respect to the samples on which the matte Ni plating was applied, the appearance of gloss was observed. Appearance evaluation was measured using a gloss meter (Nippon Denshoku Kogyo Density Densitometer ND-1) from the Goodway direction and Badway direction of the sample. As for the glossiness of Ni plating, the measured value exceeded 250.
These results are shown in Table 3.
In addition, after degreasing and pickling the surface of the above-described sample, the surface of the sample was prepared using an Ag plating bath (silver cyanide; 50 g / L, sodium cyanide; 100 g / L, potassium carbonate; 10 g / L). Then, an Ag plating layer having a thickness of 3 μm was formed at a liquid temperature of 20 ° C. and a current density of 1.0 A / dm ² .
Gloss appearance was observed for the samples plated with Ag. Appearance evaluation was measured using a gloss meter (Nippon Denshoku Kogyo Density Densitometer ND-1) from the Goodway direction and Badway direction of the sample. As for the glossiness of Ag plating, those with measured values exceeding 570 were considered good.
These results are shown in Table 3.

From the results of Table 1, Table 2 and Table 3, the sample of the example has a smaller difference in gloss between the Goodway direction and Badway direction of the rolling direction than the sample of the comparative example, and has a uniform and high gloss. You can see that
That is, the plated copper alloy plate obtained by applying the Ag plating layer or the Ni plating layer to the copper alloy base plate manufactured by the manufacturing method of the present invention has a uniform and excellent glossiness, and leads for optical members and the like. It turns out that it is optimal as a frame.

A copper alloy having the composition shown in Table 4 (% is mass%) (components other than additive elements are Cu and inevitable impurities) is dissolved in a reducing atmosphere in an electric furnace and has a thickness of 30 mm and a width of 100 mm. An ingot having a length of 250 mm was produced. The ingot was heated at 730 ° C. for 1 hour, and then hot-rolled at a rolling rate of 67% to finish a thickness of 10 mm, and the surface thereof was milled with a milling machine until the plate thickness was 8 mm. Next, solution treatment is performed at 920 ° C. for 3 hours, cold rolling is performed to a plate thickness of 1.5 mm, and aging treatment is performed at 450 to 575 ° C. for 3 to 12 hours, and then flows on the line. The copper alloy sheet is mechanically polished using a rotating wire brush under the conditions shown in Table 4, and after forming a work-affected layer on the surface, finish cold rolling is performed at a processing rate of 50%. Cu-Fe-P-based copper alloy thin plates shown in Examples 21 to 31 and Comparative Examples 21 to 26 having a thickness of 0.75 mm and having a work-affected layer on the surface were prepared.
In this case, the rotary wire brush was a foil type (diameter: 480 mmφ), and the copper alloy plate width was 460 mm.

Samples were cut out from these copper alloy thin plates, and the thickness, crystal grain size, and Rz / Rq of the surface damaged layer were measured for each sample.
The thickness of the work-affected layer on the surface and the crystal grain size were determined by polishing the cross section of the surface of the sample using an ion milling system (Hitachi High-Technologies Corporation IM4000) and scanning the cross section parallel to the rolling direction with a scanning electron microscope (FE-). SEM) was observed and measured.
Rz / Rq was determined by measuring Rz and Rq using a laser microscope (OLS300 manufactured by Olympus Corporation) and calculating the ratio.
These measurement results are shown in Table 5.

Next, after these surfaces were degreased and pickled, using a matte Ni plating bath (nickel sulfamate; 60 g / l, boric acid; 40 g / l), A Ni plating layer having a thickness of 3 μm was formed at 60 ° C. and a current density of 5 A / dm ² .
With respect to the samples on which the matte Ni plating was applied, the appearance of gloss was observed. Appearance evaluation was measured using a gloss meter (Nippon Denshoku Kogyo Density Densitometer ND-1) from the Goodway direction and Badway direction of the sample. As for the glossiness of Ni plating, those with measured values exceeding 250 were considered good.
These results are shown in Table 6.
In addition, after degreasing and pickling the surface of the above-described sample, the surface of the sample was prepared using an Ag plating bath (silver cyanide; 50 g / L, sodium cyanide; 100 g / L, potassium carbonate; 10 g / L). Then, an Ag plating layer having a thickness of 3 μm was formed at a liquid temperature of 20 ° C. and a current density of 1.0 A / dm ² .
Gloss appearance was observed for the samples plated with Ag. Appearance evaluation was measured using a gloss meter (Nippon Denshoku Kogyo Density Densitometer ND-1) from the Goodway direction and Badway direction of the sample. As for the glossiness of Ag plating, those with measured values exceeding 570 were considered good.
These results are shown in Table 6.

From the results of Table 4, Table 5, and Table 6, the sample of the example has a smaller difference in glossiness between the Goodway direction and Badway direction of the rolling direction than the sample of the comparative example, and has a uniform and high glossiness. You can see that
That is, the plated copper alloy plate obtained by applying the Ag plating layer or the Ni plating layer to the copper alloy base plate manufactured by the manufacturing method of the present invention has a uniform and excellent glossiness, and leads for optical members and the like. It turns out that it is optimal as a frame.

  As mentioned above, although the manufacturing method of embodiment of this invention was demonstrated, this invention is not limited to this description, A various change can be added in the range which does not deviate from the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 Copper alloy plate with Cu-Fe-P system plating 2 Work-affected layer 3 Copper alloy base plate 4 Ag plating layer or Ni plating layer

Claims (4)

Fe; 1.8 to 2.4 mass%, P; 0.01 to 0.08 mass%, Zn; 0.1 to 0.5 mass%, the balance being Cu and inevitable impurities, Surface processing , measured by observing a cross section parallel to the rolling direction with a scanning electron microscope (FE-SEM) using an ion milling system (Hitachi High-Technologies Corporation IM4000). The thickness of the deteriorated layer is 0.3 to 0.5 μm, the crystal grain size is 0.05 to 0.3 μm, the maximum height roughness (Rz) of the surface of the processed affected layer and the root mean square of the surface A copper alloy base plate having a ratio (Rz / Rq) to roughness (Rq) of 6.6 to 7.9, and an Ag plating layer or gloss having a glossiness of over 570 formed on the work-affected layer. Excellent in glossiness, characterized by having a Ni plating layer with a degree of more than 250 Plated copper alloy sheet.   The said copper alloy mother board contains Ni; 0.003-0.5 mass% and Sn; 0.003-0.5 mass% further, It was excellent in the glossiness of Claim 1 characterized by the above-mentioned. Copper alloy plate with plating.   The copper alloy base plate further contains at least one of Al, Be, Ca, Cr, Mg, and Si, and the total content thereof is set to 0.0007 to 0.5 mass%. The copper alloy plate with plating excellent in glossiness according to claim 1 or 2. Fe; 1.8 to 2.4 mass%, P; 0.01 to 0.08 mass%, Zn; 0.1 to 0.5 mass%, the balance being Cu and inevitable impurities, Surface processing , measured by observing a cross section parallel to the rolling direction with a scanning electron microscope (FE-SEM) using an ion milling system (Hitachi High-Technologies Corporation IM4000). The thickness of the deteriorated layer is 0.3 to 0.5 μm, the crystal grain size is 0.05 to 0.3 μm, the maximum height roughness (Rz) of the surface of the processed affected layer and the root mean square of the surface A method for producing a copper alloy base plate having a ratio (Rz / Rq) to roughness (Rq) of 6.6 to 7.9, in which melting casting, hot rolling, heat treatment, and finish cold rolling are performed in this order. In manufacturing the copper alloy base plate in the process of including, before the finish cold rolling or Later, with a rotary wire brush having a wire speed of 30 to 100 mm / min, a wire diameter of 0.4 to 0.6 mm, a pressing pressure of 5 to 15 KPa, a rotational speed of 500 to 2500 rpm, and the above finish cold A method for producing a Cu-Fe-P copper alloy base plate, wherein the surface of the copper alloy plate before or after rolling is mechanically polished.

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