MX2012010887A - Aleacion de cobre para material electronico y metodo de manufactura del mismo. - Google Patents

Aleacion de cobre para material electronico y metodo de manufactura del mismo.

Info

Publication number
MX2012010887A
MX2012010887A MX2012010887A MX2012010887A MX2012010887A MX 2012010887 A MX2012010887 A MX 2012010887A MX 2012010887 A MX2012010887 A MX 2012010887A MX 2012010887 A MX2012010887 A MX 2012010887A MX 2012010887 A MX2012010887 A MX 2012010887A
Authority
MX
Mexico
Prior art keywords
copper alloy
electronic material
less
crystal grains
grain diameter
Prior art date
Application number
MX2012010887A
Other languages
English (en)
Inventor
Hiroshi Kuwagaki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MX2012010887A publication Critical patent/MX2012010887A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Se provee una aleación de cobre para material electrónico que exhibe excelente uniformidad de deposición. Una aleación de cobre para material electrónico en donde, cuando su sección transversal paralela a la dirección de laminación es observada mediante SIM, la proporción del área de la estructura amorfa y granos cristalinos que tienen un tamaño de grano de menos de 0.1 micras a un intervalo de profundidad de 0.5 micras o menos de la superficie es de 1% o menos y la proporción del número de granos cristalinos que tienen un tamaño de grano de por lo menos 0.1 micras y menos de 0.2 micras al número global de granos cristalinos que tienen un tamaño de grano de por lo menos 0.1 micras a un intervalo de profundidad de 0.2 - 0.5 micras de la superficie es del 47.5% o más.
MX2012010887A 2010-03-23 2011-03-23 Aleacion de cobre para material electronico y metodo de manufactura del mismo. MX2012010887A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010066397A JP4629154B1 (ja) 2010-03-23 2010-03-23 電子材料用銅合金及びその製造方法
PCT/JP2011/057026 WO2011118650A1 (ja) 2010-03-23 2011-03-23 電子材料用銅合金及びその製造方法

Publications (1)

Publication Number Publication Date
MX2012010887A true MX2012010887A (es) 2012-12-17

Family

ID=43638543

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2012010887A MX2012010887A (es) 2010-03-23 2011-03-23 Aleacion de cobre para material electronico y metodo de manufactura del mismo.

Country Status (7)

Country Link
EP (1) EP2551384A4 (es)
JP (1) JP4629154B1 (es)
KR (1) KR101335201B1 (es)
CN (1) CN102803574B (es)
MX (1) MX2012010887A (es)
TW (1) TWI429763B (es)
WO (1) WO2011118650A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4831552B1 (ja) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP5961371B2 (ja) * 2011-12-06 2016-08-02 Ｊｘ金属株式会社 Ｎｉ−Ｃｏ−Ｓｉ系銅合金板
JP6141708B2 (ja) * 2013-07-09 2017-06-07 三菱伸銅株式会社 光沢度に優れためっき付き銅合金板
JP6085536B2 (ja) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール
WO2015022916A1 (ja) 2013-08-14 2015-02-19 三菱レイヨン株式会社 ナノインプリント用モールドの製造方法、および反射防止物品
JP6320759B2 (ja) * 2014-01-06 2018-05-09 三菱伸銅株式会社 Ｃｕ−Ｆｅ−Ｐ系銅合金板の製造方法
JP6228941B2 (ja) * 2015-01-09 2017-11-08 Ｊｘ金属株式会社 めっき層を有するチタン銅
KR102503365B1 (ko) * 2015-09-01 2023-02-24 후루카와 덴키 고교 가부시키가이샤 내열성이 우수한 도금재 및 그 제조방법
JP6271626B2 (ja) * 2016-03-31 2018-01-31 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
JP6662685B2 (ja) * 2016-03-31 2020-03-11 Ｊｘ金属株式会社 めっき層を有するチタン銅箔
JP2016211078A (ja) * 2016-07-26 2016-12-15 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP6793005B2 (ja) * 2016-10-27 2020-12-02 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516415A (en) * 1993-11-16 1996-05-14 Ontario Hydro Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
JP3550482B2 (ja) 1997-07-09 2004-08-04 三島光産株式会社 連続鋳造に用いる鋳型片のめっき方法
FR2781922B1 (fr) * 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
JP4001491B2 (ja) * 2001-02-20 2007-10-31 日鉱金属株式会社 高強度チタン銅合金及びその製造法並びにそれを用いた端子・コネクター
JP2006002233A (ja) * 2004-06-18 2006-01-05 Furukawa Electric Co Ltd:The 成形加工性に優れた被めっき物
JP2007039804A (ja) * 2005-07-05 2007-02-15 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
US7946022B2 (en) * 2005-07-05 2011-05-24 The Furukawa Electric Co., Ltd. Copper alloy for electronic machinery and tools and method of producing the same
JP5128152B2 (ja) * 2007-03-14 2013-01-23 古河電気工業株式会社 ベアボンディング性に優れるリードフレーム用銅合金及びその製造方法
CN100560797C (zh) * 2007-12-28 2009-11-18 天津大学 一种在紫铜表面制备纳米厚度的薄膜表面的方法
US20100316879A1 (en) * 2008-02-08 2010-12-16 Kuniteru Mihara Copper alloy material for electric/electronic components
CN101509850A (zh) * 2009-03-20 2009-08-19 北京科技大学 一种制备电铸铜金相样品及显示组织的方法

Also Published As

Publication number Publication date
KR20120114341A (ko) 2012-10-16
JP4629154B1 (ja) 2011-02-09
JP2011195927A (ja) 2011-10-06
CN102803574B (zh) 2015-09-02
TWI429763B (zh) 2014-03-11
EP2551384A1 (en) 2013-01-30
EP2551384A4 (en) 2017-07-19
WO2011118650A1 (ja) 2011-09-29
CN102803574A (zh) 2012-11-28
KR101335201B1 (ko) 2013-11-29
TW201139703A (en) 2011-11-16

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