JP4618064B2 - 半導体装置およびその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 165
- 238000004519 manufacturing process Methods 0.000 title claims description 71
- 238000002955 isolation Methods 0.000 claims description 112
- 239000000758 substrate Substances 0.000 claims description 97
- 239000012535 impurity Substances 0.000 claims description 90
- 238000000605 extraction Methods 0.000 claims description 51
- 229910052710 silicon Inorganic materials 0.000 claims description 43
- 239000010703 silicon Substances 0.000 claims description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 39
- 238000005468 ion implantation Methods 0.000 claims description 36
- 230000031700 light absorption Effects 0.000 claims description 11
- 241000255925 Diptera Species 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 31
- 230000035945 sensitivity Effects 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 229910052814 silicon oxide Inorganic materials 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 8
- 239000012212 insulator Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 150000003376 silicon Chemical class 0.000 description 4
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1443—Devices controlled by radiation with at least one potential jump or surface barrier
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76283—Lateral isolation by refilling of trenches with dielectric material
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02024—Position sensitive and lateral effect photodetectors; Quadrant photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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Description
また、本発明の第2の半導体装置は、半導体基板上に形成された絶縁層と、前記絶縁層上に、エピタキシャル成長により形成されたN型のシリコン層からなる低濃度層と、前記低濃度層に形成されていて前記絶縁層に達する素子分離領域と、前記絶縁層と前記素子分離領域で囲まれた前記低濃度層の前記絶縁層側に形成されていて前記低濃度層よりも高濃度のN型の埋め込み層と、前記絶縁層と前記素子分離領域で囲まれた前記低濃度層に形成されていて前記埋め込み層に達するカソード取り出し領域と、イオン注入法により、前記絶縁層と前記素子分離領域で囲まれた前記低濃度層の上部にP型不純物を導入し、それぞれが分離されて形成されたP型シリコン層からなる複数のアノードと、を備え、前記カソード取り出し領域を、前記素子分離領域に隣接させた状態で、前記複数のアノードを挟んで対向するように配置し、前記複数のアノードと前記低濃度層によって複数のフォトダイオードを構成し、前記埋め込み層、前記低濃度層および前記カソード取り出し領域によってカソードを構成している。
Claims (5)
- 半導体基板上に形成された絶縁層と、
前記絶縁層上に、エピタキシャル成長により形成されたP型のシリコン層からなる低濃度層と、
前記低濃度層に形成されていて前記絶縁層に達する素子分離領域と、
前記絶縁層と前記素子分離領域で囲まれた前記低濃度層の前記絶縁層側に形成されていて前記低濃度層よりも高濃度のP型の埋め込み層と、
前記絶縁層と前記素子分離領域で囲まれた前記低濃度層に形成されていて前記埋め込み層に達するアノード取り出し領域と、
イオン注入法により、前記絶縁層と前記素子分離領域で囲まれた前記低濃度層の上部にN型不純物を導入し、それぞれが分離されて形成された複数のN型シリコン層からなるカソードと、を備え、
前記アノード取り出し領域を、前記素子分離領域に隣接させた状態で、前記複数のカソードを挟んで対向するように配置し、
前記複数のカソードと前記低濃度層によって複数のフォトダイオードを構成し、
前記埋め込み層、前記低濃度層および前記アノード取り出し領域によってアノードを構成する半導体装置。 - 半導体基板上に形成された絶縁層と、
前記絶縁層上に、エピタキシャル成長により形成されたN型のシリコン層からなる低濃度層と、
前記低濃度層に形成されていて前記絶縁層に達する素子分離領域と、
前記絶縁層と前記素子分離領域で囲まれた前記低濃度層の前記絶縁層側に形成されていて前記低濃度層よりも高濃度のN型の埋め込み層と、
前記絶縁層と前記素子分離領域で囲まれた前記低濃度層に形成されていて前記埋め込み層に達するカソード取り出し領域と、
イオン注入法により、前記絶縁層と前記素子分離領域で囲まれた前記低濃度層の上部にP型不純物を導入し、それぞれが分離されて形成されたP型シリコン層からなる複数のアノードと、を備え、
前記カソード取り出し領域を、前記素子分離領域に隣接させた状態で、前記複数のアノードを挟んで対向するように配置し、
前記複数のアノードと前記低濃度層によって複数のフォトダイオードを構成し、
前記埋め込み層、前記低濃度層および前記カソード取り出し領域によってカソードを構成する半導体装置。 - 前記埋め込み層および前記低濃度層の厚さは光の吸収長よりも長いことを特徴とする請求項1又は請求項2記載の半導体装置。
- 半導体基板に形成された絶縁層上にアノードを形成するP型の埋め込み層を形成する工程と、
前記埋め込み層上に、前記埋め込み層よりも低濃度のP型のシリコン層からなる低濃度層を、エピタキシャル成長により形成する工程と、
前記埋め込み層に前記絶縁層に達するアノード取り出し領域を形成する工程と、
前記低濃度層および前記埋め込み層を分離して独立したアノード領域を区画するもので、前記絶縁層に達する素子分離領域を形成する工程と、
イオン注入法により、前記低濃度層にN型不純物を導入し、フォトダイオードのカソードとなるN型シリコン層を形成する工程と、を有し、
前記複数のカソードと前記低濃度層で複数のフォトダイオードを形成し、
前記埋め込み層、前記低濃度層および前記アノード取り出し領域によってアノードを形成し、
前記アノード取り出し領域を、前記素子分離領域に隣接させた状態で、前記複数のカソードを挟んで対向するように配置する半導体装置の製造方法。 - 半導体基板に形成された絶縁層上にカソードを形成するN型の埋め込み層を形成する工程と、
前記埋め込み層上に、前記埋め込み層よりも低濃度のN型のシリコン層からなる低濃度層を、エピタキシャル成長により形成する工程と、
前記埋め込み層に前記絶縁層に達するカソード取り出し領域を形成する工程と、
前記低濃度層および前記埋め込み層を分離して独立したカソード領域を区画するもので、前記絶縁層に達する素子分離領域を形成する工程と、
イオン注入法により、前記低濃度層にP型不純物を導入し、フォトダイオードのアノードとなるP型シリコン層を形成する工程と、を有し、
前記複数のアノードと前記低濃度層で複数のフォトダイオードを形成し、
前記埋め込み層、前記低濃度層および前記カソード取り出し領域によってカソードを形成し、
前記カソード取り出し領域を、前記素子分離領域に隣接させた状態で、前記複数のアノードを挟んで対向するように配置する半導体装置の製造方法。
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JP2005263366A JP4618064B2 (ja) | 2005-09-12 | 2005-09-12 | 半導体装置およびその製造方法 |
EP06782631A EP1933390A4 (en) | 2005-09-12 | 2006-08-10 | SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
CN2006800412984A CN101300685B (zh) | 2005-09-12 | 2006-08-10 | 半导体装置及其制造方法 |
US12/066,629 US7928511B2 (en) | 2005-09-12 | 2006-08-10 | Semiconductor device and method for manufacturing semiconductor device |
KR1020087005372A KR101248084B1 (ko) | 2005-09-12 | 2006-08-10 | 반도체 장치 및 그 제조 방법 |
PCT/JP2006/315837 WO2007032165A1 (ja) | 2005-09-12 | 2006-08-10 | 半導体装置およびその製造方法 |
TW095130581A TW200715594A (en) | 2005-09-12 | 2006-08-21 | Semiconductor device and fabrication method thereof |
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CN107039425B (zh) * | 2017-03-29 | 2018-07-13 | 湖北京邦科技有限公司 | 一种半导体光电倍增器件 |
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CN108573989B (zh) * | 2018-04-28 | 2021-09-14 | 中国科学院半导体研究所 | 硅基雪崩光电探测器阵列及其制作方法 |
JP7039411B2 (ja) | 2018-07-20 | 2022-03-22 | 株式会社東芝 | 光検出器、光検出システム、ライダー装置及び車 |
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JP7222851B2 (ja) | 2019-08-29 | 2023-02-15 | 株式会社東芝 | 光検出器、光検出システム、ライダー装置、及び車 |
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WO2007055299A1 (en) * | 2005-11-09 | 2007-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
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2005
- 2005-09-12 JP JP2005263366A patent/JP4618064B2/ja not_active Expired - Fee Related
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2006
- 2006-08-10 KR KR1020087005372A patent/KR101248084B1/ko not_active IP Right Cessation
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- 2006-08-10 EP EP06782631A patent/EP1933390A4/en not_active Withdrawn
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JP2000150842A (ja) * | 1998-11-05 | 2000-05-30 | Sharp Corp | 受光素子及びその製造方法 |
JP2000277792A (ja) * | 1999-03-29 | 2000-10-06 | Siird Center:Kk | 多チャンネルpinフォトダイオードの駆動方法 |
JP2001345436A (ja) * | 2000-05-30 | 2001-12-14 | Sharp Corp | 回路内蔵受光素子 |
JP2003204070A (ja) * | 2001-12-06 | 2003-07-18 | Internatl Rectifier Corp | 光起電力発生装置 |
JP2004071058A (ja) * | 2002-08-06 | 2004-03-04 | Sharp Corp | 受光増幅回路および光ピックアップ装置 |
Also Published As
Publication number | Publication date |
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CN101300685B (zh) | 2010-05-19 |
TWI307968B (ja) | 2009-03-21 |
WO2007032165A1 (ja) | 2007-03-22 |
JP2007080905A (ja) | 2007-03-29 |
CN101300685A (zh) | 2008-11-05 |
US7928511B2 (en) | 2011-04-19 |
EP1933390A4 (en) | 2012-05-23 |
KR101248084B1 (ko) | 2013-03-27 |
US20100155867A1 (en) | 2010-06-24 |
KR20080053464A (ko) | 2008-06-13 |
EP1933390A1 (en) | 2008-06-18 |
TW200715594A (en) | 2007-04-16 |
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