JP4557328B2 - ポジ型フォトレジスト組成物 - Google Patents

ポジ型フォトレジスト組成物 Download PDF

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Publication number
JP4557328B2
JP4557328B2 JP02423699A JP2423699A JP4557328B2 JP 4557328 B2 JP4557328 B2 JP 4557328B2 JP 02423699 A JP02423699 A JP 02423699A JP 2423699 A JP2423699 A JP 2423699A JP 4557328 B2 JP4557328 B2 JP 4557328B2
Authority
JP
Japan
Prior art keywords
group
carbon atoms
acid
photoresist composition
positive photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP02423699A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000219743A (ja
JP2000219743A5 (enExample
Inventor
一良 水谷
昭一郎 安波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP02423699A priority Critical patent/JP4557328B2/ja
Priority to KR1020000004602A priority patent/KR100653624B1/ko
Priority to US09/496,259 priority patent/US6296985B1/en
Publication of JP2000219743A publication Critical patent/JP2000219743A/ja
Publication of JP2000219743A5 publication Critical patent/JP2000219743A5/ja
Application granted granted Critical
Publication of JP4557328B2 publication Critical patent/JP4557328B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP02423699A 1999-02-01 1999-02-01 ポジ型フォトレジスト組成物 Expired - Fee Related JP4557328B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP02423699A JP4557328B2 (ja) 1999-02-01 1999-02-01 ポジ型フォトレジスト組成物
KR1020000004602A KR100653624B1 (ko) 1999-02-01 2000-01-31 폴리실록산 및 포지티브 포토레지스트 조성물
US09/496,259 US6296985B1 (en) 1999-02-01 2000-02-01 Positive photoresist composition comprising a polysiloxane

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02423699A JP4557328B2 (ja) 1999-02-01 1999-02-01 ポジ型フォトレジスト組成物

Publications (3)

Publication Number Publication Date
JP2000219743A JP2000219743A (ja) 2000-08-08
JP2000219743A5 JP2000219743A5 (enExample) 2005-07-07
JP4557328B2 true JP4557328B2 (ja) 2010-10-06

Family

ID=12132632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02423699A Expired - Fee Related JP4557328B2 (ja) 1999-02-01 1999-02-01 ポジ型フォトレジスト組成物

Country Status (3)

Country Link
US (1) US6296985B1 (enExample)
JP (1) JP4557328B2 (enExample)
KR (1) KR100653624B1 (enExample)

Families Citing this family (26)

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JP2000336267A (ja) * 1999-05-31 2000-12-05 Jsr Corp 膜形成用組成物および絶縁膜形成用材料
JP4187879B2 (ja) * 1999-08-06 2008-11-26 東京応化工業株式会社 感放射線レジスト組成物
TW523639B (en) * 1999-12-06 2003-03-11 Fuji Photo Film Co Ltd Positive photoresist composition
US6531260B2 (en) * 2000-04-07 2003-03-11 Jsr Corporation Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition
JP4141625B2 (ja) * 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
JP4295937B2 (ja) * 2000-12-05 2009-07-15 株式会社Ｋｒｉ 活性成分及びそれを用いた感光性樹脂組成物
DE10137109A1 (de) * 2001-07-30 2003-02-27 Infineon Technologies Ag Siliziumhaltiger Resist für die Fotolithografie
US6797453B2 (en) * 2002-01-24 2004-09-28 Jsr Corporation Radiation sensitive composition for forming an insulating film, insulating film and display device
JP4262516B2 (ja) 2003-05-12 2009-05-13 富士フイルム株式会社 ポジ型レジスト組成物
US8088547B2 (en) * 2004-11-02 2012-01-03 Dow Corning Corporation Resist composition
JP4601056B2 (ja) * 2005-02-21 2010-12-22 株式会社資生堂 シロキサンエステル化合物、皮膚外用剤油分又は毛髪化粧料油分及びこれを配合した皮膚外用剤又は毛髪化粧料
JP5074488B2 (ja) * 2006-06-28 2012-11-14 ダウ・コーニング・コーポレイション 電子求引官能性を有する塩基性添加剤を含むシルセスキオキサン樹脂システム
US8524439B2 (en) 2006-06-28 2013-09-03 Dow Corning Corporation Silsesquioxane resin systems with base additives bearing electron-attracting functionalities
CN104011596A (zh) * 2011-12-26 2014-08-27 东丽株式会社 感光性树脂组合物和半导体元件的制造方法
KR101354538B1 (ko) * 2012-04-20 2014-01-23 주식회사 아이에스엠 크산텐 구조를 포함하는 바인더 수지 및 이를 포함하는 유기절연막 조성물
JP6758575B2 (ja) * 2014-02-24 2020-09-23 東京エレクトロン株式会社 感光性化学増幅レジスト化学物質およびプロセスを使用する方法および技術
DE112015000546T5 (de) 2014-02-25 2016-11-10 Tokyo Electron Limited Chemische Verstärkungsverfahren und -methoden für entwickelbare untere Antireflexbeläge und gefärbte Implantationsresists
WO2016004286A1 (en) * 2014-07-03 2016-01-07 Momentive Performance Materials Inc. Ester-functional polysiloxanes and copolymers made therefrom
WO2016208300A1 (ja) 2015-06-24 2016-12-29 富士フイルム株式会社 パターン形成方法、積層体、及び、有機溶剤現像用レジスト組成物
US10048594B2 (en) 2016-02-19 2018-08-14 Tokyo Electron Limited Photo-sensitized chemically amplified resist (PS-CAR) model calibration
US10429745B2 (en) 2016-02-19 2019-10-01 Osaka University Photo-sensitized chemically amplified resist (PS-CAR) simulation
CN109313394B (zh) 2016-05-13 2021-07-02 东京毅力科创株式会社 使用光敏化学品或光敏化学放大抗蚀剂的临界尺寸控制
TWI662360B (zh) 2016-05-13 2019-06-11 東京威力科創股份有限公司 藉由使用光劑之臨界尺寸控制
WO2021034567A1 (en) 2019-08-16 2021-02-25 Tokyo Electron Limited Method and process for stochastic driven defectivity healing
JP2021176953A (ja) * 2020-05-01 2021-11-11 国立大学法人 鹿児島大学 ラダー状ポリシルセスキオキサン、直鎖状ポリシロキサン、接着剤、ラダー状ポリシルセスキオキサンの製造方法及び直鎖状ポリシロキサンの製造方法
JP7678519B2 (ja) * 2021-04-09 2025-05-16 国立大学法人 鹿児島大学 ポリシロキサン組成物、接着剤、及びポリシロキサン組成物の製造方法

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Also Published As

Publication number Publication date
KR20000076572A (ko) 2000-12-26
KR100653624B1 (ko) 2006-12-05
JP2000219743A (ja) 2000-08-08
US6296985B1 (en) 2001-10-02

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