JP4549171B2 - 混成集積回路装置 - Google Patents
混成集積回路装置 Download PDFInfo
- Publication number
- JP4549171B2 JP4549171B2 JP2004342657A JP2004342657A JP4549171B2 JP 4549171 B2 JP4549171 B2 JP 4549171B2 JP 2004342657 A JP2004342657 A JP 2004342657A JP 2004342657 A JP2004342657 A JP 2004342657A JP 4549171 B2 JP4549171 B2 JP 4549171B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- back surface
- metal substrate
- insulating layer
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
矩形の第1の金属基板と、
前記第1の金属基板の表面に設けられた第1の絶縁層と、
前記第1の絶縁層の表面に設けられた導電パターンと、
前記導電パターンと電気的に接続されて設けられた半導体素子と、
前記導電パターンの一つであり、前記金属基板の側辺に沿って設けられたパッドに固着されたリードと、
前記第1の金属基板の裏面に設けられた第2の絶縁層と、
前記第1の金属基板の裏面の周囲を封止樹脂の被覆する領域として残し、前記第2の絶縁層に貼着された第2の金属基板と、
前記金属基板の表面、前記金属基板の側面を被覆し、前記金属基板の側面から前記金属基板裏面の端部を覆って前記被覆する領域まで設けられ、前記第2の金属基板の裏面と平坦となる前記封止樹脂とを有する事で解決するものである。
11 回路基板
12 絶縁層
12A 第1の絶縁層
12B 第2の絶縁層
13 導電パターン
14 封止樹脂
15 回路素子
15A 半導体素子
15B チップ素子
16 金属基板
17 金属細線
18 接続部
19 接着剤
21 放熱フィン
22 金型
22A 上金型
22B 下金型
23 キャビティ
24 凸部
25 リード
26A 第1の導電箔
26B 第2の導電箔
27 レジスト
Claims (4)
- 矩形の第1の金属基板と、
前記第1の金属基板の表面に設けられた第1の絶縁層と、
前記第1の絶縁層の表面に設けられた導電パターンと、
前記導電パターンと電気的に接続されて設けられた半導体素子と、
前記導電パターンの一つであり、前記金属基板の側辺に沿って設けられたパッドに固着されたリードと、
前記第1の金属基板の裏面に設けられた第2の絶縁層と、
前記第1の金属基板の裏面の周囲を封止樹脂の被覆する領域として残し、前記第2の絶縁層に貼着された第2の金属基板と、
前記金属基板の表面、前記金属基板の側面を被覆し、前記金属基板の側面から前記金属基板裏面の端部を覆って前記被覆する領域まで設けられ、前記第2の金属基板の裏面と平坦となる前記封止樹脂とを有する事を特徴とした混成集積回路装置。 - 前記第2の絶縁層の裏面に金属膜が設けられ、前記金属膜に設けられた接着剤により前記第2の金属基板が固着される請求項1に記載の混成集積回路装置。
- 前記第2の金属基板は、アルミニウムから成り、表面と裏面には酸化膜が形成されている請求項1に記載の混成集積回路装置。
- 酸化膜は、陽極酸化膜であり、前記陽極酸化膜が前記第2の絶縁層に接着され、前記回路装置の裏面には、前記第2の金属基板の裏面に形成された陽極酸化膜が露出する請求項3に記載の混成集積回路装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004342657A JP4549171B2 (ja) | 2004-08-31 | 2004-11-26 | 混成集積回路装置 |
KR20050110728A KR100765604B1 (ko) | 2004-11-26 | 2005-11-18 | 회로 장치 및 그 제조 방법 |
CN200510126887XA CN1783487B (zh) | 2004-11-26 | 2005-11-25 | 电路装置及其制造方法 |
US11/164,522 US7529093B2 (en) | 2004-11-26 | 2005-11-28 | Circuit device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004251363 | 2004-08-31 | ||
JP2004342657A JP4549171B2 (ja) | 2004-08-31 | 2004-11-26 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006100759A JP2006100759A (ja) | 2006-04-13 |
JP4549171B2 true JP4549171B2 (ja) | 2010-09-22 |
Family
ID=36240235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004342657A Expired - Fee Related JP4549171B2 (ja) | 2004-08-31 | 2004-11-26 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4549171B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100765604B1 (ko) | 2004-11-26 | 2007-10-09 | 산요덴키가부시키가이샤 | 회로 장치 및 그 제조 방법 |
JP4904104B2 (ja) * | 2006-07-19 | 2012-03-28 | 三菱電機株式会社 | 半導体装置 |
WO2010053158A1 (ja) * | 2008-11-07 | 2010-05-14 | タイコエレクトロニクスジャパン合同会社 | Ptcデバイス |
JP5371564B2 (ja) * | 2009-06-15 | 2013-12-18 | 日東シンコー株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
JP5541618B2 (ja) * | 2009-09-01 | 2014-07-09 | 新光電気工業株式会社 | 半導体パッケージの製造方法 |
DE112011104406B4 (de) | 2010-12-16 | 2015-12-24 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
CN102956787A (zh) * | 2011-08-16 | 2013-03-06 | 欧司朗股份有限公司 | 电子模块、发光装置及该电子模块的制造方法 |
JP2013115133A (ja) * | 2011-11-25 | 2013-06-10 | Semiconductor Components Industries Llc | 回路装置の製造方法 |
JP2013229535A (ja) * | 2012-04-27 | 2013-11-07 | Mitsubishi Electric Corp | 半導体装置 |
JP6124440B2 (ja) * | 2013-01-18 | 2017-05-10 | 新電元工業株式会社 | 半導体装置 |
JP6304700B2 (ja) * | 2016-09-26 | 2018-04-04 | 株式会社パウデック | 半導体パッケージ、モジュールおよび電気機器 |
JP7069082B2 (ja) | 2019-05-08 | 2022-05-17 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
JP7142067B2 (ja) * | 2020-09-30 | 2022-09-26 | Nissha株式会社 | 成形品及び成形品の製造方法 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6185828A (ja) * | 1984-10-03 | 1986-05-01 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
JPH043967A (ja) * | 1990-04-20 | 1992-01-08 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH04206278A (ja) * | 1990-11-29 | 1992-07-28 | Sharp Corp | 一体型端子ユニット |
JPH06209054A (ja) * | 1993-01-08 | 1994-07-26 | Mitsubishi Electric Corp | 半導体装置 |
JPH07147343A (ja) * | 1993-11-24 | 1995-06-06 | Sanyo Electric Co Ltd | 混成集積回路装置 |
JPH08298299A (ja) * | 1995-04-27 | 1996-11-12 | Hitachi Ltd | 半導体装置 |
JPH09102650A (ja) * | 1995-10-05 | 1997-04-15 | Matsushita Electron Corp | 半導体レーザ装置及び光ピックアップ装置 |
JPH09260550A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JPH10223669A (ja) * | 1997-02-12 | 1998-08-21 | Oki Electric Ind Co Ltd | 半導体装置の樹脂封止装置及びその樹脂封止方法 |
JPH11330317A (ja) * | 1997-07-03 | 1999-11-30 | Sanyo Electric Co Ltd | 混成集積回路装置およびその製造方法 |
JP2002314037A (ja) * | 2001-04-17 | 2002-10-25 | Hitachi Ltd | パワー半導体モジュール |
JP2003031765A (ja) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | パワーモジュールおよびインバータ |
JP2003318312A (ja) * | 2002-04-24 | 2003-11-07 | Sanyo Electric Co Ltd | 混成集積回路装置 |
-
2004
- 2004-11-26 JP JP2004342657A patent/JP4549171B2/ja not_active Expired - Fee Related
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6185828A (ja) * | 1984-10-03 | 1986-05-01 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
JPH043967A (ja) * | 1990-04-20 | 1992-01-08 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH04206278A (ja) * | 1990-11-29 | 1992-07-28 | Sharp Corp | 一体型端子ユニット |
JPH06209054A (ja) * | 1993-01-08 | 1994-07-26 | Mitsubishi Electric Corp | 半導体装置 |
JPH07147343A (ja) * | 1993-11-24 | 1995-06-06 | Sanyo Electric Co Ltd | 混成集積回路装置 |
JPH08298299A (ja) * | 1995-04-27 | 1996-11-12 | Hitachi Ltd | 半導体装置 |
JPH09102650A (ja) * | 1995-10-05 | 1997-04-15 | Matsushita Electron Corp | 半導体レーザ装置及び光ピックアップ装置 |
JPH09260550A (ja) * | 1996-03-22 | 1997-10-03 | Mitsubishi Electric Corp | 半導体装置 |
JPH10223669A (ja) * | 1997-02-12 | 1998-08-21 | Oki Electric Ind Co Ltd | 半導体装置の樹脂封止装置及びその樹脂封止方法 |
JPH11330317A (ja) * | 1997-07-03 | 1999-11-30 | Sanyo Electric Co Ltd | 混成集積回路装置およびその製造方法 |
JP2002314037A (ja) * | 2001-04-17 | 2002-10-25 | Hitachi Ltd | パワー半導体モジュール |
JP2003031765A (ja) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | パワーモジュールおよびインバータ |
JP2003318312A (ja) * | 2002-04-24 | 2003-11-07 | Sanyo Electric Co Ltd | 混成集積回路装置 |
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JP2006100759A (ja) | 2006-04-13 |
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