WO2010053158A1 - Ptcデバイス - Google Patents
Ptcデバイス Download PDFInfo
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- WO2010053158A1 WO2010053158A1 PCT/JP2009/068999 JP2009068999W WO2010053158A1 WO 2010053158 A1 WO2010053158 A1 WO 2010053158A1 JP 2009068999 W JP2009068999 W JP 2009068999W WO 2010053158 A1 WO2010053158 A1 WO 2010053158A1
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- ptc
- ptc element
- layered support
- resin
- potting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- the present invention relates to a PTC device having a PTC element, in particular, a polymer PTC element, and an electric apparatus having such a PTC device.
- the polymer PTC element has, for example, a characteristic that a resistance value increases rapidly when the temperature exceeds a predetermined critical value in order to prevent a failure due to an excessive current in the electric device, an overheating of the electric device, and the like. That is, it has a so-called positive temperature coefficient or PTC (positive temperature coefficient) characteristic.
- Such critical temperature is also called trip temperature.
- the substrate on which the IC chip is mounted which is disposed in the electric device, generates a large amount of heat when the electric device is used, it has a heat radiating plate to dissipate the heat to the outside. If for some reason (for example, due to excessive current flowing through such a substrate), if such a substrate becomes abnormally hot, the heat dissipation by the heat sink cannot catch up and the heat sink, and therefore the substrate, May remain abnormally hot. Therefore, a ceramic PTC element (for example, Posister (registered trademark) commercially available from Murata Manufacturing Co., Ltd.) is attached to the heat sink to detect the temperature of the substrate and indirectly prevent the substrate from becoming abnormally hot. Things have been done.
- Posister registered trademark
- Such a ceramic PTC element functions to prevent the substrate from becoming abnormally hot, but in some cases, such a function is not always sufficient. For example, when the temperature rises, the resistance value does not increase with time, that is, the resistance value does not increase sharply in a short time, and as a result, the current cannot be cut off in a short time. For this reason, a method of interrupting the current (independent of the PTC element) when the resistance value of the ceramic PTC element reaches a certain value (that is, an indirect method) is generally employed. In particular, it is desired to detect the possibility of an abnormally high temperature of the substrate more promptly and to prevent the abnormally high temperature in advance.
- the present invention provides: A PTC device comprising a layered support that functions as a heat transfer medium and a polymer PTC element disposed thereon, The polymer PTC element is disposed on one surface of the layered support (in a thermally connected state), and these are molded in the resin so that the other surface of the layered support is exposed.
- a featured PTC device is provided.
- the PTC element is molded in the resin.
- the molded PTC element is separated from the environment around the PTC device by the molding resin.
- the resin to be molded has a barrier function against moisture, oxygen, and the like.
- the layered support can be in thermal contact with an object whose temperature is to be detected by the PTC device.
- Thermal contact means that heat is quickly transferred from the object to the exposed surface of the layered support by contacting the exposed surface of the layered support with the surface of the object.
- such thermal contact results in the temperature of the exposed surface of the layered support being substantially equal to the surface temperature of the object. More preferably, as a result of such thermal contact, the temperature of the exposed surface of the layered support is also substantially equal to the temperature of the unexposed opposite surface.
- the material constituting such a layered support is preferably a heat conductive material, particularly a good heat conductive material (for example, a metal material such as stainless steel or copper).
- a good heat conductive material for example, a metal material such as stainless steel or copper.
- the material is not so good heat conductive material (for example, composite material such as glass epoxy (glass fiber + epoxy resin), other ceramic materials, etc.) Such a material may be used because it is not very resistive.
- the polymer PTC element is thermally connected to the layered support, so that heat is transferred from the exposed surface of the layered support, and thus from the object on which the PTC device is placed, through the layered support to the PTC element.
- it is configured to transmit quickly.
- the expression that the layered support “functions as a heat transfer medium” is used in the sense of transferring heat from the object to the PTC element.
- the connection of the polymer PTC element to the layered support may be direct or indirect.
- the direct connection corresponds to an aspect in which there is no intervening between the polymer PTC element and the layered support, and the indirect connection is another material between the polymer PTC element and the layered support. It corresponds to the mode to do.
- Such other materials include adhesive materials (adhesives, solders, conductive adhesives, conductive pastes, etc.), insulating materials, etc., such materials usually present in the form of layers.
- the layered support and the PTC element are connected via a heat conductive material, particularly a good heat conductive material (for example, a metal material). Even if the material is not so good in heat conductivity (for example, a ceramic material), if the thickness is small, it does not become so resistant to heat transfer, so such a material may be used. .
- a good heat conductive material for example, a metal material.
- the present invention is a method for producing a PTC device comprising a layered support and a polymer PTC element disposed thereon, Disposing the polymer PTC element on one surface of the layered support and molding the layered support and polymer PTC element so that the other surface of the layered support is exposed.
- the above-described PTC device of the present invention can be manufactured.
- the arrangement of the polymer PTC element on the layered support may be direct or indirect, as in the connection of the polymer PTC element to the layered support.
- the present invention provides an electrical apparatus comprising the PTC device described above.
- an electric apparatus includes a circuit board having the PTC device of the present invention, in particular, an IC board of a circuit for controlling a power source, a circuit module, an overheat detection device, and the like.
- the PTC device of the present invention is formed by combining a polymer PTC element having higher sensitivity than a ceramic PTC element with a layered support and molding so that one surface of the support is exposed.
- FIG. 1 is a schematic cross-sectional view of a PTC device of the present invention.
- FIG. 2 is a schematic plan view showing the PTC device of FIG. 1 viewed from the left side of FIG.
- FIG. 3 shows the RT measurement result of the PTC device of the present invention of Example 1.
- FIG. 4 shows the RT measurement result of the PTC device of the present invention in Example 5.
- FIG. 5 shows the RT measurement result of the PTC device of the present invention in Example 6.
- FIG. 6 shows temporal changes in resistance value and thermocouple temperature when the ambient temperature is raised for the PTC device of the present invention of Example 1.
- FIG. 7 shows temporal changes in the resistance value and the temperature of the thermocouple when the ambient temperature is raised for the inorganic PTC element.
- the polymer PTC element constituting the PTC device of the present invention is well known, and various types are commercially available. Such polymer PTC elements are used in the meaning of commonly used terms.
- the polymer PTC element has a polymer PTC element in which a so-called polymer PTC composition is formed in layers, and a first metal electrode (particularly a foil electrode) and a second metal electrode (particularly a foil) disposed on both main surfaces thereof. It is particularly preferable that the electrode has a shape electrode).
- a conductive filler for example, a carbon filler, a metal filler (a filler such as copper, nickel, nickel-cobalt alloy), etc.
- a polymer material for example, polyethylene, polyvinylidene fluoride, etc.
- PTC elements can be obtained by extruding such compositions.
- the layered support is defined by two main surfaces facing each other, and is capable of directly or indirectly mounting the polymer PTC element on one of the main surfaces as a heat conductive material to the polymer PTC element.
- it is a metal layer, for example, a metal sheet or a metal film.
- the same layered metal lead frame (for example, stainless steel, other suitable metal, etc.) used for the wiring board may be used as the layered support.
- it may be a layered support of ceramic material.
- the layered support is preferably larger than the area occupied by the PTC element placed thereon.
- the state in which the PTC element is disposed on the layered support is viewed from above, at least a part of the periphery of the PTC element, preferably a part of the layered support extends outside the entire circumference of the PTC element. Is preferred.
- the layered support When placing the PTC element on the layered support, if the layered support is an electrically conductive material, it is necessary to dispose an insulating material between the PTC element and the layered support. If the layered support is electrically insulating, it is not necessary to arrange such an insulating material.
- the insulating material is preferably in a layered form.
- an insulating material layer is bonded to the layered support with an adhesive material, and a PTC element is bonded to the bonded insulating material layer with an adhesive material.
- adhesive materials may be the same or different, and preferably have thermal conductivity, more preferably good thermal conductivity.
- solder, conductive material paste for example, silver paste
- solder paste for example, conductive adhesive, or the like may be used for bonding.
- the PTC element and the layered support are molded so that the other surface of the layered support (that is, the surface on which the PTC element is not placed) is exposed.
- the layered support on which the PTC element is placed is placed in a predetermined mold with the other surface of the layered support exposed, and then a resin is injected into the mold to solidify and / or cure.
- the resin to be injected is a curable resin such as a thermosetting resin, a light or radiation curable resin, and various epoxy resins and silicone resins can be used.
- the resin to be injected may be a thermoplastic resin.
- the molten resin is injected into a mold and then solidified by cooling.
- Such molding is well known and is performed so that at least a portion, preferably most, more preferably substantially all of the other surface of the layered support is exposed.
- the mold resin has a function of separating the molded PTC element from the environment around the PTC device. Specifically, the PTC element is prevented from being adversely affected by surrounding moisture, oxygen, and the like as much as possible.
- the PTC element placed on the layered support is pre-enclosed by potting with a curable resin before being molded as described above, and then the curable resin is cured.
- potting means so-called “resin coating (or resin coating)”, covering the element with resin, and then curing the coating resin.
- a curable resin is placed on a PTC element placed on a layered support and cured. The pile of curable resin is carried out so that the PTC element placed on the layered support is entirely covered with the resin. As a result, on the layered support, the PTC element is covered with a cured resin, i.e.
- a coating surrounding the PTC element is formed as a potting element.
- potting can also be said to encapsulate other parts while securing an exposed part.
- a wire (or wiring) connected to the PTC element needs to pass through the potting element and extend outward. In this way, after the PCT element placed on the layered support is covered with the potting element, molding is performed.
- the melting point of polyethylene (PE) used for the PTC element is, for example, 180 ° C. to 240 ° C.
- a high temperature liquid epoxy resin of about 180 ° C. is used as a resin for molding such an element.
- the potting element can function as a cushioning material that suppresses such adverse effects on the PTC element.
- a polymer such as PE constituting the PTC element may be altered or deteriorated by an organic solvent or oil.
- the potting element prevents the chemical component (for example, a curing agent) contained in the molten / softened resin contained in the resin to be injected at the time of molding as much as possible.
- the curable resin forming the potting element may be any suitable curable resin.
- a thermosetting resin such as an epoxy resin or a silicone resin
- the curable resin forming the potting element may be a light or radiation curable resin.
- the resin used for molding is a curable resin
- the curable resin is a resin different from the curable resin that forms the potting element.
- the curable resin forming such a potting element preferably has a linear expansion coefficient after curing larger than that of the mold resin at the trip temperature of the PTC element.
- the PTC element constituting the PTC element It is more preferable that it is the same as or smaller than the linear expansion coefficient of the polymer.
- the linear expansion coefficient of the resin forming the potting element is preferably 3.0 ⁇ 10 ⁇ 5 / ° C. or higher at a temperature higher than Tg (glass transition temperature) after curing. It is preferably 40.0 ⁇ 10 ⁇ 5 / ° C. or less, and particularly preferably 30.0 ⁇ 10 ⁇ 5 / ° C. or less.
- the linear expansion coefficient of the cured resin is, for example, 10 ⁇ 10 ⁇ 5 / ° C. to 20 ⁇ 10 ⁇ 5 / ° C.
- the polymer constituting the polymer PTC element is polyethylene, it is particularly preferable that the cured resin has a linear expansion coefficient within this range.
- the linear expansion coefficient of the resin is 3.0 ⁇ 10 ⁇ 5 / ° C. or more at a temperature near the trip temperature of the PTC element after curing. Is preferably 40.0 ⁇ 10 ⁇ 5 / ° C. or less.
- the force generated by the expansion of the element balances the force generated by compressing the periphery of the PTC element. Therefore, when the molding material located around the PTC element is relatively hard, that is, when the temperature does not expand so much (that is, when the linear expansion coefficient is small), the PTC element cannot expand sufficiently, and as a result. It is considered that the PTC characteristics are adversely affected. For example, the resistance may not be sufficiently high during a trip.
- the soft material exists around the PTC element, so that the PTC element can easily expand.
- Such soft materials have a relatively large coefficient of linear expansion. Therefore, when a material having a large linear expansion coefficient is used as the potting element, it is possible to suppress the expansion of the PTC element, and as a result, the characteristics as the PTC element are maintained as much as possible. For example, by interposing such a potting element, compared to the case where no potting element is present, the RT characteristic of the PTC device is 2 to 4 times the resistance value after a trip in which the PTC element is expanded due to heat. (See FIG. 5 described later).
- the linear expansion coefficient of the molding material is smaller than the linear expansion coefficient of the potting element.
- This linear expansion coefficient relationship is preferably satisfied at least in the vicinity of the trip temperature of the PTC element (preferably trip temperature ⁇ 20 ° C., more preferably trip temperature ⁇ 10 ° C., for example, trip temperature ⁇ 5 ° C.).
- FIG. 1 is a schematic cross-sectional view of a PTC device of the present invention. 1 is shown in a schematic plan view in FIG. 2 so that the state of the PTC element located inside the mold resin can be understood similarly.
- the cut surface when cut along a vertical straight line passing through the center of FIG. 2 corresponds to FIG.
- the PTC device 10 of the present invention comprises a polymer PTC element 12 and a layered support 14.
- the layered support 14 has two main surfaces 15 (also referred to as one surface) and a main surface 15 ′ (also referred to as the other surface) that face each other, and the PTC element 12 is placed on one main surface 15. .
- the main surface 15 ' is the surface to be exposed.
- the main surface 15 ' is a surface that contacts an object 32 to be detected for an abnormal condition (for example, excessively high temperature, excessive current, etc.), and as a result of detection, the PTC element 12 trips according to the abnormal condition.
- the main surface 15 ' is in contact with the object 32 at least in part, preferably most, more preferably substantially all as shown (the object 32 is not shown in FIG. 2). By such contact, heat is quickly transferred from the object 32 to the PTC device 10 via the layered support 14.
- an insulating material layer (for example, a ceramic material layer, a glass epoxy material layer, or a resin layer that can be used in the above-described mold) 20 exists between the PTC element 12 and the layered support 14.
- the layered support 14 is made of a conductive material, it is effective to interpose the insulating material layer in this way.
- the layered support 14 and the insulating material layer 20 are connected by a solder material layer 18, and a silver paste layer 22 exists between the insulating material layer 20 and the PTC element 12. Accordingly, in the illustrated embodiment, the PTC element 12 and the layered support 14 are indirectly connected, and thus indirectly in thermal contact.
- These layers existing between the PTC element 12 and the layered support 14 are both made of a heat conductive material, preferably a good heat conductive material.
- a potting element 24 so as to cover the PTC element 12 disposed on the layered support 14 and the above-described layers (18, 20 and 22).
- one end of a wire 28 is connected to the upper side of the PTC element (that is, one metal electrode of the PTC element), which extends outside through the potting element 24.
- the other end of the wire 28 is connected to the lead 26.
- one end of a wire 28 ' is connected to the lower side of the PTC element (that is, the other metal electrode of the PTC element) via a silver paste layer 22, which extends outward through the potting element 24. Exist.
- the other end of the wire 28 is connected to the lead 26 '.
- the lead 26 'and the wire 28' are not shown in FIG.
- the PTC element 12 arranged on the layered support 14 is molded, and as shown in the figure, the mold resin 16 covers the PTC element 12 and various layers located below the PTC element 12. As shown in the drawing, the mold resin 16 does not cover the other surface 15 ′ of the layered support 14 and is exposed. That is, the PTC device of the present invention in which the PTC element 12 is molded in the resin 16 is obtained.
- the layered support 14 has a screw opening 30 so that the PTC device can be screwed when attached to an object.
- the PTC element 12 is first mounted directly or indirectly on the layered support 14, and thereafter, between the PTC element 12 and the lead 26 and the lead 26 ′. Wires 28 and 28 'are formed by wire bonding. In this state, if necessary, the resin is piled up by potting and cured to form a potting element 24. An assembly in which the PTC element 12 connected to the lead 26 is placed on the layered support 14 is assembled. obtain. Then, the PTC device 10 of the present invention molded in the resin 16 can be obtained by molding the obtained assembly.
- a lead frame in which the layered support 14 and the leads 26 and 26 'are originally integrated is prepared, and after wire bonding is performed and the wires 28 and 28' are connected, as shown in the figure. It is advantageous to separate the layered support and the lead. It is also effective to directly connect the leads 26 and 26 'to the front and back sides of the PTC element without performing wire bonding.
- PTC element A conductive polymer composition containing polyethylene (PE, 46% by weight) and carbon black (54% by weight) was extruded to obtain an extrudate.
- This PTC element is a lead frame (corresponding to a layered support, made of copper / tin alloy with nickel base silver plating (nickel plated on an alloy frame and further silver plated thereon), thickness: 1.3 mm).
- a 5 mm ⁇ 3 mm ceramic insulating substrate (Tn / Ni, thickness 0.6 mm) is soldered as an insulating material layer on the lead frame (Senju Metal M705), and the above PTC element is mounted thereon.
- the paste was hardened by fixing with silver paste (Panasonic DBC130SD) and holding at 150 ° C. for 10 minutes. In this way, as shown in FIG. 1, the PTC element 12 was placed on the layered support 14 via the solder material layer 18, the insulating material layer 20, and the silver paste layer 22 as an adhesive material.
- Epoxy resin epoxy (Epoxy) (Epiform K-8908, manufactured by Somar Co., Ltd.) 24 so as to cover the PTC element 12 and the underlying layer of the obtained assembly
- the epoxy resin was heated at 80 ° C.
- the precursor of the PTC device was obtained by curing in 7 hours and covering the PTC element placed on the layered support and the underlying layer with the potting element 24 as shown in FIG.
- the precursor is attached to the injection mold so that the surface 15 'of the lead frame on which the PTC element is not placed is exposed, and after the molten mold material (epoxy resin, Sumitomo Bakelite, Sumicon EME6200) is injected And temporarily cured at 180 ° C. for 3 minutes.
- the assembly is removed from the mold and deburred, and then the assembly is maintained at 175 ° C. for 8 hours to completely cure the molding material 16 and the PTC device 10 shown in FIG. (Tr) is a device using a PTC element having a 95 ° C. and a device using a PTC element having a trip temperature of 125 ° C.
- Example 1 was repeated except that the potting element was formed using another epoxy resin (Epiform R-2101, manufactured by Somar Co., Ltd.), and then molded, and the PTC of the present invention having the potting element was repeated. A device precursor was obtained. However, a PTC element having Tr of 95 ° C. was used.
- Epiform R-2101 manufactured by Somar Co., Ltd.
- Example 2 was repeated to obtain the precursor of the PTC device of the present invention, except that the potting element was formed using another epoxy resin (SOMAKOTE KZ-106, manufactured by Somaru Corporation). However, a PTC element having Tr of 95 ° C. was used.
- Example 2 was repeated to obtain a precursor of the PTC device of the present invention, except that a potting element was formed using another epoxy resin (SOMAKOTE KZ-107, manufactured by Somaru Corporation). However, a PTC element having Tr of 95 ° C. was used.
- Example 1 was repeated to obtain the PTC device of the present invention except that silicone resin (manufactured by Shin-Etsu Polymer, KE-1867) was used. However, a PTC element having Tr of 95 ° C. was used.
- Example 1 was repeated to obtain the PTC device of the present invention.
- the PTC device of the present invention was obtained without forming the above-described potting element.
- the used PTC element had a Tr of 125 ° C.
- the measurement results are shown in Table 1 and Table 2 below.
- Tg glass transition temperature of the cured resin (except PE)
- T> Tg linear expansion coefficient at a temperature higher than Tg
- T ⁇ Tg linear expansion coefficient at a temperature lower than Tg
- the resistance value at room temperature is very small for any of the PTC devices detected at 95 ° C., as in the case of the PTC element, and is slightly higher than the trip temperature (60).
- the resistance value at (° C.) is not so large, but shows a very large resistance value near the trip temperature, which means that the PTC device of the present invention has appropriate properties as a PTC element.
- the resistance at the time of tripping in Example 6 that was not potted was as low as about half of the resistance at the time of tripping in Example 1 that was potted, and potting was performed. It is speculated that the processing can have a slight effect on the expansion of the PTC element.
- FIG. 3 shows the RT measurement result of the PTC device of the present invention of Example 1 (using a PTC element with Tr of 125 ° C.).
- the RT measurement result of the PTC element itself having a Tr of 125 ° C. and the measurement result of the ceramic PTC element as a comparative example are plotted together.
- FIG. 3 shows that the device of Example 1 of the present invention and the inorganic PTC element of the comparative example (detected at 125 ° C.) had a threshold temperature in the range of about 120 ° C. to 130 ° C. (The temperature at which the resistance of the PTC element suddenly increases in the vicinity of a temperature also called “trip temperature”), and in any case, the resistance value after such a range is at least about 10 6 times or more of the previous resistance value Therefore, it is apparent that both the PTC device and the inorganic PTC element have a switching function as a PTC element. In general, when the resistance value is increased by at least about 10 3 times or more, it may be considered to have a function as a PTC element.
- the PTC device of the present invention when comparing the molded PTC device of the present invention and the inorganic PTC device, the PTC device of the present invention is far more than the inorganic PTC element in terms of the rate of increase in resistance before and after the trip and the sharp increase in resistance. It turns out that it is excellent. That is, the PTC device of the present invention exhibits RT characteristics that are not significantly different from polymer PTC elements, and the characteristics are clearly superior to those of inorganic PTC elements.
- FIG. 4 shows the RT measurement result of the PTC device of Example 5 (using a PTC element with Tr of 95 ° C.).
- the measurement results of the RT measurement results of the PTC element itself with Tr of 95 ° C. are plotted together.
- the PTC element both not PTC device and any alms present invention (Example 5), has a threshold temperature to trip at about 95 ° C., also any increase of about 104 times the resistance value It can be seen that it shows sufficient trip characteristics. That is, even when another potting material such as a silicone resin is used in the device of the present invention, the PTC device of the present invention exhibits RT characteristics that are not significantly different from those of the PTC element. The characteristics are sufficient for use as an element.
- FIG. 5 shows the RT measurement result of the PTC device of Example 6 (using a PTC element with Tr of 125 ° C.).
- FIG. 5 plots together the RT measurement result of the PTC element itself having a Tr of 125 ° C. and the measurement result of the PTC device of the present invention obtained using the same, as in FIG. Yes.
- the PTC device having no potting element of the present invention has a threshold temperature that trips around 125 ° C., similar to Example 1 having the potting element. Further, in Example 6, it is considered that the PTC element expansion is somewhat hindered by having no potting element, and the resistance value at the time of trip is reduced to about 2 to 1/4 compared to Example 1. are but one to rise to about 10 4 times the resistance value even when observed, it can be seen that exhibits sufficient trip characteristic. That is, even when the potting element is omitted, the PTC device of the present invention exhibits an RT characteristic that is not significantly different from that of the PTC element, and the characteristic is sufficient for use as a PTC element.
- the device is fixed with a heat-resistant tape on a hot plate (manufactured by ASONE, EC-1200NP) so that the exposed surface of the layered support of the PTC device is in contact with the hot plate, and a thermocouple (TC-KH- 0.1-1 WP) was attached to the hot plate surface and the exposed surface of the layered support of the device, and the hot plate temperature was raised to 20 ° C. to 160 ° C.
- a thermocouple TC-KH- 0.1-1 WP
- FIG. 7 shows data when an inorganic PTC element (molded ceramic PTC element, manufactured by Murata Manufacturing Co., Ltd., PTFM04BB222Q2N34B0) is similarly heated on a hot plate.
- the PTC device of the present invention reached the trip state in 20 seconds to 25 seconds while the temperature of the hot plate increased from 100 ° C. to 130 ° C. for about 25 seconds. I understand.
- the temperature of the PTC element hardly changed for about 25 seconds when the temperature of the hot plate reached from 100 ° C. to 130 ° C., and 30 seconds passed. Later, the temperature starts to rise gradually, and then it can be seen that it has tripped.
- the PTC device of the present invention reacts to the temperature change of the hot plate to be detected in a very fast time and exhibits a steep increase in resistance as compared with the inorganic PTC element. That is, it can be seen that the PTC device of the present invention can detect the temperature of the object whose temperature is to be detected more quickly and more accurately.
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Abstract
Description
伝熱媒体として機能する層状支持体およびその上に配置したポリマーPTC素子を有して成るPTCデバイスであって、
ポリマーPTC素子は層状支持体の一方の表面上に(熱的に接続された状態で)配置され、これらは、層状支持体の他方の表面が露出するように樹脂内にモールドされている
ことを特徴とするPTCデバイスを提供する。
層状支持体の一方の表面にポリマーPTC素子を配置する工程、ならびに
層状支持体の他方の表面が露出するように、層状支持体およびポリマーPTC素子をモールド成形する工程
を含んで成る。この製造方法によって、上述の本発明のPTCデバイスを製造できる。尚、層状支持体へのポリマーPTC素子の配置は、上述のポリマーPTC素子の層状支持体への接続と同様に、直接的であっても、あるいは間接的であってもよい。
15,15’…主表面、16…モールド樹脂、18…ハンダ材料層、
20…絶縁材料層、22…銀ペースト層、24…ポッティング要素、
26,26’…リード、28,28’…ワイヤ、30…開口部、32…対象物。
PTC素子:ポリエチレン(PE、46重量%)およびカーボンブラック(54重量%)を含む導電性ポリマー組成物を押し出して押出物を得、この両主表面に第1および第2金属電極:Niメッキ銅箔を熱圧着して、2種類のPTC素子を得た。これらのPTC素子のトリップ温度(Tr)は、それぞれ95℃および125℃であった。その後、PTC素子の金属電極を金メッキした(メッキ厚さ:0.03μm以下)。PTC素子のサイズは、Tr=95℃の素子については1.6mm×0.8mm×0.3mm(厚さ)であり、Tr=125℃の素子については3.2mm×2.5mm×0.3mm(厚さ)であった。
上述のようにして得られた種々のPTCデバイスまたはその前駆体について、その周囲の温度を5℃ずつ上昇させ、その温度雰囲気で10分間保持した後、PTCデバイスの抵抗を測定することを繰り返して、PTCデバイスまたはその前駆体の抵抗(R)-温度(T)特性を評価した。測定温度範囲は20℃~160℃とした。
尚、抵抗は、2つのリード間の抵抗値を測定することによって求めた。これらのPCTデバイスおよびその前駆体に加えて、PTC素子自体(ポッティング要素を有さず、また、モールド成形もしていないもの)および比較例としての無機PTC素子(村田製作所製、商品名:ポジスタ、125℃を検知する素子)についても、同様に抵抗を測定した。
実施例1の本発明のPTCデバイス(Tr=125℃のPTC素子を使用)について、デバイスの周辺環境の温度を所定時間的割合で上昇させた場合のPTCデバイスの温度および抵抗値を測定することによって、PTCデバイスの熱反応特性試験を実施した。
Claims (11)
- 伝熱媒体として機能する層状支持体およびその上に配置したポリマーPTC素子を有して成るPTCデバイスであって、
ポリマーPTC素子は層状支持体の一方の表面上に配置され、これらは、層状支持体の他方の表面が露出するように樹脂内にモールドされている
ことを特徴とするPTCデバイス。 - ポリマーPTC素子は層状支持体の一方の表面上に熱的に接続された状態で配置されている請求項1に記載のPTCデバイス。
- PTC素子とモールドしている樹脂との間に、硬化性樹脂により形成したポッティング要素を更に有して成る請求項1または2に記載のPTCデバイス。
- ポッティング要素の線膨張係数は、モールド樹脂の線膨張係数より大きい請求項3に記載のPTCデバイス。
- ポッティング要素の線膨張係数は、3.0×10-5/℃以上であり、また、40.0×10-5/℃以下である請求項3または4に記載のPTCデバイス。
- ポッティング要素の線膨張係数は、30.0×10-5/℃以下である請求項3~5のいずれかに記載のPTCデバイス。
- 層状支持体およびそれに配置されたポリマーPTC素子を有して成るPTCデバイスの製造方法であって、
層状支持体の一方の表面にポリマーPTC素子を配置する工程、ならびに
層状支持体の他方の表面が露出するように、層状支持体およびポリマーPTC素子をモールド成形する工程
を含んで成るPTCデバイスの製造方法。 - 層状支持体へのポリマーPTC素子の配置は、直接的または間接的である請求項7に記載の製造方法。
- モールド成形する前に、層状支持体上に載置されたPTC素子を硬化性樹脂によってポッティングすることによって包囲し、
その後、この硬化性樹脂を硬化してポッティング要素を形成し、
その後、モールド成形する請求項7または8に記載の製造方法。 - ポッティングする硬化性樹脂は、硬化後の線膨張係数が3.0×10-5/℃以上、40.0×10-5/℃以下となる樹脂である請求項9に記載の製造方法。
- 請求項1~6のいずれかに記載のPTCデバイスを有して成る電気装置。
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JP2010536800A JP5736174B2 (ja) | 2008-11-07 | 2009-11-06 | Ptcデバイス |
KR1020117012826A KR101697381B1 (ko) | 2008-11-07 | 2009-11-06 | Ptc 디바이스 |
BRPI0921360A BRPI0921360A2 (pt) | 2008-11-07 | 2009-11-06 | dispositivo de ptc |
RU2011122735/07A RU2518219C2 (ru) | 2008-11-07 | 2009-11-06 | Устройство птк |
US13/128,223 US8723636B2 (en) | 2008-11-07 | 2009-11-06 | PTC device |
EP09824857.8A EP2365492B1 (en) | 2008-11-07 | 2009-11-06 | Ptc device |
CN2009801440701A CN102203883B (zh) | 2008-11-07 | 2009-11-06 | Ptc装置 |
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EP (1) | EP2365492B1 (ja) |
JP (2) | JP5736174B2 (ja) |
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CN (1) | CN102203883B (ja) |
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WO2012002523A1 (ja) * | 2010-07-02 | 2012-01-05 | タイコエレクトロニクスジャパン合同会社 | Ptcデバイスおよびそれを有する2次電池 |
JP2014168105A (ja) * | 2008-11-07 | 2014-09-11 | Tyco Electronics Japan Kk | Ptcデバイス |
WO2015046257A1 (ja) * | 2013-09-26 | 2015-04-02 | タイコエレクトロニクスジャパン合同会社 | 熱変色性インクの変色装置 |
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CN102203883B (zh) | 2013-01-23 |
EP2365492A1 (en) | 2011-09-14 |
RU2518219C2 (ru) | 2014-06-10 |
US20110279220A1 (en) | 2011-11-17 |
JP2014168105A (ja) | 2014-09-11 |
EP2365492A4 (en) | 2018-02-21 |
RU2011122735A (ru) | 2012-12-20 |
JP6159685B2 (ja) | 2017-07-05 |
BRPI0921360A2 (pt) | 2016-07-26 |
KR20110082605A (ko) | 2011-07-19 |
KR101697381B1 (ko) | 2017-01-17 |
JP5736174B2 (ja) | 2015-06-17 |
JPWO2010053158A1 (ja) | 2012-04-05 |
US8723636B2 (en) | 2014-05-13 |
EP2365492B1 (en) | 2019-05-01 |
CN102203883A (zh) | 2011-09-28 |
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