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US3824328A - Encapsulated ptc heater packages - Google Patents

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Publication number
US3824328A
US3824328A US30002272A US3824328A US 3824328 A US3824328 A US 3824328A US 30002272 A US30002272 A US 30002272A US 3824328 A US3824328 A US 3824328A
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Prior art keywords
ptc
material
potting
heater
materials
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Expired - Lifetime
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Y Ting
H Stoeckler
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Texas Instruments Inc
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Texas Instruments Inc
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances

Abstract

Packaged PTC heater elements wherein the package includes an outer material such as a phenolic resin in the form of a casing and an inner potting material which is thermally conductive and electrically insulated and does not deteriorate the PTC material. The potting material is one that does not include nucleophiles such as amines and the like and therefore excludes the epoxy resins. The potting material used is a silicone resin, polyamides, polyimides and ceramics which are not amine initiated. The PTC device can be completely potted in one of the above noted potting materials or a barrier layer of one of the above potting materials can be placed around the PTC material to separate it from an external potting material and then the PTC material with the barrier layer therearound can be potted with the well known epoxy resin.

Description

United States Patent 1 Ting et a1.

[ ENCAPSULATED PTC HEATER PACKAGES [75] Inventors: Youn H. Ting, Attleboro, Mass; 7 Hans Adolf Stoeckler, Pawtucket,

[73] Assignee: Texas Instruments Incorporated,

Dallas, Tex.

[22] Filed: Oct. 24, 1972 [21] App]. No.: 300,022

[52] US. Cl 174/52 PE, 174/52 S, 219/210, 317/234 E, 317/235 Q, 338/22 R, 338/275 [51] Int. Cl. H05k 5/06 [58] Field of Search 219/210, 552; 338/275, 338/22, 23, 24; 174/52 S, 52 PE; 317/234, 235 Q; 336/96; 29/612; 323/20 [56] References Cited UNITED STATES PATENTS 2,829,320 4/1958 Dimond 317/234 3,081,374 3/1963 Burch 174/52 PE 3,210,701 10/1965 Fastner et al. 174/52 PE X 3,214,719 10/1965 Turner 338/22 R 3,242,393 3/1966 Pauli 338/275X 3,251,015 10/1966 Denham 336/96 3,254,282 5/1966 West 174/52 PE X 3,375,774 4/1968 Fujimura. 338/22 R X 3,390,226 6/1968 Beyerlein 174/52 PE [11] 3,824,328 [451 July 16,1974

Primary Examiner-Velodymyr Y. Mayewsky Attorney, Agent, or Firm-John A. Haug; James P. McAndrews; Edward J. Connors, Jr.

[57] ABSTRACT Packaged PTC heater elements wherein the package includes an outer material such as a phenolic resin in the form of a casing and an inner potting material which is thermally conductive and electrically insulated and does not deteriorate the PTC material. The potting material is one that does not include nucleophiles such as amines and the like and therefore excludes the epoxy resins. The potting material used is a silicone resin, polyamides, polyimides and ceramics which are not amine initiated. The PTC device can be completely potted in one of the above noted potting materials or a barrier layer of one of the above potting materials can be placed around the PTC material to separate it'from an external potting material and then the PTC material with the barrier layer therearound can be potted with the well known epoxy resin.

4 Claims, 2 Drawing Figures PATENIED JUL 1 88974 I 1 ENCAPSULATED PTC HEATER PACKAGES The disclosure relates to a packaging for PTC materials, and more specifically, to a potting material for use with doped PTC materials which does not include nuv cleophiles which degrade the PTC material.

In the prior art, epoxy resins have normally been used as potting materials for PTC devices. These potting materials have a tendency to degrade the PTC materials which are normally formed from doped 2arium titanate. The reasonfor this is that the epoxy resins are normally made from secondary amines or acid anhydrides which are nucleophiles and react with chemabsorbed oxygen atoms on the boundaries of the PTC device. These chemabsorbed oxygen atoms act as electron traps. In the event that these electron traps become either neutralized or desorbed from the grain boundaries, the PTC effect is destroyed in the sense that electron traps are no longer available to stop the current flow. In order to eliminate this detrimental effect, it is necessary to look for classes of packaging material's which do not contain nucleophiles.

The degradation takes place in the form of gradual flattening of the PTC resistance-temperature curve. The degradation of the resistance-temperature curve, when the organic polymer, such as the epoxy, acts as a reducing agent, is caused by depletion of the oxygen supply in the grain boundary. In accordance with the present invention, it has been noted that certain potting materials do not cause the above described degradation of the PTC materials and particularly the degradation of the resistance-temperature curve. Briefly, in accordance with the present invention, one embodiment thereof, the prior art epoxy potting materials are replaced by potting materials which do not degrade the PTC heating materials. These include the silicone resin, polyamides, polyimides and ceramics which are not amine initiated. In accordance with the second embodiment of the invention, the PTC material is coated with a barrier of a nondegrading material such as one of the above described potting materials and then the remainder of the package is potted with the well known epoxy material.

It is therefore an' object of this invention to provide a PTC heater package with potting material which does not degrade the surface of the PTC heater.

It is a further object of this invention to provide a PTC heater package using a potting material taken from the class consisting of silicone resins, polyamides, polyimides and ceramics which are not amine initiated.

It is a yet further object of this invention to provide a package for containing a PTC heater material wherein the PTC material is surrounded by a nondestructive barrier layer placed between the heater and an epoxy or other degrading potting material.

The above objects and still further objects of the invention will immediately become apparent to those skilled in the art after consideration of the following preferred embodiments, which are provided by way of example and not by way of limitation, wherein:

Referring first to FIG. 1, there is shown a case 1 which may be metallic or may be made out of a material s'uch as phenolic resin. Positioned within the case 1 is a PTC heater 3 of well known type to which has been secured a pair of lead wires 5 and 7. It is understood that the PTC material has been previously metallized in well known manner so that the leads 5 and 7 can be secured thereto by soldering or the like. The wire 5 includes insulation therearound which extends outwardly out of the case I and the wire 7 includes insulation ll therearound which extends out of the case in the same manner.

In the event that case I is metallic, it is a requirement that the PTC heater 3 be electrically insulated from the case and that the case and potting compound 13 be thermally conductive. The PTC heater 3 is therefore encapsulated inside the phenolic case 1 by using such FIG. 1 is a view in section of a first embodiment of a package in accordance with the present invention a potting or sealing compound 13 which also provides a tight seal around the PTC pill or heater, thus serving as a heat transfer medium. The potting compound 13 therefore also serves as a water-tight seal for the PTC device 3. In accordance with the present invention, the potting compound 13 is free of nucleophiles and is therefore formed from the class of compounds consisting of silicone resins, polyamides, polyimides and ceramics which are not amine initiated and which are capable of forming potted compounds of the type de-' scribed above. Some materials of this type which are well known are Novalac epoxy of Dow Chemical Co. which is a silicone rubber. These materials can be used as base potting materials and do not react with the PTC element, even at elevated temperatures of as high as C. A sealed potting material 15 can be added on the top of the base potting material 13 to provide a better water tight seal.

It can be seen that there is provided a package for a PTC pill or heater material which has the properties of the prior art epoxy and yet does not have any material in contact with the PTC heater which can in any way cause the heater to become degraded.

Referring now to FIG. 2, wherein like character references denote like elements, there is shown a second embodiment of the invention. Again, there is shown the case 1 and PTC heater 3 which is metallized as-in the prior embodiment and which includes leads 5 and 7 attached thereto with insulation 9 and 11 surrounding the leads 5 and 7 respectively. However, in accordance with the present embodiment, a layer of material which does not degrade the PTC material 3 and which is labelled 17 completely surround the PTC element. The entire PTC element 3 with the coating'l7 thereon is then placed into thecase l and the entire device with coating 17 thereon is now potted with a potting material 19. Since the PTC element now has an impervious barrier therearound, the potting material 19 can be the epoxy resins and the like which are specifically excluded in the first embodiment. The impervious or passivating coating 17 can be formed from silicon resins, RTV silicons, polyimides, polyimide-amide, etc. These materials do not degrade the PTC element in accordance with the second embodiment.

It has been found that the degradation of the PTC material by the potting agent is temperature related. It is therefore apparent, that many of the potting compounds which can be used in low temperature applications are not usable in higher temperature applications.

It is therefore intended that this concept also be included in accordance with the present invention.

Though the invention has been described with respect to specific preferred embodiments thereof, many variations and modifications thereof will immediately become apparent to those skilled in the art. It is therefore the intention that the appended claims be intcrpreted as broadly as possible in view of the prior art to I include all such variations and modifications.

What is claimed is:

l. A PTC heater package which comprises:

a. a PTC device,

b. a potting material encapsulating said PTC device, said potting material being taken from the class of potting materials which is free of nucleophiles, said potting material encapsulating said PTC device forms a layer contacting and surrounding said PTC device,

c. a further epoxy resin potting material encapsulates said PTC device and said potting material,

(1. a casing enclosing said PTC device and potting ma- I 4. A PTC heater package as set forth in claim 3,

wherein said PTC device is formed from doped barium titanate.

Claims (3)

  1. 2. A PTC heater package as set forth in claim 1, wherein said PTC device is formed from doped barium titanate.
  2. 3. A PTC heater package as set forth in claim 1, wherein said potting material is taken from the class consisting of silicone resins, polyamides, polyimides and ceramics which are not amine initiated.
  3. 4. A PTC heater package as set forth in claim 3, wherein said PTC device is formed from doped barium titanate.
US3824328A 1972-10-24 1972-10-24 Encapsulated ptc heater packages Expired - Lifetime US3824328A (en)

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Application Number Priority Date Filing Date Title
US3824328A US3824328A (en) 1972-10-24 1972-10-24 Encapsulated ptc heater packages
DK535573A DK147415C (en) 1972-10-24 1973-10-02 Containment of a PTK-heater in a house
NL7313514A NL7313514A (en) 1972-10-24 1973-10-02
JP11223573A JPS547057B2 (en) 1972-10-24 1973-10-05
DE19732351956 DE2351956C2 (en) 1972-10-24 1973-10-16
JP12906980U JPS5834716Y2 (en) 1972-10-24 1980-09-10

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DE (1) DE2351956C2 (en)
DK (1) DK147415C (en)
NL (1) NL7313514A (en)

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940591A (en) * 1974-07-01 1976-02-24 Texas Instruments Incorporated Self-regulating electric heater
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
FR2326103A1 (en) * 1975-09-23 1977-04-22 Philips Nv Self-regulating heating element
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
US4072848A (en) * 1976-07-22 1978-02-07 Thermon Manufacturing Company Electrical heating cable with temperature self-limiting heating elements
US4086467A (en) * 1976-07-19 1978-04-25 Texas Instruments Incorporated Electronic heater for high voltage applications
DE2746342A1 (en) * 1976-10-18 1978-04-27 Rosemount Inc Illegal probe for air values ​​and process for its manufacture
US4091267A (en) * 1976-07-19 1978-05-23 Texas Instruments Incorporated Self-regulating electric heater
US4092487A (en) * 1975-02-11 1978-05-30 Nippondenso Co., Ltd. Resin-sealed electrical device
FR2381434A1 (en) * 1977-02-21 1978-09-15 Philips Nv heating element having a resistance body has positive temperature coefficient
US4178855A (en) * 1978-03-20 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Explosive actuated arming switch device
US4206436A (en) * 1976-08-26 1980-06-03 Westinghouse Electric Corp. Electrical apparatus encapsulated with resin coated filler
US4230754A (en) * 1978-11-07 1980-10-28 Sprague Electric Company Bonding electronic component to molded package
US4315237A (en) * 1978-12-01 1982-02-09 Raychem Corporation PTC Devices comprising oxygen barrier layers
US4352008A (en) * 1979-01-26 1982-09-28 Firma Fritz Eichenauer Electric heating device for heating the interior of a switch cabinet
EP0067681A1 (en) * 1981-06-15 1982-12-22 RAYCHEM CORPORATION (a California corporation) End seal for conductive polymer devices
US4371778A (en) * 1978-09-15 1983-02-01 Siemens Aktiengesellschaft Electric heating device employing PTC heating element for preheating of heating oil
US4541899A (en) * 1979-12-04 1985-09-17 Ngk Insulators, Ltd. Method of heating a solid electrolyte body
US4547659A (en) * 1979-08-17 1985-10-15 Raychem Corporation PTC Heater assembly
US4558510A (en) * 1983-03-31 1985-12-17 Tokyo Shibaura Denki Kabushiki Kaisha Method of producing a semiconductor device
US4673801A (en) * 1979-08-17 1987-06-16 Raychem Corporation PTC heater assembly
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US4823064A (en) * 1987-05-07 1989-04-18 Gte Products Corporation Quick reset motor starting device
US5057030A (en) * 1990-07-02 1991-10-15 Itt Corporation Grommet/seal member for a connector assembly
EP0589602A2 (en) * 1992-09-22 1994-03-30 Simmonds Precision Engine Systems, Inc. Potted electrical components and methods of making the same
US5367282A (en) * 1992-07-21 1994-11-22 Texas Instruments Incorporated Electric motor protector sensor
US5414241A (en) * 1992-05-11 1995-05-09 Sekisui Kaseihin Kogyo Kabushiki Kaisha Heater, a method of manufacturing the same, and an anti-condensation mirror incorporating the same
US5777541A (en) * 1995-08-07 1998-07-07 U.S. Philips Corporation Multiple element PTC resistor
US5802709A (en) * 1995-08-15 1998-09-08 Bourns, Multifuse (Hong Kong), Ltd. Method for manufacturing surface mount conductive polymer devices
US5849129A (en) * 1995-08-15 1998-12-15 Bourns Multifuse (Hong Kong) Ltd. Continuous process and apparatus for manufacturing conductive polymer components
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6025556A (en) * 1996-05-20 2000-02-15 Murata Manufacturing Co., Ltd. Electronic components with resin-coated lead terminals
US6172591B1 (en) 1998-03-05 2001-01-09 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6228287B1 (en) 1998-09-25 2001-05-08 Bourns, Inc. Two-step process for preparing positive temperature coefficient polymer materials
US6236302B1 (en) 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6242997B1 (en) 1998-03-05 2001-06-05 Bourns, Inc. Conductive polymer device and method of manufacturing same
WO2001091138A1 (en) * 2000-05-26 2001-11-29 Epcos Ag Electrical component and method for production thereof
US6380840B1 (en) 1996-05-24 2002-04-30 Heraeus Electro-Nite International N.V. Temperature sensor with measuring resistor
WO2002049047A2 (en) * 2000-12-14 2002-06-20 Epcos Ag Electrical component and method for producing the same
US6429533B1 (en) 1999-11-23 2002-08-06 Bourns Inc. Conductive polymer device and method of manufacturing same
US20040026106A1 (en) * 2000-08-30 2004-02-12 Roland Peinsipp Electrical component and method for production thereof
EP1666286A1 (en) * 2004-12-02 2006-06-07 Delphi Technologies Inc. Heating device
US20060152330A1 (en) * 2005-01-12 2006-07-13 Jong-Sung Kang PTC current limiting device having molding part made of insulating material
US20090128276A1 (en) * 2007-11-19 2009-05-21 John Horowy Light weight reworkable inductor
US20120026659A1 (en) * 2010-07-30 2012-02-02 Joinset Co., Ltd. Ceramic chip assembly

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FR2443125B1 (en) * 1978-12-01 1985-02-08 Raychem Corp
DE2948592C2 (en) * 1979-12-03 1990-05-10 Fritz Eichenauer Gmbh & Co Kg, 6744 Kandel, De
JPH0448701A (en) * 1990-06-15 1992-02-18 Daito Tsushinki Kk Self-reset type overcurrent protection element
JPH04298002A (en) * 1991-03-27 1992-10-21 Taiyo Yuden Co Ltd Resin-sealed thermistor
JPH0677204U (en) 1993-03-30 1994-10-28 株式会社村田製作所 Thermistor devices
JP5736174B2 (en) * 2008-11-07 2015-06-17 タイコエレクトロニクスジャパン合同会社 Ptc device
DE102010042978A1 (en) * 2010-10-27 2012-05-16 Continental Automotive Gmbh Method for manufacturing nozzle device of windscreen washing system for motor car, involves assigning sub-casting processes to respective chambers for casting chambers by thermally conductive casting material
EP3115759A4 (en) * 2014-03-07 2017-03-29 Shibaura Electronics Co Ltd Temperature sensor and temperature sensor manufacturing method

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Cited By (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001655A (en) * 1974-01-10 1977-01-04 P. R. Mallory & Co., Inc. Compressible intermediate layer for encapsulated electrical devices
US3940591A (en) * 1974-07-01 1976-02-24 Texas Instruments Incorporated Self-regulating electric heater
US4092487A (en) * 1975-02-11 1978-05-30 Nippondenso Co., Ltd. Resin-sealed electrical device
US4104509A (en) * 1975-09-23 1978-08-01 U.S. Philips Corporation Self-regulating heating element
FR2326103A1 (en) * 1975-09-23 1977-04-22 Philips Nv Self-regulating heating element
US4039904A (en) * 1976-01-02 1977-08-02 P. R. Mallory & Co., Inc. Intermediate precoat layer of resin material for stabilizing encapsulated electric devices
US4086467A (en) * 1976-07-19 1978-04-25 Texas Instruments Incorporated Electronic heater for high voltage applications
US4091267A (en) * 1976-07-19 1978-05-23 Texas Instruments Incorporated Self-regulating electric heater
US4072848A (en) * 1976-07-22 1978-02-07 Thermon Manufacturing Company Electrical heating cable with temperature self-limiting heating elements
US4206436A (en) * 1976-08-26 1980-06-03 Westinghouse Electric Corp. Electrical apparatus encapsulated with resin coated filler
US4121088A (en) * 1976-10-18 1978-10-17 Rosemount Inc. Electrically heated air data sensing device
DE2746342A1 (en) * 1976-10-18 1978-04-27 Rosemount Inc Illegal probe for air values ​​and process for its manufacture
FR2381434A1 (en) * 1977-02-21 1978-09-15 Philips Nv heating element having a resistance body has positive temperature coefficient
US4210800A (en) * 1977-02-21 1980-07-01 U.S. Philips Corporation Heating element comprising a PTC-resistor body
US4178855A (en) * 1978-03-20 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Explosive actuated arming switch device
US4371778A (en) * 1978-09-15 1983-02-01 Siemens Aktiengesellschaft Electric heating device employing PTC heating element for preheating of heating oil
US4230754A (en) * 1978-11-07 1980-10-28 Sprague Electric Company Bonding electronic component to molded package
US4315237A (en) * 1978-12-01 1982-02-09 Raychem Corporation PTC Devices comprising oxygen barrier layers
US4352008A (en) * 1979-01-26 1982-09-28 Firma Fritz Eichenauer Electric heating device for heating the interior of a switch cabinet
US4673801A (en) * 1979-08-17 1987-06-16 Raychem Corporation PTC heater assembly
US4547659A (en) * 1979-08-17 1985-10-15 Raychem Corporation PTC Heater assembly
US4541899A (en) * 1979-12-04 1985-09-17 Ngk Insulators, Ltd. Method of heating a solid electrolyte body
EP0067681A1 (en) * 1981-06-15 1982-12-22 RAYCHEM CORPORATION (a California corporation) End seal for conductive polymer devices
US4558510A (en) * 1983-03-31 1985-12-17 Tokyo Shibaura Denki Kabushiki Kaisha Method of producing a semiconductor device
US4823064A (en) * 1987-05-07 1989-04-18 Gte Products Corporation Quick reset motor starting device
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US5057030A (en) * 1990-07-02 1991-10-15 Itt Corporation Grommet/seal member for a connector assembly
US5414241A (en) * 1992-05-11 1995-05-09 Sekisui Kaseihin Kogyo Kabushiki Kaisha Heater, a method of manufacturing the same, and an anti-condensation mirror incorporating the same
US5367282A (en) * 1992-07-21 1994-11-22 Texas Instruments Incorporated Electric motor protector sensor
EP0589602A2 (en) * 1992-09-22 1994-03-30 Simmonds Precision Engine Systems, Inc. Potted electrical components and methods of making the same
US5525644A (en) * 1992-09-22 1996-06-11 Simmonds Precision Engine Systems Potted electrical components and methods of making the same
EP0589602A3 (en) * 1992-09-22 1994-07-13 Simmonds Precision Engine Syst Potted electrical components and methods of making the same
US5777541A (en) * 1995-08-07 1998-07-07 U.S. Philips Corporation Multiple element PTC resistor
US5849129A (en) * 1995-08-15 1998-12-15 Bourns Multifuse (Hong Kong) Ltd. Continuous process and apparatus for manufacturing conductive polymer components
US5802709A (en) * 1995-08-15 1998-09-08 Bourns, Multifuse (Hong Kong), Ltd. Method for manufacturing surface mount conductive polymer devices
US5849137A (en) * 1995-08-15 1998-12-15 Bourns Multifuse (Hong Kong) Ltd. Continuous process and apparatus for manufacturing conductive polymer components
US6025556A (en) * 1996-05-20 2000-02-15 Murata Manufacturing Co., Ltd. Electronic components with resin-coated lead terminals
US6380840B1 (en) 1996-05-24 2002-04-30 Heraeus Electro-Nite International N.V. Temperature sensor with measuring resistor
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6223423B1 (en) 1997-09-03 2001-05-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficient device
US6236302B1 (en) 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
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Also Published As

Publication number Publication date Type
JPS4976134A (en) 1974-07-23 application
DK147415B (en) 1984-07-23 grant
JPS5652887U (en) 1981-05-09 application
NL7313514A (en) 1974-04-26 application
DK147415C (en) 1985-02-04 grant
DE2351956A1 (en) 1974-04-25 application
JPS5834716Y2 (en) 1983-08-04 grant
JPS547057B2 (en) 1979-04-03 grant
DE2351956C2 (en) 1982-12-30 grant

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