JP4542324B2 - 研磨状態監視装置及びポリッシング装置 - Google Patents

研磨状態監視装置及びポリッシング装置 Download PDF

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Publication number
JP4542324B2
JP4542324B2 JP2003321639A JP2003321639A JP4542324B2 JP 4542324 B2 JP4542324 B2 JP 4542324B2 JP 2003321639 A JP2003321639 A JP 2003321639A JP 2003321639 A JP2003321639 A JP 2003321639A JP 4542324 B2 JP4542324 B2 JP 4542324B2
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Japan
Prior art keywords
polishing
light
polished
light receiving
sampling
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Expired - Lifetime
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JP2003321639A
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English (en)
Japanese (ja)
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JP2004154928A5 (enExample
JP2004154928A (ja
Inventor
洋一 小林
俊輔 中井
仁志 辻
康郎 佃
潤喜 石本
和也 新屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Shimadzu Corp
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Ebara Corp
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp, Shimadzu Corp filed Critical Ebara Corp
Priority to JP2003321639A priority Critical patent/JP4542324B2/ja
Priority to PCT/JP2003/013171 priority patent/WO2004035265A1/en
Priority to CN 200910133188 priority patent/CN101530983B/zh
Priority to KR1020057004531A priority patent/KR101011425B1/ko
Priority to US10/526,933 priority patent/US7252575B2/en
Priority to EP03758725.0A priority patent/EP1551593B1/en
Priority to TW092128804A priority patent/TWI336279B/zh
Publication of JP2004154928A publication Critical patent/JP2004154928A/ja
Publication of JP2004154928A5 publication Critical patent/JP2004154928A5/ja
Priority to US11/819,453 priority patent/US7438627B2/en
Priority to US12/230,317 priority patent/US7645181B2/en
Priority to US12/627,333 priority patent/US8342907B2/en
Application granted granted Critical
Publication of JP4542324B2 publication Critical patent/JP4542324B2/ja
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2003321639A 2002-10-17 2003-09-12 研磨状態監視装置及びポリッシング装置 Expired - Lifetime JP4542324B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2003321639A JP4542324B2 (ja) 2002-10-17 2003-09-12 研磨状態監視装置及びポリッシング装置
CN 200910133188 CN101530983B (zh) 2002-10-17 2003-10-15 抛光状态监测装置和抛光装置以及方法
KR1020057004531A KR101011425B1 (ko) 2002-10-17 2003-10-15 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법
US10/526,933 US7252575B2 (en) 2002-10-17 2003-10-15 Polishing state monitoring apparatus and polishing apparatus and method
EP03758725.0A EP1551593B1 (en) 2002-10-17 2003-10-15 Polishing state monitoring apparatus and polishing apparatus and method
PCT/JP2003/013171 WO2004035265A1 (en) 2002-10-17 2003-10-15 Polishing state monitoring apparatus and polishing apparatus and method
TW092128804A TWI336279B (en) 2002-10-17 2003-10-17 Polishing state monitoring apparatus and polishing apparatus and method
US11/819,453 US7438627B2 (en) 2002-10-17 2007-06-27 Polishing state monitoring method
US12/230,317 US7645181B2 (en) 2002-10-17 2008-08-27 Polishing state monitoring apparatus and polishing apparatus
US12/627,333 US8342907B2 (en) 2002-10-17 2009-11-30 Polishing state monitoring method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002303628 2002-10-17
JP2003321639A JP4542324B2 (ja) 2002-10-17 2003-09-12 研磨状態監視装置及びポリッシング装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2009172232A Division JP2009233853A (ja) 2002-10-17 2009-07-23 ポリッシング装置及び研磨方法
JP2009172231A Division JP5137910B2 (ja) 2002-10-17 2009-07-23 ポリッシング装置及び研磨方法

Publications (3)

Publication Number Publication Date
JP2004154928A JP2004154928A (ja) 2004-06-03
JP2004154928A5 JP2004154928A5 (enExample) 2006-04-20
JP4542324B2 true JP4542324B2 (ja) 2010-09-15

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Country Link
US (4) US7252575B2 (enExample)
EP (1) EP1551593B1 (enExample)
JP (1) JP4542324B2 (enExample)
KR (1) KR101011425B1 (enExample)
TW (1) TWI336279B (enExample)
WO (1) WO2004035265A1 (enExample)

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US20100075576A1 (en) 2010-03-25
EP1551593B1 (en) 2013-08-14
US7438627B2 (en) 2008-10-21
TWI336279B (en) 2011-01-21
JP2004154928A (ja) 2004-06-03
KR20050050106A (ko) 2005-05-27
KR101011425B1 (ko) 2011-01-28
US20060166606A1 (en) 2006-07-27
TW200407528A (en) 2004-05-16
WO2004035265A1 (en) 2004-04-29
US7252575B2 (en) 2007-08-07
EP1551593A1 (en) 2005-07-13
US7645181B2 (en) 2010-01-12
US20090011680A1 (en) 2009-01-08
US8342907B2 (en) 2013-01-01
US20070254557A1 (en) 2007-11-01

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