KR101011425B1 - 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법 - Google Patents

폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법 Download PDF

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Publication number
KR101011425B1
KR101011425B1 KR1020057004531A KR20057004531A KR101011425B1 KR 101011425 B1 KR101011425 B1 KR 101011425B1 KR 1020057004531 A KR1020057004531 A KR 1020057004531A KR 20057004531 A KR20057004531 A KR 20057004531A KR 101011425 B1 KR101011425 B1 KR 101011425B1
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South Korea
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light
polishing
workpiece
spectral data
unit
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KR1020057004531A
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Korean (ko)
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KR20050050106A (ko
Inventor
요이치 고바야시
šœ스케 나카이
히토시 츠지
야스오 츠쿠다
준키 이시모토
가즈나리 신야
Original Assignee
가부시키가이샤 시마즈세이사꾸쇼
가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020057004531A 2002-10-17 2003-10-15 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법 Expired - Lifetime KR101011425B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00303628 2002-10-17
JP2002303628 2002-10-17
JPJP-P-2003-00321639 2003-09-12
JP2003321639A JP4542324B2 (ja) 2002-10-17 2003-09-12 研磨状態監視装置及びポリッシング装置

Publications (2)

Publication Number Publication Date
KR20050050106A KR20050050106A (ko) 2005-05-27
KR101011425B1 true KR101011425B1 (ko) 2011-01-28

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KR1020057004531A Expired - Lifetime KR101011425B1 (ko) 2002-10-17 2003-10-15 폴리싱 상태 모니터링 장치와 폴리싱 장치 및 방법

Country Status (6)

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US (4) US7252575B2 (enExample)
EP (1) EP1551593B1 (enExample)
JP (1) JP4542324B2 (enExample)
KR (1) KR101011425B1 (enExample)
TW (1) TWI336279B (enExample)
WO (1) WO2004035265A1 (enExample)

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CN115308140A (zh) * 2022-10-11 2022-11-08 杭州众硅电子科技有限公司 一种化学机械抛光的在线监测装置
JP2024117029A (ja) * 2023-02-16 2024-08-28 株式会社東京精密 研磨終点検出装置及び方法並びにｃｍｐ装置
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