TWI336279B - Polishing state monitoring apparatus and polishing apparatus and method - Google Patents

Polishing state monitoring apparatus and polishing apparatus and method Download PDF

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Publication number
TWI336279B
TWI336279B TW092128804A TW92128804A TWI336279B TW I336279 B TWI336279 B TW I336279B TW 092128804 A TW092128804 A TW 092128804A TW 92128804 A TW92128804 A TW 92128804A TW I336279 B TWI336279 B TW I336279B
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TW
Taiwan
Prior art keywords
light
polishing
workpiece
unit
sampling
Prior art date
Application number
TW092128804A
Other languages
English (en)
Chinese (zh)
Other versions
TW200407528A (en
Inventor
Yoichi Kobayashi
Shunsuke Nakai
Hitoshi Tsuji
Yasuo Tsukuda
Junki Ishimoto
Kazunari Shinya
Original Assignee
Ebara Corp
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Shimadzu Corp filed Critical Ebara Corp
Publication of TW200407528A publication Critical patent/TW200407528A/zh
Application granted granted Critical
Publication of TWI336279B publication Critical patent/TWI336279B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H10P74/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW092128804A 2002-10-17 2003-10-17 Polishing state monitoring apparatus and polishing apparatus and method TWI336279B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002303628 2002-10-17
JP2003321639A JP4542324B2 (ja) 2002-10-17 2003-09-12 研磨状態監視装置及びポリッシング装置

Publications (2)

Publication Number Publication Date
TW200407528A TW200407528A (en) 2004-05-16
TWI336279B true TWI336279B (en) 2011-01-21

Family

ID=32109475

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128804A TWI336279B (en) 2002-10-17 2003-10-17 Polishing state monitoring apparatus and polishing apparatus and method

Country Status (6)

Country Link
US (4) US7252575B2 (enExample)
EP (1) EP1551593B1 (enExample)
JP (1) JP4542324B2 (enExample)
KR (1) KR101011425B1 (enExample)
TW (1) TWI336279B (enExample)
WO (1) WO2004035265A1 (enExample)

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* Cited by examiner, † Cited by third party
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TWI468256B (enExample) * 2012-03-14 2015-01-11
TWI793138B (zh) * 2017-07-24 2023-02-21 日商荏原製作所股份有限公司 基板研磨裝置及方法
TWI848130B (zh) * 2019-06-27 2024-07-11 日商荏原製作所股份有限公司 決定光學式膜厚測定裝置最適合作動方案之方法、裝置、及系統

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TWI793138B (zh) * 2017-07-24 2023-02-21 日商荏原製作所股份有限公司 基板研磨裝置及方法
TWI848130B (zh) * 2019-06-27 2024-07-11 日商荏原製作所股份有限公司 決定光學式膜厚測定裝置最適合作動方案之方法、裝置、及系統

Also Published As

Publication number Publication date
US20090011680A1 (en) 2009-01-08
KR101011425B1 (ko) 2011-01-28
US7438627B2 (en) 2008-10-21
TW200407528A (en) 2004-05-16
WO2004035265A1 (en) 2004-04-29
JP2004154928A (ja) 2004-06-03
US20100075576A1 (en) 2010-03-25
EP1551593A1 (en) 2005-07-13
US20070254557A1 (en) 2007-11-01
US7252575B2 (en) 2007-08-07
EP1551593B1 (en) 2013-08-14
US20060166606A1 (en) 2006-07-27
JP4542324B2 (ja) 2010-09-15
US7645181B2 (en) 2010-01-12
KR20050050106A (ko) 2005-05-27
US8342907B2 (en) 2013-01-01

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