|
JP2005203729A
(ja)
*
|
2003-12-19 |
2005-07-28 |
Ebara Corp |
基板研磨装置
|
|
JP4581427B2
(ja)
*
|
2004-02-27 |
2010-11-17 |
富士電機システムズ株式会社 |
膜厚評価方法、研磨終点検出方法
|
|
TWI352645B
(en)
|
2004-05-28 |
2011-11-21 |
Ebara Corp |
Apparatus for inspecting and polishing substrate r
|
|
KR101521414B1
(ko)
*
|
2005-08-22 |
2015-05-19 |
어플라이드 머티어리얼스, 인코포레이티드 |
화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
|
|
US8392012B2
(en)
|
2008-10-27 |
2013-03-05 |
Applied Materials, Inc. |
Multiple libraries for spectrographic monitoring of zones of a substrate during processing
|
|
US7406394B2
(en)
|
2005-08-22 |
2008-07-29 |
Applied Materials, Inc. |
Spectra based endpointing for chemical mechanical polishing
|
|
JP5534672B2
(ja)
*
|
2005-08-22 |
2014-07-02 |
アプライド マテリアルズ インコーポレイテッド |
化学機械的研磨のスペクトルに基づく監視のための装置および方法
|
|
US7764377B2
(en)
|
2005-08-22 |
2010-07-27 |
Applied Materials, Inc. |
Spectrum based endpointing for chemical mechanical polishing
|
|
US8260446B2
(en)
|
2005-08-22 |
2012-09-04 |
Applied Materials, Inc. |
Spectrographic monitoring of a substrate during processing using index values
|
|
US7409260B2
(en)
|
2005-08-22 |
2008-08-05 |
Applied Materials, Inc. |
Substrate thickness measuring during polishing
|
|
JP2007067179A
(ja)
*
|
2005-08-31 |
2007-03-15 |
Shin Etsu Handotai Co Ltd |
半導体ウエーハの鏡面研磨方法及び鏡面研磨システム
|
|
US7636611B2
(en)
*
|
2005-10-28 |
2009-12-22 |
Samsung Austin Semiconductor, L.P. |
Fuzzy logic system for process control in chemical mechanical polishing
|
|
KR101381341B1
(ko)
|
2006-10-06 |
2014-04-04 |
가부시끼가이샤 도시바 |
가공 종점 검지방법, 연마방법 및 연마장치
|
|
US7998358B2
(en)
|
2006-10-31 |
2011-08-16 |
Applied Materials, Inc. |
Peak-based endpointing for chemical mechanical polishing
|
|
US7444198B2
(en)
|
2006-12-15 |
2008-10-28 |
Applied Materials, Inc. |
Determining physical property of substrate
|
|
JP2008186873A
(ja)
*
|
2007-01-26 |
2008-08-14 |
Tokyo Seimitsu Co Ltd |
Cmp装置の段差解消終点検知装置及び段差解消終点検知方法
|
|
KR101678082B1
(ko)
|
2007-02-23 |
2016-11-21 |
어플라이드 머티어리얼스, 인코포레이티드 |
연마 엔드포인트들을 결정하기 위한 스펙트럼 사용
|
|
US7952708B2
(en)
|
2007-04-02 |
2011-05-31 |
Applied Materials, Inc. |
High throughput measurement system
|
|
JP5112007B2
(ja)
|
2007-10-31 |
2013-01-09 |
株式会社荏原製作所 |
研磨装置および研磨方法
|
|
JP2009129970A
(ja)
|
2007-11-20 |
2009-06-11 |
Ebara Corp |
研磨装置及び研磨方法
|
|
US20090275265A1
(en)
*
|
2008-05-02 |
2009-11-05 |
Applied Materials, Inc. |
Endpoint detection in chemical mechanical polishing using multiple spectra
|
|
JP5254668B2
(ja)
*
|
2008-06-03 |
2013-08-07 |
株式会社荏原製作所 |
研磨終点検出方法
|
|
JP4739393B2
(ja)
*
|
2008-11-11 |
2011-08-03 |
株式会社荏原製作所 |
研磨終点検知用の光の波長選択に用いられるダイヤグラムの作成方法、光の波長選択方法、研磨終点検出方法、研磨終点検出装置、および研磨装置
|
|
JP5436969B2
(ja)
*
|
2009-05-27 |
2014-03-05 |
株式会社荏原製作所 |
研磨終点検知方法、研磨終点検知装置、研磨方法、および研磨装置
|
|
US8388408B2
(en)
|
2008-10-10 |
2013-03-05 |
Ebara Corporation |
Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method
|
|
US20100103422A1
(en)
*
|
2008-10-27 |
2010-04-29 |
Applied Materials, Inc. |
Goodness of fit in spectrographic monitoring of a substrate during processing
|
|
WO2010062497A2
(en)
*
|
2008-10-27 |
2010-06-03 |
Applied Materials, Inc. |
Goodness of fit in spectrographic monitoring of a substrate during processing
|
|
US20100114532A1
(en)
*
|
2008-11-03 |
2010-05-06 |
Applied Materials, Inc. |
Weighted spectrographic monitoring of a substrate during processing
|
|
US8989890B2
(en)
*
|
2008-11-07 |
2015-03-24 |
Applied Materials, Inc. |
GST film thickness monitoring
|
|
US8352061B2
(en)
|
2008-11-14 |
2013-01-08 |
Applied Materials, Inc. |
Semi-quantitative thickness determination
|
|
KR20110120893A
(ko)
*
|
2009-01-16 |
2011-11-04 |
어플라이드 머티어리얼스, 인코포레이티드 |
윈도우 지지부를 가지는 폴리싱 패드 및 시스템
|
|
JP5348530B2
(ja)
*
|
2009-01-21 |
2013-11-20 |
株式会社ニコン |
研磨装置および研磨方法
|
|
US8392009B2
(en)
*
|
2009-03-31 |
2013-03-05 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Advanced process control with novel sampling policy
|
|
US8157614B2
(en)
*
|
2009-04-30 |
2012-04-17 |
Applied Materials, Inc. |
Method of making and apparatus having windowless polishing pad and protected fiber
|
|
CN101927453B
(zh)
*
|
2009-06-20 |
2015-05-06 |
无锡华润上华半导体有限公司 |
浅沟槽隔离结构的研磨装置
|
|
KR101170760B1
(ko)
*
|
2009-07-24 |
2012-08-03 |
세메스 주식회사 |
기판 연마 장치
|
|
JP5583946B2
(ja)
|
2009-10-06 |
2014-09-03 |
株式会社荏原製作所 |
研磨終点検知方法および研磨終点検知装置
|
|
WO2011056485A2
(en)
*
|
2009-11-03 |
2011-05-12 |
Applied Materials, Inc. |
Endpoint method using peak location of spectra contour plots versus time
|
|
EP2513955A1
(en)
|
2009-12-15 |
2012-10-24 |
Osaka University |
Polishing method, polishing apparatus and polishing tool
|
|
US8581707B2
(en)
*
|
2009-12-16 |
2013-11-12 |
Pyramid Meriden Inc. |
Methods and apparatus for identifying and categorizing distributed devices
|
|
JP5728239B2
(ja)
|
2010-03-02 |
2015-06-03 |
株式会社荏原製作所 |
研磨監視方法、研磨方法、研磨監視装置、および研磨装置
|
|
WO2011139571A2
(en)
*
|
2010-05-05 |
2011-11-10 |
Applied Materials, Inc. |
Dynamically or adaptively tracking spectrum features for endpoint detection
|
|
US8834229B2
(en)
*
|
2010-05-05 |
2014-09-16 |
Applied Materials, Inc. |
Dynamically tracking spectrum features for endpoint detection
|
|
JP5612945B2
(ja)
|
2010-07-23 |
2014-10-22 |
株式会社荏原製作所 |
基板の研磨の進捗を監視する方法および研磨装置
|
|
US8954186B2
(en)
|
2010-07-30 |
2015-02-10 |
Applied Materials, Inc. |
Selecting reference libraries for monitoring of multiple zones on a substrate
|
|
US20110032225A1
(en)
*
|
2010-10-05 |
2011-02-10 |
Phu Dang |
Systems, methods, and articles for manufacture for the intelligent control of decorative bodies
|
|
JP5980476B2
(ja)
|
2010-12-27 |
2016-08-31 |
株式会社荏原製作所 |
ポリッシング装置およびポリッシング方法
|
|
US8547538B2
(en)
|
2011-04-21 |
2013-10-01 |
Applied Materials, Inc. |
Construction of reference spectra with variations in environmental effects
|
|
US8657646B2
(en)
*
|
2011-05-09 |
2014-02-25 |
Applied Materials, Inc. |
Endpoint detection using spectrum feature trajectories
|
|
JP6005467B2
(ja)
|
2011-10-26 |
2016-10-12 |
株式会社荏原製作所 |
研磨方法および研磨装置
|
|
US9744081B2
(en)
*
|
2012-03-05 |
2017-08-29 |
Robbin Field Riordan |
Tampon with looped string
|
|
KR101892914B1
(ko)
*
|
2012-03-08 |
2018-08-29 |
어플라이드 머티어리얼스, 인코포레이티드 |
측정된 스펙트럼에 대한 광학 모델의 피팅
|
|
TW201336622A
(zh)
*
|
2012-03-14 |
2013-09-16 |
Hsiu Fong Machinery Co Ltd |
彈性拋光載具及應用其的拋光裝置及拋光方法
|
|
JP2013219248A
(ja)
|
2012-04-10 |
2013-10-24 |
Ebara Corp |
研磨装置および研磨方法
|
|
US9011202B2
(en)
*
|
2012-04-25 |
2015-04-21 |
Applied Materials, Inc. |
Fitting of optical model with diffraction effects to measured spectrum
|
|
US20140024293A1
(en)
*
|
2012-07-19 |
2014-01-23 |
Jimin Zhang |
Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
|
|
US20140120802A1
(en)
*
|
2012-10-31 |
2014-05-01 |
Wayne O. Duescher |
Abrasive platen wafer surface optical monitoring system
|
|
JP6105371B2
(ja)
|
2013-04-25 |
2017-03-29 |
株式会社荏原製作所 |
研磨方法および研磨装置
|
|
JP6215602B2
(ja)
*
|
2013-07-11 |
2017-10-18 |
株式会社荏原製作所 |
研磨装置および研磨状態監視方法
|
|
TWI635929B
(zh)
|
2013-07-11 |
2018-09-21 |
日商荏原製作所股份有限公司 |
研磨裝置及研磨狀態監視方法
|
|
JP6275421B2
(ja)
*
|
2013-09-06 |
2018-02-07 |
株式会社荏原製作所 |
研磨方法および研磨装置
|
|
US9375824B2
(en)
|
2013-11-27 |
2016-06-28 |
Applied Materials, Inc. |
Adjustment of polishing rates during substrate polishing with predictive filters
|
|
KR101539208B1
(ko)
*
|
2013-12-02 |
2015-07-24 |
주식회사 케이씨텍 |
화학 기계적 연마 시스템의 웨이퍼 막두께 모니터링 장치 및 방법
|
|
JP6293519B2
(ja)
*
|
2014-03-05 |
2018-03-14 |
株式会社荏原製作所 |
研磨装置および研磨方法
|
|
JP6423600B2
(ja)
|
2014-03-12 |
2018-11-14 |
株式会社荏原製作所 |
膜厚測定装置、及び、研磨装置
|
|
US9425109B2
(en)
*
|
2014-05-30 |
2016-08-23 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Planarization method, method for polishing wafer, and CMP system
|
|
JP6475604B2
(ja)
*
|
2015-11-24 |
2019-02-27 |
株式会社荏原製作所 |
研磨方法
|
|
JP2018001296A
(ja)
*
|
2016-06-28 |
2018-01-11 |
株式会社荏原製作所 |
研磨装置、研磨方法、及び研磨制御プログラム
|
|
TWI784719B
(zh)
|
2016-08-26 |
2022-11-21 |
美商應用材料股份有限公司 |
獲得代表在基板上的層的厚度的測量的方法,及量測系統和電腦程式產品
|
|
JP6920849B2
(ja)
*
|
2017-03-27 |
2021-08-18 |
株式会社荏原製作所 |
基板処理方法および装置
|
|
JP7023062B2
(ja)
|
2017-07-24 |
2022-02-21 |
株式会社荏原製作所 |
基板研磨装置及び方法
|
|
JP6847811B2
(ja)
*
|
2017-10-24 |
2021-03-24 |
株式会社荏原製作所 |
研磨方法および研磨装置
|
|
JP7068831B2
(ja)
*
|
2018-01-18 |
2022-05-17 |
株式会社荏原製作所 |
研磨装置
|
|
JP7265885B2
(ja)
*
|
2019-02-27 |
2023-04-27 |
株式会社荏原製作所 |
研磨装置、研磨方法、プログラムを格納した記憶媒体
|
|
JP7253458B2
(ja)
*
|
2019-06-27 |
2023-04-06 |
株式会社荏原製作所 |
光学式膜厚測定装置の最適な動作レシピを決定する方法、装置、およびシステム
|
|
JP7464412B2
(ja)
*
|
2020-03-09 |
2024-04-09 |
株式会社東京精密 |
加工装置
|
|
US12288724B2
(en)
|
2021-03-04 |
2025-04-29 |
Applied Materials, Inc. |
Region classification of film non-uniformity based on processing of substrate images
|
|
JP2023148801A
(ja)
*
|
2022-03-30 |
2023-10-13 |
株式会社東京精密 |
研磨終点検出装置及びcmp装置
|
|
CN115308140A
(zh)
*
|
2022-10-11 |
2022-11-08 |
杭州众硅电子科技有限公司 |
一种化学机械抛光的在线监测装置
|
|
JP2024117029A
(ja)
*
|
2023-02-16 |
2024-08-28 |
株式会社東京精密 |
研磨終点検出装置及び方法並びにcmp装置
|
|
CN120388965B
(zh)
*
|
2025-03-18 |
2025-11-21 |
中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) |
晶圆的测试结构、测试晶圆和测试晶圆的制备方法
|