JP4541571B2 - 半導体製造装置 - Google Patents

半導体製造装置 Download PDF

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Publication number
JP4541571B2
JP4541571B2 JP2001014209A JP2001014209A JP4541571B2 JP 4541571 B2 JP4541571 B2 JP 4541571B2 JP 2001014209 A JP2001014209 A JP 2001014209A JP 2001014209 A JP2001014209 A JP 2001014209A JP 4541571 B2 JP4541571 B2 JP 4541571B2
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JP
Japan
Prior art keywords
lamp
light source
lighting device
unit
starter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001014209A
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English (en)
Japanese (ja)
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JP2002217093A5 (enExample
JP2002217093A (ja
Inventor
元 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2001014209A priority Critical patent/JP4541571B2/ja
Priority to US10/044,937 priority patent/US6810299B2/en
Publication of JP2002217093A publication Critical patent/JP2002217093A/ja
Publication of JP2002217093A5 publication Critical patent/JP2002217093A5/ja
Application granted granted Critical
Publication of JP4541571B2 publication Critical patent/JP4541571B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70016—Production of exposure light, i.e. light sources by discharge lamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G03F7/70175—Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2001014209A 2001-01-23 2001-01-23 半導体製造装置 Expired - Fee Related JP4541571B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001014209A JP4541571B2 (ja) 2001-01-23 2001-01-23 半導体製造装置
US10/044,937 US6810299B2 (en) 2001-01-23 2002-01-15 Semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001014209A JP4541571B2 (ja) 2001-01-23 2001-01-23 半導体製造装置

Publications (3)

Publication Number Publication Date
JP2002217093A JP2002217093A (ja) 2002-08-02
JP2002217093A5 JP2002217093A5 (enExample) 2008-03-06
JP4541571B2 true JP4541571B2 (ja) 2010-09-08

Family

ID=18880937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001014209A Expired - Fee Related JP4541571B2 (ja) 2001-01-23 2001-01-23 半導体製造装置

Country Status (2)

Country Link
US (1) US6810299B2 (enExample)
JP (1) JP4541571B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9785140B2 (en) * 2000-02-01 2017-10-10 Peer Intellectual Property Inc. Multi-protocol multi-client equipment server
JP2003162901A (ja) * 2001-11-27 2003-06-06 Fujitsu Display Technologies Corp バックライトおよび液晶表示装置
JP2004158510A (ja) * 2002-11-01 2004-06-03 Canon Inc デバイス製造装置
US7253383B2 (en) * 2002-12-03 2007-08-07 Samsung Electronics Co., Ltd. Transformer assembly for microwave oven, method for manufacturing the same, and microwave oven having the same
JP2004283484A (ja) * 2003-03-25 2004-10-14 Pentax Corp 内視鏡用光源装置
JP4560518B2 (ja) * 2003-11-07 2010-10-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 放電灯用のスタータハウジング、及びそれを取り付ける方法
US7292310B2 (en) * 2004-07-02 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method
JP2006261273A (ja) * 2005-03-16 2006-09-28 Canon Inc チャンバおよびこれを用いた露光装置
JP2007142265A (ja) * 2005-11-21 2007-06-07 Fuji Koken Kk 露光装置及び露光方法
US9301340B2 (en) 2006-06-26 2016-03-29 Tp Solar, Inc. IR conveyor furnace having single belt with multiple independently controlled processing lanes
US8571396B2 (en) * 2006-06-26 2013-10-29 Tp Solar, Inc. Rapid thermal firing IR conveyor furnace having high intensity heating section
WO2012009636A1 (en) * 2010-07-15 2012-01-19 Despatch Industries Limited Partnership Firing furnace configuration for thermal processing system
US9354630B2 (en) 2011-05-19 2016-05-31 Universal Laser Systems, Inc. Flexible laser manufacturing systems and associated methods of use and manufacture
US9372407B2 (en) 2013-04-18 2016-06-21 E I Du Pont De Nemours And Company Exposure apparatus and a method for exposing a photosensitive element and a method for preparing a printing form from the photosensitive element
CN106100733A (zh) * 2016-06-14 2016-11-09 苏州迈奇杰智能技术有限公司 一种家用光通信移动端控制节能系统
JP7115735B2 (ja) * 2018-05-18 2022-08-09 株式会社ユメックス Ｖｕｖ光のフラッシュランプ照射処理装置
JP2024005835A (ja) * 2022-06-30 2024-01-17 キヤノン株式会社 光源装置、リソグラフィ装置、及び物品の製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575046A (en) * 1980-06-13 1982-01-11 Nec Kyushu Ltd Developing apparatus for photoresist
JPS5899205A (ja) * 1981-12-09 1983-06-13 株式会社日立製作所 密閉型制御盤の冷却装置
JPS62239533A (ja) * 1986-04-11 1987-10-20 Nec Corp 超高圧水銀ランプ用ハウジング
JPS6327015A (ja) * 1986-07-18 1988-02-04 Nec Corp 縮小投影露光装置
JPH0729081B2 (ja) * 1987-09-14 1995-04-05 ウシオ電機株式会社 光照射装置
JP2567468B2 (ja) * 1988-04-23 1996-12-25 株式会社リコー 立体露光法およびその装置
JPH06250060A (ja) * 1993-02-22 1994-09-09 Nikon Corp ランプ取付アダプター
JPH0670229U (ja) * 1993-03-11 1994-09-30 株式会社ニコン 照明装置
JP3275575B2 (ja) * 1993-10-27 2002-04-15 キヤノン株式会社 投影露光装置及び該投影露光装置を用いたデバイスの製造方法
JPH07201712A (ja) * 1993-12-27 1995-08-04 Dainippon Screen Mfg Co Ltd 照度分布調整装置
JPH08250071A (ja) * 1995-03-14 1996-09-27 Ushio Inc ランプおよび光源装置
JP3594706B2 (ja) * 1995-08-22 2004-12-02 浜松ホトニクス株式会社 光源位置調整装置
JP3437352B2 (ja) * 1995-10-02 2003-08-18 キヤノン株式会社 照明光学系及び光源装置
JP4011643B2 (ja) 1996-01-05 2007-11-21 キヤノン株式会社 半導体製造装置
JP3610175B2 (ja) * 1996-10-29 2005-01-12 キヤノン株式会社 投影露光装置及びそれを用いた半導体デバイスの製造方法
JP3645389B2 (ja) * 1997-01-13 2005-05-11 富士写真フイルム株式会社 光源位置調整方法および光源装置
DE19821194B4 (de) * 1997-05-12 2005-09-22 Advantest Corp. Halbleiterbauelement-Testgerät
JPH11111604A (ja) * 1997-10-07 1999-04-23 Canon Inc 露光装置用放電ランプの点灯開始方法、および露光装置
JPH11162839A (ja) * 1997-12-01 1999-06-18 Canon Inc 露光装置
JPH11258815A (ja) * 1998-03-10 1999-09-24 Nikon Corp 光源ユニットおよび露光装置
JPH11283893A (ja) * 1998-03-30 1999-10-15 Canon Inc デバイス製造装置
JPH11338163A (ja) * 1998-05-21 1999-12-10 Nikon Corp 照明装置、露光装置及び照明方法
JP3441973B2 (ja) 1998-06-30 2003-09-02 キヤノン株式会社 露光装置およびデバイス製造方法
US6247830B1 (en) * 1998-07-29 2001-06-19 Russell Winnett Heat shield for agricultural light bulb
JP2000181075A (ja) * 1998-12-11 2000-06-30 Ushio Inc 露光装置におけるランプ点灯制御方法
JP2000260698A (ja) * 1999-03-09 2000-09-22 Canon Inc 投影露光装置およびそれを用いた半導体デバイスの製造方法
US6333602B1 (en) * 1999-12-14 2001-12-25 Exfo Photonic Solutions Inc. Smart light source with integrated operational parameters data storage capability
US6792321B2 (en) * 2000-03-02 2004-09-14 Electro Standards Laboratories Remote web-based control

Also Published As

Publication number Publication date
US6810299B2 (en) 2004-10-26
JP2002217093A (ja) 2002-08-02
US20020097205A1 (en) 2002-07-25

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