JP4539925B2 - 微小電子機器における銅の電着 - Google Patents

微小電子機器における銅の電着 Download PDF

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Publication number
JP4539925B2
JP4539925B2 JP2006547095A JP2006547095A JP4539925B2 JP 4539925 B2 JP4539925 B2 JP 4539925B2 JP 2006547095 A JP2006547095 A JP 2006547095A JP 2006547095 A JP2006547095 A JP 2006547095A JP 4539925 B2 JP4539925 B2 JP 4539925B2
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Prior art keywords
vinylpyridine
polymer compound
substituted pyridyl
seconds
group
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Expired - Lifetime
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JP2006547095A
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Japanese (ja)
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JP2007517140A (ja
JP2007517140A5 (https=
Inventor
パネッカシオ，ビンセント
リン，シュワン
フィグラ，ポール
ハートビーズ，リチャード
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エントン インコーポレイテッド
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Publication of JP2007517140A5 publication Critical patent/JP2007517140A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electrolytic Production Of Metals (AREA)
JP2006547095A 2003-12-22 2004-12-13 微小電子機器における銅の電着 Expired - Lifetime JP4539925B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53177103P 2003-12-22 2003-12-22
US10/963,369 US8002962B2 (en) 2002-03-05 2004-10-12 Copper electrodeposition in microelectronics
PCT/US2004/041620 WO2005066391A1 (en) 2003-12-22 2004-12-13 Copper electrodeposition in microelectronics

Publications (3)

Publication Number Publication Date
JP2007517140A JP2007517140A (ja) 2007-06-28
JP2007517140A5 JP2007517140A5 (https=) 2008-02-07
JP4539925B2 true JP4539925B2 (ja) 2010-09-08

Family

ID=34752972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006547095A Expired - Lifetime JP4539925B2 (ja) 2003-12-22 2004-12-13 微小電子機器における銅の電着

Country Status (7)

Country Link
US (4) US8002962B2 (https=)
EP (1) EP1697561B1 (https=)
JP (1) JP4539925B2 (https=)
KR (1) KR101157284B1 (https=)
PT (1) PT1697561T (https=)
TW (1) TWI266383B (https=)
WO (1) WO2005066391A1 (https=)

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Also Published As

Publication number Publication date
EP1697561B1 (en) 2018-07-18
EP1697561A4 (en) 2008-05-21
US20120043218A1 (en) 2012-02-23
TW200525695A (en) 2005-08-01
US20140102909A1 (en) 2014-04-17
US8608933B2 (en) 2013-12-17
EP1697561A1 (en) 2006-09-06
PT1697561T (pt) 2018-10-19
JP2007517140A (ja) 2007-06-28
US20050045488A1 (en) 2005-03-03
WO2005066391A1 (en) 2005-07-21
US20170029972A1 (en) 2017-02-02
TWI266383B (en) 2006-11-11
US9493884B2 (en) 2016-11-15
KR101157284B1 (ko) 2012-07-06
KR20060127067A (ko) 2006-12-11
US8002962B2 (en) 2011-08-23

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