JP4493955B2 - 基板処理装置及び搬送ケース - Google Patents

基板処理装置及び搬送ケース Download PDF

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Publication number
JP4493955B2
JP4493955B2 JP2003309367A JP2003309367A JP4493955B2 JP 4493955 B2 JP4493955 B2 JP 4493955B2 JP 2003309367 A JP2003309367 A JP 2003309367A JP 2003309367 A JP2003309367 A JP 2003309367A JP 4493955 B2 JP4493955 B2 JP 4493955B2
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JP
Japan
Prior art keywords
substrate
transfer
chamber
processing apparatus
transfer case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003309367A
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English (en)
Japanese (ja)
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JP2005079409A5 (https=
JP2005079409A (ja
Inventor
俊久 野沢
孝明 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2003309367A priority Critical patent/JP4493955B2/ja
Priority to US10/569,378 priority patent/US7874781B2/en
Priority to KR1020057009241A priority patent/KR100770232B1/ko
Priority to PCT/JP2004/012276 priority patent/WO2005022627A1/ja
Priority to CNB200480001617XA priority patent/CN100365794C/zh
Publication of JP2005079409A publication Critical patent/JP2005079409A/ja
Publication of JP2005079409A5 publication Critical patent/JP2005079409A5/ja
Application granted granted Critical
Publication of JP4493955B2 publication Critical patent/JP4493955B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003309367A 2003-09-01 2003-09-01 基板処理装置及び搬送ケース Expired - Fee Related JP4493955B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003309367A JP4493955B2 (ja) 2003-09-01 2003-09-01 基板処理装置及び搬送ケース
US10/569,378 US7874781B2 (en) 2003-09-01 2004-08-26 Substrate processing apparatus
KR1020057009241A KR100770232B1 (ko) 2003-09-01 2004-08-26 기판 처리 장치
PCT/JP2004/012276 WO2005022627A1 (ja) 2003-09-01 2004-08-26 基板処理装置
CNB200480001617XA CN100365794C (zh) 2003-09-01 2004-08-26 基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003309367A JP4493955B2 (ja) 2003-09-01 2003-09-01 基板処理装置及び搬送ケース

Publications (3)

Publication Number Publication Date
JP2005079409A JP2005079409A (ja) 2005-03-24
JP2005079409A5 JP2005079409A5 (https=) 2006-10-12
JP4493955B2 true JP4493955B2 (ja) 2010-06-30

Family

ID=34269559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003309367A Expired - Fee Related JP4493955B2 (ja) 2003-09-01 2003-09-01 基板処理装置及び搬送ケース

Country Status (5)

Country Link
US (1) US7874781B2 (https=)
JP (1) JP4493955B2 (https=)
KR (1) KR100770232B1 (https=)
CN (1) CN100365794C (https=)
WO (1) WO2005022627A1 (https=)

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JP4216250B2 (ja) * 2002-05-10 2009-01-28 東京エレクトロン株式会社 基板処理装置
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
US8029226B2 (en) 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
KR100578134B1 (ko) * 2003-11-10 2006-05-10 삼성전자주식회사 멀티 챔버 시스템
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4908771B2 (ja) * 2005-04-27 2012-04-04 東京エレクトロン株式会社 処理装置システム
JP4754304B2 (ja) * 2005-09-02 2011-08-24 東京エレクトロン株式会社 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
KR101341211B1 (ko) * 2006-12-29 2013-12-12 엘지전자 주식회사 건조 공정 중 평판표시장치 유리기판의 지지장치, 이를이용한 유리기판의 건조 방법 및 건조 방법을 이용한평판표시장치의 제조방법
US20080206020A1 (en) * 2007-02-27 2008-08-28 Smith John M Flat-panel display processing tool with storage bays and multi-axis robot arms
TW200910505A (en) * 2007-05-08 2009-03-01 Brooks Automation Inc Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
TW201013760A (en) * 2008-09-17 2010-04-01 Inotera Memories Inc A wafer base clean room and a method of using the wafer base clean room
JP5173699B2 (ja) 2008-09-25 2013-04-03 株式会社日立ハイテクノロジーズ 有機ｅｌデバイス製造装置
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
KR101146981B1 (ko) * 2009-06-02 2012-05-22 삼성모바일디스플레이주식회사 증착 장치 및 그 제어 방법
KR101010196B1 (ko) * 2010-01-27 2011-01-21 에스엔유 프리시젼 주식회사 진공 증착 장비
JP2012028659A (ja) * 2010-07-27 2012-02-09 Hitachi High-Technologies Corp 真空処理装置
KR101233290B1 (ko) 2010-09-27 2013-02-14 강창수 피처리모듈 공정시스템
US8918203B2 (en) 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
JP6013792B2 (ja) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
KR101408164B1 (ko) * 2012-12-26 2014-06-17 주식회사 싸이맥스 웨이퍼 이송위치 측정 범위를 최소화하는 트랜스퍼 모듈
US9281222B2 (en) * 2013-03-15 2016-03-08 Applied Materials, Inc. Wafer handling systems and methods
US20150041062A1 (en) * 2013-08-12 2015-02-12 Lam Research Corporation Plasma processing chamber with removable body
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
JP6677884B2 (ja) * 2015-12-15 2020-04-08 シンフォニアテクノロジー株式会社 搬送装置
TW201740466A (zh) * 2016-05-03 2017-11-16 系統科技公司 基板處理裝置及基板處理方法
JP6838319B2 (ja) * 2016-08-31 2021-03-03 株式会社デンソーウェーブ 生産システム
JP6601360B2 (ja) * 2016-09-30 2019-11-06 株式会社ダイフク 物品搬送設備
JP6900862B2 (ja) * 2017-09-22 2021-07-07 株式会社デンソーウェーブ 移動ロボット
JP7177585B2 (ja) * 2017-09-22 2022-11-24 株式会社デンソーウェーブ 移動ロボット
KR102706036B1 (ko) * 2018-02-15 2024-09-11 램 리써치 코포레이션 기판 이송 챔버 이동
JP7154986B2 (ja) * 2018-12-11 2022-10-18 平田機工株式会社 基板搬送装置及び基板搬送システム
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7341822B2 (ja) * 2019-09-26 2023-09-11 株式会社アルバック 真空処理装置
CN113314448B (zh) * 2021-05-13 2022-07-22 长江存储科技有限责任公司 半导体传输设备及其控制方法
KR102822951B1 (ko) 2021-09-09 2025-06-20 삼성전자주식회사 Efem을 포함하는 웨이퍼 처리 장치 및 웨이퍼 처리 방법

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JP3539814B2 (ja) * 1995-10-05 2004-07-07 大日本スクリーン製造株式会社 基板処理装置
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JPH11284048A (ja) * 1998-03-31 1999-10-15 Shibaura Mechatronics Corp ロボット装置および処理装置
JP4533462B2 (ja) * 1998-04-04 2010-09-01 東京エレクトロン株式会社 処理方法
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JP4216250B2 (ja) * 2002-05-10 2009-01-28 東京エレクトロン株式会社 基板処理装置
WO2004010476A2 (en) * 2002-07-22 2004-01-29 Brooks Automation, Inc. Substrate processing apparatus

Also Published As

Publication number Publication date
KR100770232B1 (ko) 2007-10-26
US7874781B2 (en) 2011-01-25
CN100365794C (zh) 2008-01-30
US20070000612A1 (en) 2007-01-04
CN1717796A (zh) 2006-01-04
WO2005022627A1 (ja) 2005-03-10
KR20050114209A (ko) 2005-12-05
JP2005079409A (ja) 2005-03-24

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