JP4447279B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP4447279B2
JP4447279B2 JP2003355471A JP2003355471A JP4447279B2 JP 4447279 B2 JP4447279 B2 JP 4447279B2 JP 2003355471 A JP2003355471 A JP 2003355471A JP 2003355471 A JP2003355471 A JP 2003355471A JP 4447279 B2 JP4447279 B2 JP 4447279B2
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JP
Japan
Prior art keywords
substrate holder
chamber
substrate
film forming
forming apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003355471A
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English (en)
Japanese (ja)
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JP2005120412A5 (enExample
JP2005120412A (ja
Inventor
真司 古川
雅弘 芝本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2003355471A priority Critical patent/JP4447279B2/ja
Priority to US10/957,864 priority patent/US7625450B2/en
Publication of JP2005120412A publication Critical patent/JP2005120412A/ja
Priority to US12/031,474 priority patent/US7935187B2/en
Publication of JP2005120412A5 publication Critical patent/JP2005120412A5/ja
Application granted granted Critical
Publication of JP4447279B2 publication Critical patent/JP4447279B2/ja
Priority to US13/089,042 priority patent/US8377210B2/en
Priority to US13/744,919 priority patent/US8715417B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2003355471A 2003-10-15 2003-10-15 成膜装置 Expired - Lifetime JP4447279B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003355471A JP4447279B2 (ja) 2003-10-15 2003-10-15 成膜装置
US10/957,864 US7625450B2 (en) 2003-10-15 2004-10-04 Film forming apparatus
US12/031,474 US7935187B2 (en) 2003-10-15 2008-02-14 Film forming apparatus
US13/089,042 US8377210B2 (en) 2003-10-15 2011-04-18 Film forming apparatus
US13/744,919 US8715417B2 (en) 2003-10-15 2013-01-18 Film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003355471A JP4447279B2 (ja) 2003-10-15 2003-10-15 成膜装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008035565A Division JP4746063B2 (ja) 2008-02-18 2008-02-18 成膜装置及び成膜装置用ストックチャンバー

Publications (3)

Publication Number Publication Date
JP2005120412A JP2005120412A (ja) 2005-05-12
JP2005120412A5 JP2005120412A5 (enExample) 2008-04-17
JP4447279B2 true JP4447279B2 (ja) 2010-04-07

Family

ID=34613052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003355471A Expired - Lifetime JP4447279B2 (ja) 2003-10-15 2003-10-15 成膜装置

Country Status (2)

Country Link
US (4) US7625450B2 (enExample)
JP (1) JP4447279B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210151285A1 (en) * 2019-11-15 2021-05-20 Tokyo Electron Limited Temperature measurement system, temperature measurement method, and substrate processing apparatus

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KR100945431B1 (ko) * 2007-10-05 2010-03-05 한국원자력연구원 다층기판홀더를 이용한 양산형 박막증착장치
JP5076870B2 (ja) * 2007-12-21 2012-11-21 大日本印刷株式会社 インラインスパッタ装置
WO2009107740A1 (ja) * 2008-02-27 2009-09-03 昭和電工株式会社 磁気記録媒体の製造装置および製造方法
JPWO2009153856A1 (ja) * 2008-06-17 2011-11-24 キヤノンアネルバ株式会社 防着カバー付きキャリアおよび防着カバー着脱装置
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
US9214372B2 (en) * 2008-08-28 2015-12-15 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device and coating device
US8919756B2 (en) * 2008-08-28 2014-12-30 Tokyo Ohka Kogyo Co., Ltd. Substrate processing system, carrying device, and coating device
JP4377452B1 (ja) * 2008-09-30 2009-12-02 キヤノンアネルバ株式会社 基板ホルダー収納チャンバ、インライン型基板処理装置及び磁気ディスクの製造方法
JP5529484B2 (ja) * 2008-10-28 2014-06-25 キヤノンアネルバ株式会社 基板搬送装置、及び磁気記録媒体の製造方法
WO2010058606A1 (ja) * 2008-11-21 2010-05-27 株式会社ニコン 保持部材管理装置、積層半導体製造装置および保持部材管理方法
JP5431901B2 (ja) * 2008-12-26 2014-03-05 キヤノンアネルバ株式会社 インライン真空処理装置、インライン真空処理装置の制御方法、情報記録媒体の製造方法
JP5150575B2 (ja) * 2009-07-17 2013-02-20 キヤノンアネルバ株式会社 基板ホルダー保持装置及び基板ホルダー収納チャンバ
WO2011121665A1 (ja) * 2010-03-31 2011-10-06 キヤノンアネルバ株式会社 電子デバイスの製造装置及びこれを用いた電子デバイスの製造方法
JP5582895B2 (ja) * 2010-07-09 2014-09-03 キヤノンアネルバ株式会社 基板ホルダーストッカ装置及び基板処理装置並びに該基板ホルダーストッカ装置を用いた基板ホルダー移動方法
US9115425B2 (en) * 2010-10-18 2015-08-25 Electronics And Telecommunications Research Institute Thin film depositing apparatus
JP5611027B2 (ja) * 2010-12-24 2014-10-22 小島プレス工業株式会社 樹脂製品の製造システム
DE102011006676A1 (de) * 2011-04-01 2012-10-04 Von Ardenne Anlagentechnik Gmbh Verfahren zur Reduzierung der Gaslast von Substratträgern bei Vakuumprozessen
JP5832372B2 (ja) * 2011-05-16 2015-12-16 キヤノンアネルバ株式会社 真空処理装置
RU2539487C2 (ru) * 2012-05-03 2015-01-20 Вера Дмитриевна Мирошникова Способ нанесения покрытия магнетронным распылением и держатель подложек на его основе
WO2014170986A1 (ja) * 2013-04-18 2014-10-23 株式会社島津製作所 基板検出システム及び基板検出方法
JP6303167B2 (ja) * 2013-11-07 2018-04-04 昭和電工株式会社 インライン式成膜装置及びそれを用いた磁気記録媒体の製造方法
WO2015075817A1 (ja) * 2013-11-22 2015-05-28 株式会社島津製作所 基板処理システム
SG11201603358PA (en) * 2014-03-04 2016-09-29 Canon Anelva Corp Vacuum process apparatus and vacuum process method
JP5896047B1 (ja) * 2015-01-26 2016-03-30 三菱マテリアル株式会社 成膜装置、コーティング膜付き切削工具の製造方法
DE102015004352A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Behandlungsvorrichtung für Wafer
DE102015004419A1 (de) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Waferboot und Plasma-Behandlungsvorrichtung für Wafer
CN104928646B (zh) * 2015-04-28 2018-05-08 沈阳拓荆科技有限公司 双层式负载腔室真空与大气快速平衡结构
KR102519797B1 (ko) * 2016-04-12 2023-04-10 삼성디스플레이 주식회사 증착 장치 및 증착 방법
US11358168B2 (en) * 2019-06-18 2022-06-14 Visera Technologies Company Limited Coating apparatus
CN116868321B (zh) * 2021-01-29 2025-01-10 平克塞莫系统有限公司 用于连接电子组件的系统和方法
TWI843196B (zh) * 2022-09-08 2024-05-21 凌嘉科技股份有限公司 旋轉移載式立式鍍膜設備及雙面多層膜的鍍膜方法
TWI826001B (zh) * 2022-09-19 2023-12-11 汎銓科技股份有限公司 一種減少缺陷的鍍膜方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210151285A1 (en) * 2019-11-15 2021-05-20 Tokyo Electron Limited Temperature measurement system, temperature measurement method, and substrate processing apparatus
US11972921B2 (en) * 2019-11-15 2024-04-30 Tokyo Electron Limited Temperature measurement system, temperature measurement method, and substrate processing apparatus

Also Published As

Publication number Publication date
US20080178796A1 (en) 2008-07-31
US8377210B2 (en) 2013-02-19
US20110192344A1 (en) 2011-08-11
US20050115830A1 (en) 2005-06-02
US8715417B2 (en) 2014-05-06
JP2005120412A (ja) 2005-05-12
US7935187B2 (en) 2011-05-03
US7625450B2 (en) 2009-12-01
US20130133571A1 (en) 2013-05-30

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