JP4446875B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4446875B2
JP4446875B2 JP2004362178A JP2004362178A JP4446875B2 JP 4446875 B2 JP4446875 B2 JP 4446875B2 JP 2004362178 A JP2004362178 A JP 2004362178A JP 2004362178 A JP2004362178 A JP 2004362178A JP 4446875 B2 JP4446875 B2 JP 4446875B2
Authority
JP
Japan
Prior art keywords
substrate
processing liquid
support
processing
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004362178A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006032891A5 (enExample
JP2006032891A (ja
Inventor
勝彦 宮
幸嗣 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2004362178A priority Critical patent/JP4446875B2/ja
Priority to TW094115516A priority patent/TWI284933B/zh
Priority to US11/130,585 priority patent/US7608152B2/en
Publication of JP2006032891A publication Critical patent/JP2006032891A/ja
Publication of JP2006032891A5 publication Critical patent/JP2006032891A5/ja
Application granted granted Critical
Publication of JP4446875B2 publication Critical patent/JP4446875B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/266—Sputtering or spin-coating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004362178A 2004-06-14 2004-12-15 基板処理装置 Expired - Fee Related JP4446875B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004362178A JP4446875B2 (ja) 2004-06-14 2004-12-15 基板処理装置
TW094115516A TWI284933B (en) 2004-06-14 2005-05-13 A substrate processing apparatus and method
US11/130,585 US7608152B2 (en) 2004-06-14 2005-05-17 Substrate processing apparatus and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004175730 2004-06-14
JP2004362178A JP4446875B2 (ja) 2004-06-14 2004-12-15 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009284676A Division JP4979758B2 (ja) 2004-06-14 2009-12-16 基板処理装置および方法

Publications (3)

Publication Number Publication Date
JP2006032891A JP2006032891A (ja) 2006-02-02
JP2006032891A5 JP2006032891A5 (enExample) 2007-09-06
JP4446875B2 true JP4446875B2 (ja) 2010-04-07

Family

ID=35460869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004362178A Expired - Fee Related JP4446875B2 (ja) 2004-06-14 2004-12-15 基板処理装置

Country Status (3)

Country Link
US (1) US7608152B2 (enExample)
JP (1) JP4446875B2 (enExample)
TW (1) TWI284933B (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4262004B2 (ja) * 2002-08-29 2009-05-13 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4397299B2 (ja) * 2004-07-30 2010-01-13 大日本スクリーン製造株式会社 基板処理装置
JP4698407B2 (ja) 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US20070221335A1 (en) * 2006-03-23 2007-09-27 Recif Technologies Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device
JP4890067B2 (ja) * 2006-03-28 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
ATE445229T1 (de) * 2006-04-18 2009-10-15 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
TWI378502B (en) * 2006-06-12 2012-12-01 Semes Co Ltd Method and apparatus for cleaning substrates
JP4708286B2 (ja) * 2006-08-11 2011-06-22 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4841451B2 (ja) 2007-01-31 2011-12-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5006829B2 (ja) * 2008-04-23 2012-08-22 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5270607B2 (ja) * 2010-03-30 2013-08-21 大日本スクリーン製造株式会社 基板処理装置
JP5795917B2 (ja) 2010-09-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5496966B2 (ja) * 2011-08-05 2014-05-21 東京エレクトロン株式会社 液処理装置
JP5006464B1 (ja) * 2011-10-25 2012-08-22 ミクロ技研株式会社 基板処理装置及び基板処理方法
US8877075B2 (en) * 2012-02-01 2014-11-04 Infineon Technologies Ag Apparatuses and methods for gas mixed liquid polishing, etching, and cleaning
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
US20150050752A1 (en) * 2013-08-14 2015-02-19 Applied Materials, Inc. Methods for cleaning a wafer edge including a notch
TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
TWI597770B (zh) 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6240450B2 (ja) * 2013-09-27 2017-11-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6359477B2 (ja) * 2014-08-27 2018-07-18 東京エレクトロン株式会社 基板液処理装置
JP6512554B2 (ja) * 2014-09-29 2019-05-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI661479B (zh) * 2015-02-12 2019-06-01 Screen Holdings Co,. Ltd. 基板處理裝置、基板處理系統以及基板處理方法
CN107437516B (zh) 2016-05-25 2021-07-13 株式会社斯库林集团 基板处理装置及基板处理方法
TWI797121B (zh) 2017-04-25 2023-04-01 美商維克儀器公司 半導體晶圓製程腔體
JP6842391B2 (ja) * 2017-09-07 2021-03-17 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
CN111081585B (zh) * 2018-10-18 2022-08-16 北京北方华创微电子装备有限公司 喷淋装置及清洗设备
JP7201494B2 (ja) * 2019-03-20 2023-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN113458940B (zh) * 2021-06-28 2022-12-06 云南省建设投资控股集团有限公司 一种用于钢筋加工线的刮料辅助结构

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JPH08316190A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板処理装置
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JP3956350B2 (ja) * 2002-03-25 2007-08-08 東京エレクトロン株式会社 位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法
JP4570008B2 (ja) * 2002-04-16 2010-10-27 東京エレクトロン株式会社 液処理装置および液処理方法
JP2004006672A (ja) * 2002-04-19 2004-01-08 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
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JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
JP4105574B2 (ja) * 2003-03-26 2008-06-25 大日本スクリーン製造株式会社 基板処理装置
JP4397299B2 (ja) * 2004-07-30 2010-01-13 大日本スクリーン製造株式会社 基板処理装置
JP4698407B2 (ja) * 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4708286B2 (ja) * 2006-08-11 2011-06-22 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
US7608152B2 (en) 2009-10-27
JP2006032891A (ja) 2006-02-02
US20050276921A1 (en) 2005-12-15
TWI284933B (en) 2007-08-01
TW200607012A (en) 2006-02-16

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