TWI284933B - A substrate processing apparatus and method - Google Patents

A substrate processing apparatus and method Download PDF

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Publication number
TWI284933B
TWI284933B TW094115516A TW94115516A TWI284933B TW I284933 B TWI284933 B TW I284933B TW 094115516 A TW094115516 A TW 094115516A TW 94115516 A TW94115516 A TW 94115516A TW I284933 B TWI284933 B TW I284933B
Authority
TW
Taiwan
Prior art keywords
substrate
gas
processing
liquid
rotating
Prior art date
Application number
TW094115516A
Other languages
English (en)
Chinese (zh)
Other versions
TW200607012A (en
Inventor
Katsuhiko Miya
Koji Ando
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200607012A publication Critical patent/TW200607012A/zh
Application granted granted Critical
Publication of TWI284933B publication Critical patent/TWI284933B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/266—Sputtering or spin-coating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094115516A 2004-06-14 2005-05-13 A substrate processing apparatus and method TWI284933B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004175730 2004-06-14
JP2004362178A JP4446875B2 (ja) 2004-06-14 2004-12-15 基板処理装置

Publications (2)

Publication Number Publication Date
TW200607012A TW200607012A (en) 2006-02-16
TWI284933B true TWI284933B (en) 2007-08-01

Family

ID=35460869

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115516A TWI284933B (en) 2004-06-14 2005-05-13 A substrate processing apparatus and method

Country Status (3)

Country Link
US (1) US7608152B2 (enExample)
JP (1) JP4446875B2 (enExample)
TW (1) TWI284933B (enExample)

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JP4262004B2 (ja) * 2002-08-29 2009-05-13 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4397299B2 (ja) * 2004-07-30 2010-01-13 大日本スクリーン製造株式会社 基板処理装置
JP4698407B2 (ja) 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US20070221335A1 (en) * 2006-03-23 2007-09-27 Recif Technologies Device for contact by adhesion to a glass or semiconductor plate (wafer) surface or the like and system for gripping such a plate comprising such a device
JP4890067B2 (ja) * 2006-03-28 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
ATE445229T1 (de) * 2006-04-18 2009-10-15 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
TWI378502B (en) * 2006-06-12 2012-12-01 Semes Co Ltd Method and apparatus for cleaning substrates
JP4708286B2 (ja) * 2006-08-11 2011-06-22 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4841451B2 (ja) 2007-01-31 2011-12-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5006829B2 (ja) * 2008-04-23 2012-08-22 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5270607B2 (ja) * 2010-03-30 2013-08-21 大日本スクリーン製造株式会社 基板処理装置
JP5795917B2 (ja) 2010-09-27 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5496966B2 (ja) * 2011-08-05 2014-05-21 東京エレクトロン株式会社 液処理装置
JP5006464B1 (ja) * 2011-10-25 2012-08-22 ミクロ技研株式会社 基板処理装置及び基板処理方法
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TWI569349B (zh) * 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
TWI597770B (zh) 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6240450B2 (ja) * 2013-09-27 2017-11-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6359477B2 (ja) * 2014-08-27 2018-07-18 東京エレクトロン株式会社 基板液処理装置
JP6512554B2 (ja) * 2014-09-29 2019-05-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI661479B (zh) * 2015-02-12 2019-06-01 Screen Holdings Co,. Ltd. 基板處理裝置、基板處理系統以及基板處理方法
CN107437516B (zh) 2016-05-25 2021-07-13 株式会社斯库林集团 基板处理装置及基板处理方法
TWI797121B (zh) 2017-04-25 2023-04-01 美商維克儀器公司 半導體晶圓製程腔體
JP6842391B2 (ja) * 2017-09-07 2021-03-17 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
CN111081585B (zh) * 2018-10-18 2022-08-16 北京北方华创微电子装备有限公司 喷淋装置及清洗设备
JP7201494B2 (ja) * 2019-03-20 2023-01-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN113458940B (zh) * 2021-06-28 2022-12-06 云南省建设投资控股集团有限公司 一种用于钢筋加工线的刮料辅助结构

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JP4698407B2 (ja) * 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4708286B2 (ja) * 2006-08-11 2011-06-22 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
US7608152B2 (en) 2009-10-27
JP2006032891A (ja) 2006-02-02
US20050276921A1 (en) 2005-12-15
JP4446875B2 (ja) 2010-04-07
TW200607012A (en) 2006-02-16

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MM4A Annulment or lapse of patent due to non-payment of fees