JP4401241B2 - 電気的相互接続のためのスタンドオフ／マスク構造 - Google Patents

電気的相互接続のためのスタンドオフ／マスク構造 Download PDF

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JP4401241B2
JP4401241B2 JP2004156449A JP2004156449A JP4401241B2 JP 4401241 B2 JP4401241 B2 JP 4401241B2 JP 2004156449 A JP2004156449 A JP 2004156449A JP 2004156449 A JP2004156449 A JP 2004156449A JP 4401241 B2 JP4401241 B2 JP 4401241B2
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layer
mask
standoff
adhesive
liner
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JP2004356630A5 (enExample
JP2004356630A (ja
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アール アンドリューズ ジョン
ジェイ ガーナー ブラッドリー
シューマッハテンベルグ ザ・サード リチャード
スレンズ チャド
ヴイ シュルツ サミュエル
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Xerox Corp
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Xerox Corp
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Wire Bonding (AREA)
JP2004156449A 2003-05-27 2004-05-26 電気的相互接続のためのスタンドオフ／マスク構造 Expired - Fee Related JP4401241B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/447,169 US6998539B2 (en) 2003-05-27 2003-05-27 Standoff/mask structure for electrical interconnect

Publications (3)

Publication Number Publication Date
JP2004356630A JP2004356630A (ja) 2004-12-16
JP2004356630A5 JP2004356630A5 (enExample) 2007-07-05
JP4401241B2 true JP4401241B2 (ja) 2010-01-20

Family

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Country Status (5)

Country Link
US (1) US6998539B2 (enExample)
EP (1) EP1482547A3 (enExample)
JP (1) JP4401241B2 (enExample)
CN (1) CN100388468C (enExample)
BR (1) BRPI0401840A (enExample)

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US7742311B2 (en) * 2007-04-13 2010-06-22 Hewlett-Packard Development Company, L.P. Damage prevention interposer for electronic package and electronic interconnect structure
US8156641B2 (en) * 2009-05-21 2012-04-17 Xerox Corporation Interconnection method for tightly packed arrays with flex circuit
DE102009024874A1 (de) * 2009-06-09 2010-12-16 Nb Technologies Gmbh Siebdruckform
JP5024342B2 (ja) * 2009-09-16 2012-09-12 株式会社村田製作所 回路モジュール
DE102009054764A1 (de) * 2009-12-16 2011-06-22 Robert Bosch GmbH, 70469 Verfahren und Vorrichtung zum Herstellen eines Schaltungsträgers und Schaltungsträger
KR101184792B1 (ko) * 2010-09-10 2012-09-20 삼성전기주식회사 범프 형성용 마스크 및 이의 제조 방법
TWI606565B (zh) * 2016-08-31 2017-11-21 金寶電子工業股份有限公司 封裝結構及其製作方法
US10923447B2 (en) 2017-05-23 2021-02-16 Micron Technology, Inc. Semiconductor device assembly with die support structures
US10950568B2 (en) 2017-05-23 2021-03-16 Micron Technology, Inc. Semiconductor device assembly with surface-mount die support structures
US10141668B1 (en) * 2017-07-06 2018-11-27 Palo Alto Research Center Incorporated Detachable flex-to-flex electrical connection
US20190067232A1 (en) * 2017-08-31 2019-02-28 Micron Technology, Inc. Method for Solder Bridging Elimination for Bulk Solder C2S Interconnects
CN116419481A (zh) * 2021-12-30 2023-07-11 华为技术有限公司 一种电路板组件及电子设备

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CN100388468C (zh) 2008-05-14
US20040238208A1 (en) 2004-12-02
BRPI0401840A (pt) 2005-03-08
US6998539B2 (en) 2006-02-14
CN1574475A (zh) 2005-02-02
EP1482547A3 (en) 2009-08-19
JP2004356630A (ja) 2004-12-16
EP1482547A2 (en) 2004-12-01

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