JP2004356630A - 電気的相互接続のためのスタンドオフ／マスク構造 - Google Patents

電気的相互接続のためのスタンドオフ／マスク構造 Download PDF

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JP2004356630A
JP2004356630A JP2004156449A JP2004156449A JP2004356630A JP 2004356630 A JP2004356630 A JP 2004356630A JP 2004156449 A JP2004156449 A JP 2004156449A JP 2004156449 A JP2004156449 A JP 2004156449A JP 2004356630 A JP2004356630 A JP 2004356630A
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mask
standoff
layer
mask structure
adhesive
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JP2004156449A
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JP2004356630A5 (ja
JP4401241B2 (ja
Inventor
John R Andrews
アール アンドリューズ ジョン
Bradley J Gerner
ジェイ ガーナー ブラッドリー
Richard Schmachtenberg Iii
シューマッハテンベルグ ザ・サード リチャード
Chad Slenes
スレンズ チャド
Samuel V Schultz
ヴイ シュルツ サミュエル
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Xerox Corp
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Xerox Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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Abstract

【課題】高い信頼性を持たせて高効率で回路構造を機械的電気的に相互接続する。
【解決手段】多層スタンドオフ／マスク構造は、複数のスタンドオフ開口を有するスタンドオフと、このスタンドオフ開口に位置合わせされた複数のマスク開口を有するマスクとから構成される。スタンドオフ／マスク構造は、ライナ層と、該ライナ層に取り付けられた接着剤スタンドオフ層と、ライナ層及び接着剤スタンドオフ層中に形成された複数のスタンドオフ開口と、ライナ層に取り付けられたマスク接着剤層と、該マスク接着剤層に取り付けられたマスク層と、マスク接着剤層及びマスク層中に、複数のスタンドオフ開口と位置を調整して形成された複数のマスク開口と、を備える。
【選択図】図２

Description

この主題の開示は、一般には、回路構造を相互接続するための技術に向けられている。
回路基板、集積回路ダイ及び回路パッケージ等の回路構造は、種々の技術により機械的及び／又は電気的に相互接続される。高い信頼性を持たせて高効率で回路構造を機械的電気的に相互接続することは困難である場合がある。
米国特許第６，１４８，５１２号明細書
図１及び図２は、本明細書中に開示する技術を用いて製造することの出来る相互接続された回路構造の一実施の形態の、それぞれ、略平面図及び略横断立面図である。この回路構造は、複数の接触領域５３を有する第１の電気回路構造５１を有する。この回路構造は、更に、複数の接触領域５７を有する第２の電気回路構造５５を有する。第１の回路構造５１の接触領域５３は、第２の回路構造５５の接触領域５７と位置の調整がなされている。接触領域５３は、導電性の島ないしはバンプ５９により、対応する接触領域５７に電気的に相互接続されている。パターン化されたスタンドオフ構造６１が、第１の回路構造と第２の回路構造との間に配置されている。このスタンドオフ構造６１は、複数の開口６３を有し、この複数の開口６３のそれぞれは、接触領域５３、導電性バンプ５９及び接触領域５７の相互接続を取り囲んでいる。説明のための実施例として、パターン化したスタンドオフ構造６１は接着剤層から構成される。
第１及び第２の電気回路構造５１，５５は、それぞれ、回路基板、可撓性回路、電気機械素子、集積回路ダイ、半導体パッケージ、厚膜回路、セラミック回路基板、あるいは、他の全ての電気回路構造を備えることができる。これらの電気回路構造は複数の接触領域を有し、これらの接触領域は、別の電気的回路構造に電気的に接続されることが必要である。
図３〜９は、図１の相互接続された回路構造を製造するために用いることのできる種々の工程の例を示す。
図３において、ビア（ｖｉａｓ）すなわち開口６３が積層構造６０中に形成されている。積層構造６０は、正面ライナ層（ｌｉｎｅｒ ｌａｙｅｒ）６５と背面ライナ層６７との間に配置された接着剤層６１を有している。積層構造６０は、例えば多層テープにより構成できる。接着剤層６１は、後に、図１及び図２の相互接続された回路構造のスタンドオフ６１となる。正面及び背面のライナ層６５，６７は、それぞれ可撓性を有する層であっていいし、例えば、ポリエステル、ポリイミド、ポリアミド、ポリエチルイミド、ポリスルホン、ポリエチルスルホン、ポリエチルエチルケトン、ポリフェニレンスルフィドで構成できる。正面及び背面のライナ６５，６７は、ほぼ５μｍからほぼ２５０μｍの範囲の厚さをそれぞれ有することができる。あるいは、正面及び背面のライナ６５，６７は、それぞれ、ほぼ２μｍからほぼ１００μｍの範囲の厚さを有してもよい。特定の実施例として、正面及び背面の各ライナ６５，６７はほぼ３７μｍの厚さを有することができる。
接着剤スタンドオフ層６１は、例えば、単層テープまたは両面テープで構成することができる。接着剤スタンドオフ層６１は、更に、例えば、アクリル、エポキシ、フェノール樹脂、ポリイミド、及び／又はシリコンの接着剤で構成でき、また、熱硬化性接着剤又は触圧接着剤で構成できる。接着剤スタンドオフ層６１は、ほぼ１μｍ〜ほぼ５００μｍの範囲内の厚さを有することができる。あるいは、接着剤スタンドオフ層６１は、ほぼ１０μｍ〜ほぼ１００μｍの範囲内の厚さを有することができる。特定の実施例として、接着剤スタンドオフ層６１はほぼ２５μｍの厚さを有することができる。
開口６３は、例えば、レーザ切削、穴開け、打抜き、あるいはダイ打抜きにより形成できる。開口６３のレーザ切削は、ＣＯ２レーザ等の検流計走査レーザ又はダイオードパンプト（ｄｉｏｄｅ−ｐｕｍｐｅｄ）固体レーザを用いて行なうことができる。他の実施の形態においては、開口６３の切削は、開口をパターン化するために接触マスク又は突出マスクのいずれかを用いて、エキシマレーザを用いて、広い範囲にわたって行なうことができる。説明のための実施例として、開口６３は、円形すなわち丸であることができ、約８μｍ〜約５００μｍの範囲内の直径を有することができる。開口６３は、各中心間距離で、直径のほぼ１．１倍〜ほぼ２倍の範囲内で相互に離隔できる。他の実施例として、中心間距離は、直径のほぼ１．１倍〜ほぼ１０倍の範囲内とできる。開口６３は、楕円、長方形、又は意図した電気的な相互接続を実現することのできる全ての適切な形状であることができる。
図４において、積層マスク構造７０が、開口の設けられた積層構造６０に施される。積層マスク構造７０は、マスク接着剤層７１及びマスクライナ層７５により構成され、例えば多層テープで形成できる。マスクライナ層７５は、可撓性層であってよく、例えば、ポリエステル、ポリイミド、ポリアミド、ポリエチルイミド、ポリスルホン、ポリエチルスルホン、ポリエチルエチルケトン、又はポリフェニレンスルフィドにより構成できる。マスクライナ層７５は、ほぼ１μｍ〜ほぼ５００μｍの範囲内の厚さを有することができる。又は、マスクライナ層７５は、ほぼ１０μｍ〜ほぼ１００μｍの範囲内の厚さを有することができる。特定の実施例として、マスクライナ層７５はほぼ２５μｍの厚さを有することができる。マスク接着剤層７１は、シリコンやアクリル樹脂等の接触接着剤で構成することができ、ほぼ１μｍ〜ほぼ５００μｍの範囲内の厚さを有することができる。又は、マスク接着剤層７１は、ほぼ５μｍ〜ほぼ５０μｍの範囲内の厚さを有することができる。マスク接着剤層７１は、また、ＵＶ硬化性接着剤で構成できる。
図５において、積層構造６０の開口６３と一直線上に配置されたマスク開口７３が、積層マスク構造７０中に形成される。例えば、開口６３を形成した切削装置と同一の切削装置、又は異なる切削装置で、レーザ切削工具等の切削工具を、積層構造６０中の開口６３の位置に合わせ、マスク開口７３が形成される。この位置調節は、例えばマシンビジョンにより実施することができる。マスク開口７３のレーザ切削は、ＣＯ２レーザ等の検流計操作レーザ又はダイオオードパンプト固体レーザを用いて行なうことができる。別の実施の形態においては、マスク開口７３の切削は、これらの開口をパターンとして形成するための接触マスク又は突出マスクを用いて、エキシマレーザを用いて広い範囲にわたって行なうことができる。説明のための実施例として、マスク開口７３は、ほぼ５μｍからほぼ２５０μｍの範囲内の直径を有する円とすることができる。マスク開口は、他の適当な形状とすることができる。
図６において、背面ライナ６７が積層構造６０から取り除かれ、残ったスタンドオフ／マスク積層構造は、スタンドオフ接着剤層６１、正面ライナ６５、マスク接着剤層７１及びマスクライナ層７５により構成され、例えば加熱かしめにより第１の電気構造５１に取り付けられる。正面ライナ６５とスタンドオフ接着剤層６１とは、スタンドオフ担持積層構造６０’を構成する。
図７において、導電性ペースト１５９が、マスク開口７３とスタンドオフ開口６３とを貫いて施される。導電性ペースト１５９は、例えば、銀エポキシで構成できる。導電性ペースト１５９は、また、フラックス中に懸濁させたインジウム合金粉等の低溶融半田ペーストでも構成できる。
図８において、正面ライナ６５と、マスクライナ層７５及びマスク接着剤層７１から成る積層マスク構造７０とが取り除かれ、スタンドオフ接着剤層６１と導電性エポキシ５９の島とが露出する。
図９において、第２の電気回路構造５５が、スタンドオフ接着剤層６１と導電性ペースト５９の島とに取り付けられる。
本発明を、開示された実施の形態に関して説明した。しかし、本発明の精神と範囲との中で、変形と修正をなし得ることが認識される。
相互接続された電気回路構造の一実施の形態の略平面図である。 図１の相互接続された電気回路構造の略立面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。 図１の相互接続された回路構造の製造の一工程を示す略横断面図である。
符号の説明
５１，５５ 電気回路構造、５３，５７ 接触領域、５９ 導電性バンプ、６０ 積層構造、６１ 接着剤スタンドオフ層（接着剤層）、６３ スタンドオフ開口、６５ 正面ライナ層、６７ 背面ライナ層、７０ 積層マスク構造、７１ マスク接着剤層、７３ マスク開口、７５ マスクライナ層、１５９ 導電性ペースト。

Claims (17)

  1. ライナ層と、
    該ライナ層に取り付けられた接着剤スタンドオフ層と、
    前記ライナ層及び前記接着剤スタンドオフ層中に形成された複数のスタンドオフ開口と、
    前記ライナ層に取り付けられたマスク接着剤層と、
    該マスク接着剤層に取り付けられたマスク層と、
    前記マスク接着剤層及び前記マスク層中に、前記複数のスタンドオフ開口と位置を調整して形成された複数のマスク開口と、
    を備えたことを特徴とするスタンドオフ／マスク構造。
  2. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記スタンドオフ開口は、約８μｍ〜約５００μｍの範囲内の直径を有することを特徴とするスタンドオフ／マスク構造。
  3. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記スタンドオフ開口は、約８μｍ〜約５００μｍの範囲内の直径を有し、中心間距離が、前記直径の約１．１倍〜約２倍であることを特徴とするスタンドオフ／マスク構造。
  4. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記マスク開口は、約５μｍ〜約２５０μｍの範囲内の直径を有することを特徴とするスタンドオフ／マスク構造。
  5. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記第１の接着剤層は、アクリル、エポキシ、フェノール樹脂、ポリイミド、及びシリコン接着剤からなる群から選択した接着剤で構成されることを特徴とするスタンドオフ／マスク構造。
  6. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記スタンドオフ層は、両面テープで構成されることを特徴とするスタンドオフ／マスク構造。
  7. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記スタンドオフ層は、約１μｍ〜約５００μｍの範囲内の厚さを有することを特徴とするスタンドオフ／マスク構造。
  8. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記マスク接着剤層は、接触接着剤とＵＶ硬化性接着剤とから成る群から選択した接着剤で構成されることを特徴とするスタンドオフ／マスク構造。
  9. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記マスク接着剤層は、約１μｍ〜約５００μｍの範囲内の厚さを有することを特徴とするスタンドオフ／マスク構造。
  10. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記マスク接着剤層は、約５μｍ〜約５０μｍの範囲内の厚さを有することを特徴とするスタンドオフ／マスク構造。
  11. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記第１のライナ層、第２のライナ層及び第３のライナ層の各層は、ポリエステル、ポリイミド、ポリアミド、ポリエチルイミド、ポリスルホン、ポリエチルスルホン、ポリエチルエチルケトン、及びポリフェニレンスルフィドからなる群から選択した物質で構成されることを特徴とするスタンドオフ／マスク構造。
  12. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記ライナ層と前記マスク層との各層は、約１μｍ〜約５００μｍの範囲内の厚さを有することを特徴とするスタンドオフ／マスク構造。
  13. 請求項１に記載のスタンドオフ／マスク構造であって、
    前記ライナ層と前記マスク層との各層は、約１０μｍ〜約１００μｍの範囲内の厚さを有することを特徴とするスタンドオフ／マスク構造。
  14. 相互接続された電気回路構造をマスクする方法であって、
    第１の電気回路構造の複数の接触領域上に積層スタンドオフ／マスク構造を施す工程であって、多層スタンドオフ／マスク構造が、前記接触領域と位置が調整された複数のスタンドオフ開口を有する接着剤スタンドオフと、該スタンドオフ開口と位置が調整された複数のマスク開口を有するマスクと、を有する工程と、
    前記マスク開口と前記スタンドオフ開口とを介して導電性ペーストを施し、前記第１の電気回路構造の前記複数の接触領域上に導電性バンプを形成する工程と、
    前記マスクを除去する工程と、
    第２の電気回路構造を前記スタンドオフ及び前記導電性バンプに取り付ける工程と、
    を有することを特徴とする方法。
  15. 請求項１４に記載の方法であって、
    前記第１の回路構造は、回路基板と、可撓性回路と、電気機械素子と、集積回路ダイと、半導体パッケージと、厚膜回路とセラミック回路基板と、から成る群の中の一つにより構成されることを特徴とする方法。
  16. 請求項１４に記載の方法であって、
    前記第２の回路構造は、回路基板と、可撓性回路と、電気機械素子と、集積回路ダイと、半導体パッケージと、厚膜回路とセラミック回路基板と、から成る群の中の一つにより構成されることを特徴とする方法。
  17. 請求項１４に記載の方法に従って製造された相互接続された電気回路構造。
JP2004156449A 2003-05-27 2004-05-26 電気的相互接続のためのスタンドオフ／マスク構造 Expired - Fee Related JP4401241B2 (ja)

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