CN100388468C - 支座和掩模结构、互联电路结构和其制造方法 - Google Patents

支座和掩模结构、互联电路结构和其制造方法 Download PDF

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Publication number
CN100388468C
CN100388468C CNB2004100459555A CN200410045955A CN100388468C CN 100388468 C CN100388468 C CN 100388468C CN B2004100459555 A CNB2004100459555 A CN B2004100459555A CN 200410045955 A CN200410045955 A CN 200410045955A CN 100388468 C CN100388468 C CN 100388468C
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mask
layer
standoff
support
adhesive
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CN1574475A (zh
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J·R·安德鲁斯
B·J·格尔纳
R·施马赫滕伯格三世
C·斯伦内斯
S·V·舒尔茨
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Xerox Corp
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Wire Bonding (AREA)
CNB2004100459555A 2003-05-27 2004-05-26 支座和掩模结构、互联电路结构和其制造方法 Expired - Fee Related CN100388468C (zh)

Applications Claiming Priority (2)

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US10/447169 2003-05-27
US10/447,169 US6998539B2 (en) 2003-05-27 2003-05-27 Standoff/mask structure for electrical interconnect

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CN100388468C true CN100388468C (zh) 2008-05-14

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JP (1) JP4401241B2 (enExample)
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JP5024342B2 (ja) * 2009-09-16 2012-09-12 株式会社村田製作所 回路モジュール
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KR101184792B1 (ko) * 2010-09-10 2012-09-20 삼성전기주식회사 범프 형성용 마스크 및 이의 제조 방법
TWI606565B (zh) * 2016-08-31 2017-11-21 金寶電子工業股份有限公司 封裝結構及其製作方法
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BRPI0401840A (pt) 2005-03-08
US6998539B2 (en) 2006-02-14
CN1574475A (zh) 2005-02-02
EP1482547A3 (en) 2009-08-19
JP4401241B2 (ja) 2010-01-20
JP2004356630A (ja) 2004-12-16
EP1482547A2 (en) 2004-12-01

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