JP4375968B2 - 導電性シリコーンおよびその製造方法 - Google Patents

導電性シリコーンおよびその製造方法 Download PDF

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Publication number
JP4375968B2
JP4375968B2 JP2002580347A JP2002580347A JP4375968B2 JP 4375968 B2 JP4375968 B2 JP 4375968B2 JP 2002580347 A JP2002580347 A JP 2002580347A JP 2002580347 A JP2002580347 A JP 2002580347A JP 4375968 B2 JP4375968 B2 JP 4375968B2
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Prior art keywords
organopolysiloxane
represented
less
conductive
cured silicone
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Japanese (ja)
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JP2004533501A5 (https=
JP2004533501A (ja
Inventor
ナライアン，スジャータ
ラント，マイケル
クビック，ダニエル，ジェイ．
ハミルトン，ジョン，エイ．
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ワールド プロパティーズ インク．
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
JP2002580347A 2001-04-06 2002-04-05 導電性シリコーンおよびその製造方法 Expired - Lifetime JP4375968B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28202701P 2001-04-06 2001-04-06
PCT/US2002/012765 WO2002082468A1 (en) 2001-04-06 2002-04-05 Electrically conductive silicones and method of manufacture thereof

Publications (3)

Publication Number Publication Date
JP2004533501A JP2004533501A (ja) 2004-11-04
JP2004533501A5 JP2004533501A5 (https=) 2008-01-10
JP4375968B2 true JP4375968B2 (ja) 2009-12-02

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JP2002580347A Expired - Lifetime JP4375968B2 (ja) 2001-04-06 2002-04-05 導電性シリコーンおよびその製造方法

Country Status (5)

Country Link
US (1) US6902688B2 (https=)
EP (1) EP1399928B1 (https=)
JP (1) JP4375968B2 (https=)
CN (1) CN1273994C (https=)
WO (1) WO2002082468A1 (https=)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
CN1656574A (zh) * 2002-04-01 2005-08-17 环球产权公司 导电的聚合物泡沫和弹性体及其制造方法
US6783692B2 (en) * 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
US7135767B2 (en) * 2003-07-29 2006-11-14 Agilent Technologies, Inc. Integrated circuit substrate material and method
JP2005286195A (ja) * 2004-03-30 2005-10-13 Geltec Co Ltd 押出し可能な架橋済グリース状電磁波吸収材、これを充填・封入した容器、その容器の製法、及びこれらを利用した電磁波吸収方法
EP1833289A1 (en) 2004-12-17 2007-09-12 Kabushiki Kaisha Fine Rubber Kenkyuusho Dielectric raw material, antenna device, portable phone and electromagnetic wave shielding body
WO2006064783A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 比誘電率の制御方法、誘電体、携帯電話機及び人体ファントムモデル
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
KR101271662B1 (ko) 2005-02-16 2013-06-05 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
EP1708317A3 (de) 2005-03-29 2007-11-14 Karl Ronald Schoeller Rollband-Kontakt-Einheit zur permanenten oder bewegungsabhängig intermittierenden galvanischen Verbindung zweier Systeme
US7988731B2 (en) 2005-04-25 2011-08-02 G & G Biotechnology Ltd Lightweight implantable prosthetic device
US20090162596A1 (en) * 2005-08-02 2009-06-25 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
US20100183814A1 (en) * 2005-08-02 2010-07-22 Victor Rios Silicone compositions, methods of manufacture, and articles formed therefrom
US20090162651A1 (en) * 2005-08-02 2009-06-25 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
WO2007018756A1 (en) 2005-08-04 2007-02-15 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US7589284B2 (en) * 2005-09-12 2009-09-15 Parker Hannifin Corporation Composite polymeric material for EMI shielding
CA2622559A1 (en) * 2005-09-16 2007-03-29 Hyperion Catalysis International, Inc. Conductive silicone and methods for preparing same
US8912268B2 (en) 2005-12-21 2014-12-16 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
US8084532B2 (en) * 2006-01-19 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
JP5178532B2 (ja) * 2006-02-02 2013-04-10 ダウ・コーニング・コーポレイション シリコーン樹脂フィルム、その調製方法、およびナノ材料充填シリコーン組成物
WO2007097835A2 (en) * 2006-02-20 2007-08-30 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
WO2008042056A1 (en) * 2006-10-05 2008-04-10 Dow Corning Corporation Silicone resin film and method of preparing same
US20100112321A1 (en) * 2007-02-06 2010-05-06 Dow Corning Corporation Silicone Resin, Silicone Composition, Coated Substrate, and Reinforced Silicone Resin Film
EP2117836B1 (en) * 2007-02-22 2012-11-07 Dow Corning Corporation Reinforced silicone resin films
WO2008103229A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
JP2010519381A (ja) * 2007-02-22 2010-06-03 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルムおよびその調製方法
WO2008103226A1 (en) 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
ATE474876T1 (de) * 2007-02-22 2010-08-15 Dow Corning Verfahren zur herstellung leitfähiger folien sowie in diesem verfahren hergestellte artikel
JP5250025B2 (ja) * 2007-05-01 2013-07-31 ダウ・コーニング・コーポレイション 強化シリコーン樹脂フィルム
US20100143686A1 (en) * 2007-05-01 2010-06-10 Bizhong Zhu Nanomaterial-Filled Silicone Composition and Reinforced Silicone Resin Film
KR20100070349A (ko) * 2007-10-12 2010-06-25 다우 코닝 코포레이션 강화 실리콘 수지 필름 및 나노섬유-충전된 실리콘 조성물
CN101412851B (zh) * 2008-11-25 2011-10-05 上海市合成树脂研究所 一种有机硅导电胶
US20120012382A1 (en) * 2009-05-13 2012-01-19 Laird Technologies, Inc. Conductive Films for EMI Shielding Applications
CA2770719C (en) * 2009-08-12 2017-12-12 Jonathan Bergin Fully-cured thermally or electrically-conductive form-in-place gap filler
WO2011086537A2 (en) * 2010-01-18 2011-07-21 G & G Biotechnology Ltd Lightweight breast implant material
US8355770B2 (en) * 2010-03-22 2013-01-15 Idt Technology Limited Conductive silicone material for human skin electrode
US8759692B2 (en) 2010-08-30 2014-06-24 Parker-Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications
US8766108B2 (en) 2010-08-30 2014-07-01 Parker Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications
US9049777B2 (en) * 2010-11-01 2015-06-02 Plastics Research Corporation EMI shielded thermoset article
CN102276988B (zh) * 2011-06-08 2012-10-31 北京工业大学 一种单组份Ni-C填充型FIP热硫化高导电硅橡胶及其制备方法
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
RU2522614C2 (ru) * 2012-07-11 2014-07-20 Федеральное государственное унитарное предприятие "Государственный ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (ФГУП "ГНИИХТЭОС") Способ улучшения адгезии к металлам силиконовых композиционных материалов, получаемых по реакции полиприсоединения
DE102012220700A1 (de) * 2012-11-13 2014-05-15 Wacker Chemie Ag Füllstoffhaltige Siliconzusammensetzungen
KR20150087194A (ko) * 2012-11-20 2015-07-29 요코하마 고무 가부시키가이샤 저온 소성용 도전성 조성물 및 태양 전지 셀
US9441086B2 (en) * 2012-12-20 2016-09-13 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
US9428680B2 (en) 2013-03-14 2016-08-30 Dow Corning Corporation Conductive silicone materials and uses
KR102250406B1 (ko) * 2013-03-14 2021-05-12 다우 실리콘즈 코포레이션 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스
CN103289410A (zh) * 2013-05-22 2013-09-11 吴江市德佐日用化学品有限公司 一种具有低压缩永久变形特性的导电硅橡胶
CN103351839A (zh) * 2013-07-23 2013-10-16 上海魁固塑胶制品有限公司 单组分脱胺型高导电硅橡胶及其制备方法
WO2015056374A1 (ja) * 2013-10-17 2015-04-23 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
AR099038A1 (es) 2014-01-08 2016-06-22 General Cable Tech Corp Conductor aéreo recubierto
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
US9741467B2 (en) * 2014-08-05 2017-08-22 General Cable Technologies Corporation Fluoro copolymer coatings for overhead conductors
ES2922986T3 (es) 2015-03-12 2022-09-22 G&G Biotechnology Ltd Material compuesto para implantes
MX392932B (es) 2015-11-13 2025-03-24 Gen Cable Technologies Corp Cables recubiertos con recubrimientos de fluorocopolímero.
CN109565137A (zh) 2016-05-31 2019-04-02 安费诺有限公司 高性能线缆终端装置
CN106085341B (zh) * 2016-06-12 2019-01-11 江苏明昊新材料科技股份有限公司 单组分硅酮导电银胶及其制备方法
CN106085340B (zh) * 2016-06-12 2019-01-11 江苏明昊新材料科技股份有限公司 具有触变特性的高导热导电银胶及其制备方法
US10191519B2 (en) * 2016-09-19 2019-01-29 Google Llc Electronic device with gasket sealing receptacle for tongue
US20190244722A1 (en) * 2016-10-24 2019-08-08 Luxembourg Institute Of Sceince And Technology (List) Method For Forming An Electrically Conductive Multilayer Coating With Anti-Corrosion Properties Onto A Metallic Substrate
CN108117757B (zh) * 2016-11-28 2021-06-04 天迈科技股份有限公司 具有导电与防水特性的多功能胶体
US10640232B2 (en) 2016-12-20 2020-05-05 The Boeing Company Conductive fastening system for composite structures
WO2019028373A1 (en) 2017-08-03 2019-02-07 Amphenol Corporation CABLE CONNECTOR FOR HIGH SPEED INTERCONNECTIONS
CN107364065B (zh) * 2017-08-14 2023-11-28 深圳市康利邦科技有限公司 曲面玻璃屏保护膜的一体成型加工工艺及其保护膜
EP3628704B1 (en) * 2017-12-08 2024-01-10 LG Chem, Ltd. Conductive silicone composition and silicone composite material manufactured thereby
WO2019135969A1 (en) * 2018-01-03 2019-07-11 Texting Tip LLC Fingernail tip stylus
US12053364B2 (en) 2018-02-18 2024-08-06 G & G Biotechnology Ltd Implants with enhanced shell adhesion
LU100768B1 (en) * 2018-04-18 2019-10-22 Luxembourg Inst Science & Tech List Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate
KR102540533B1 (ko) * 2018-06-01 2023-06-07 현대자동차주식회사 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품
CN109054729A (zh) * 2018-07-17 2018-12-21 泰州隆基乐叶光伏科技有限公司 一种湿/热双固化的导电胶及其制备方法
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
WO2020061988A1 (en) 2018-09-28 2020-04-02 Dow Silicones Corporation Liquid silicone rubber composition
EP3902861A1 (en) 2018-12-26 2021-11-03 Momentive Performance Materials Inc. Curable silicone-based compositions and applications thereof
KR102935990B1 (ko) 2018-12-26 2026-03-10 모멘티브 퍼포먼스 머티리얼즈 인크. 경화성 실리콘 기반 조성물 및 그 용도
KR102942509B1 (ko) 2018-12-26 2026-03-23 모멘티브 퍼포먼스 머티리얼즈 인크. 경화성 실리콘 기반 조성물 및 그 용도
KR102912731B1 (ko) * 2018-12-27 2026-01-16 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
US11137014B2 (en) 2019-01-08 2021-10-05 The Boeing Company Conductive fastening system and method for improved EME performance
US11437762B2 (en) 2019-02-22 2022-09-06 Amphenol Corporation High performance cable connector assembly
CN110294940A (zh) * 2019-06-28 2019-10-01 深圳市飞荣达科技股份有限公司 屏蔽衬垫及其制备方法
CN213862058U (zh) * 2020-04-09 2021-08-03 莱尔德技术股份有限公司 电磁干扰emi吸收体、雷达支架、汽车和汽车部件
US11454661B2 (en) 2020-11-05 2022-09-27 Amplifier Research Corp. Field probe
KR20230118078A (ko) 2020-12-04 2023-08-10 로저스코포레이션 열 폭주 방지용 다층 시트
CN112940510A (zh) * 2021-03-11 2021-06-11 广东思泉新材料股份有限公司 一种基于泡沫金属的三维骨架结构的致密导热硅胶复合材料及其制备方法
US12453500B2 (en) * 2021-05-11 2025-10-28 Purdue Research Foundation Poroelastic materials, biosensors comprising poroelastic materials, and methods of making and using poroelastic materials and biosensors
CN113338050A (zh) * 2021-06-07 2021-09-03 深圳先进电子材料国际创新研究院 一种耐高温金属化纤维布和导电硅胶复合材料及其制备方法和smt方面的用途
CN118176245A (zh) * 2021-11-01 2024-06-11 罗杰斯公司 填充有机硅泡沫层、组合物及其制造方法、以及包括填充有机硅泡沫层的制品
CN115260985A (zh) * 2022-08-26 2022-11-01 韦尔通(厦门)科技股份有限公司 一种双组份低粘度高导热灌封胶及其制备方法和应用
US12300888B2 (en) 2023-02-02 2025-05-13 Microsonic, Inc. System and method for attenuating radiation emissions from earpiece devices

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583930A (en) * 1968-04-16 1971-06-08 Chomerics Inc Plastics made conductive with coarse metal fillers
US4011360A (en) * 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
US4279783A (en) * 1979-04-04 1981-07-21 Dow Corning Corporation Electrically conductive silicone elastomers
JPS59199756A (ja) * 1983-04-27 1984-11-12 Toshiba Silicone Co Ltd 導電性シリコ−ンゴム組成物
JPS63117065A (ja) 1986-11-05 1988-05-21 Toshiba Silicone Co Ltd 室温硬化型導電性シリコ−ンゴム組成物
JPS63251464A (ja) * 1987-04-08 1988-10-18 Toray Silicone Co Ltd 導電性シリコ−ンゴム粒状物
JP2618663B2 (ja) 1987-11-30 1997-06-11 東レ・ダウコーニング・シリコーン株式会社 磁性シリコーンゴム粉状物の製造方法
CA2000787A1 (en) 1988-11-04 1990-05-04 Richard L. Cole Electrically conductive silicone compositions
US5075038A (en) * 1988-11-04 1991-12-24 Dow Corning Corporation Electrically conductive silicone compositions
JPH05325647A (ja) 1991-03-29 1993-12-10 Siegel:Kk シリコーンゲル多孔質導電体並びにその製造方法
JP3084380B2 (ja) 1991-06-06 2000-09-04 株式会社ジェルテック 導電性シリコーンゲル材の使用方法と改質方法
US5182050A (en) * 1991-10-24 1993-01-26 Amp Incorporated Extrinsically/intrinsically conductive gel
JP3318338B2 (ja) 1992-02-28 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 導電性ポリオルガノシロキサン組成物の製造方法
JPH05271548A (ja) * 1992-03-27 1993-10-19 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物及びその硬化物の形成方法
US5366664A (en) * 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
DE4320527A1 (de) * 1992-06-22 1993-12-23 Whitaker Corp Elektrisch leitfähiges Gel
JPH06144951A (ja) 1992-11-11 1994-05-24 Hiroyuki Kobayashi セラミックス発泡体とその製造方法
US5498644A (en) * 1993-09-10 1996-03-12 Specialty Silicone Products, Inc. Silcone elastomer incorporating electrically conductive microballoons and method for producing same
CA2129073C (en) 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
JP2868986B2 (ja) 1993-10-06 1999-03-10 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP2819444B2 (ja) 1993-11-08 1998-10-30 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
JP3950493B2 (ja) * 1996-04-26 2007-08-01 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
JP3436464B2 (ja) * 1996-10-31 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
US5928569A (en) * 1997-02-26 1999-07-27 Specialty Silicone Products, Inc. Substantially uniform moldable blends of silver particulate and organopolysiloxane
US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
JP3922332B2 (ja) * 2000-01-17 2007-05-30 信越化学工業株式会社 導電性液状シリコーンゴム組成物
JP3810976B2 (ja) * 2000-02-15 2006-08-16 株式会社小糸製作所 自動車用赤外光照射ランプ

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US20030047718A1 (en) 2003-03-13
WO2002082468A1 (en) 2002-10-17
EP1399928A1 (en) 2004-03-24
EP1399928B1 (en) 2012-06-13
CN1273994C (zh) 2006-09-06
JP2004533501A (ja) 2004-11-04
CN1528000A (zh) 2004-09-08

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