JP4291709B2 - 直線移動機構およびこれを用いた搬送ロボット - Google Patents

直線移動機構およびこれを用いた搬送ロボット Download PDF

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Publication number
JP4291709B2
JP4291709B2 JP2004052902A JP2004052902A JP4291709B2 JP 4291709 B2 JP4291709 B2 JP 4291709B2 JP 2004052902 A JP2004052902 A JP 2004052902A JP 2004052902 A JP2004052902 A JP 2004052902A JP 4291709 B2 JP4291709 B2 JP 4291709B2
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Japan
Prior art keywords
vertical axis
link arm
moving member
moving
link
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Expired - Fee Related
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JP2004052902A
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English (en)
Japanese (ja)
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JP2005125479A (ja
JP2005125479A5 (enExample
Inventor
弘敬 小川
隆文 浦谷
正之 菅根
剛之 松崎
直也 村田
幸紀子 宇野
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Daihen Corp
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Daihen Corp
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Filing date
Publication date
Application filed by Daihen Corp filed Critical Daihen Corp
Priority to JP2004052902A priority Critical patent/JP4291709B2/ja
Priority to US10/825,267 priority patent/US7306423B2/en
Publication of JP2005125479A publication Critical patent/JP2005125479A/ja
Publication of JP2005125479A5 publication Critical patent/JP2005125479A5/ja
Application granted granted Critical
Publication of JP4291709B2 publication Critical patent/JP4291709B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/13—Handlers utilizing parallel links
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Transmission Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004052902A 2003-04-16 2004-02-27 直線移動機構およびこれを用いた搬送ロボット Expired - Fee Related JP4291709B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004052902A JP4291709B2 (ja) 2003-04-16 2004-02-27 直線移動機構およびこれを用いた搬送ロボット
US10/825,267 US7306423B2 (en) 2003-04-16 2004-04-14 Linear moving mechanism and transfer robot using the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003111967 2003-04-16
JP2003341137 2003-09-30
JP2004052902A JP4291709B2 (ja) 2003-04-16 2004-02-27 直線移動機構およびこれを用いた搬送ロボット

Publications (3)

Publication Number Publication Date
JP2005125479A JP2005125479A (ja) 2005-05-19
JP2005125479A5 JP2005125479A5 (enExample) 2007-03-08
JP4291709B2 true JP4291709B2 (ja) 2009-07-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004052902A Expired - Fee Related JP4291709B2 (ja) 2003-04-16 2004-02-27 直線移動機構およびこれを用いた搬送ロボット

Country Status (2)

Country Link
US (1) US7306423B2 (enExample)
JP (1) JP4291709B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023177257A (ja) * 2022-05-31 2023-12-13 智▲ウェイ▼資訊科技股▲ふん▼有限公司 体感シミュレート裝置及び作動システム

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JP4490341B2 (ja) * 2005-07-05 2010-06-23 株式会社ダイヘン リンク装置および搬送ロボット
JP4440178B2 (ja) * 2005-07-25 2010-03-24 東京エレクトロン株式会社 基板の搬送装置
JP4666215B2 (ja) * 2005-08-10 2011-04-06 株式会社ダイフク 物品搬送装置
JP4697791B2 (ja) * 2005-11-07 2011-06-08 株式会社アルバック 基板搬送装置
JP2007250196A (ja) * 2006-03-13 2007-09-27 Ricoh Co Ltd 搬送装置及び真空プロセス装置
DE102006038505A1 (de) * 2006-08-16 2008-02-21 Kmb Produktions Ag Vorrichtung zum Versetzen von Gegenständen
JP5041207B2 (ja) * 2006-11-14 2012-10-03 株式会社ダイフク 物品搬送設備
WO2008120294A1 (ja) 2007-03-02 2008-10-09 Daihen Corporation 搬送装置
JP5075459B2 (ja) * 2007-04-17 2012-11-21 株式会社アルバック 搬送装置
WO2008126556A1 (ja) * 2007-04-05 2008-10-23 Ulvac, Inc. 搬送装置
JP5171093B2 (ja) * 2007-04-05 2013-03-27 株式会社アルバック 搬送装置
JP4950745B2 (ja) * 2007-04-19 2012-06-13 株式会社ダイヘン 搬送装置
JP4908306B2 (ja) * 2007-05-10 2012-04-04 株式会社ダイヘン 搬送装置
CN101730613B (zh) * 2007-05-15 2013-11-06 株式会社爱发科 搬送装置及使用该搬送装置的真空处理装置
JP4971063B2 (ja) 2007-07-27 2012-07-11 株式会社ダイヘン 搬送装置
JP4824645B2 (ja) * 2007-08-03 2011-11-30 株式会社アルバック 基板搬送装置
JP4918430B2 (ja) * 2007-08-03 2012-04-18 株式会社アルバック 基板搬送装置
JP4824648B2 (ja) * 2007-08-07 2011-11-30 株式会社アルバック 基板搬送装置
DE102007039398B4 (de) * 2007-08-21 2009-11-12 Saadat, Mohammad Mohsen, Prof. Dr.-Ing. Greifmechanismus für Roboter, Maschinen und Handhabungsgeräte
CN101417747B (zh) * 2008-12-11 2011-11-23 友达光电股份有限公司 传送台机构
US8285418B2 (en) * 2009-07-23 2012-10-09 Kla-Tencor Corporation Dual scanning stage
JP5419581B2 (ja) * 2009-07-31 2014-02-19 東京エレクトロン株式会社 搬送機構の組み立て方法および搬送室
USD639323S1 (en) * 2010-05-06 2011-06-07 Ulvac, Inc. Vacuum transfer robot
USRE44567E1 (en) * 2009-11-17 2013-11-05 Ulvac, Inc. Vacuum transfer robot
USD625748S1 (en) * 2010-05-06 2010-10-19 Ulvac, Inc. Vacuum transfer robot
USRE43781E1 (en) * 2009-11-17 2012-11-06 Ulvac, Inc. Vacuum transfer robot
CN102092045B (zh) * 2009-12-15 2012-09-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种基片处理系统及其机械手臂装置
TWI395633B (zh) * 2010-04-23 2013-05-11 私立中原大學 肘節式定位平台
GB2486486A (en) * 2010-12-17 2012-06-20 Uhv Design Ltd Work piece transfer mechanism with a linear stroke
CN102530556B (zh) * 2010-12-20 2015-06-24 理想能源设备(上海)有限公司 基板传输装置、基板传输方法及基板传输系统
EP2469339B1 (en) 2010-12-21 2017-08-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2012218144A (ja) * 2011-04-11 2012-11-12 Komiyama Electron Co Ltd 搬送装置
CN202072285U (zh) * 2011-05-24 2011-12-14 深圳市华星光电技术有限公司 面板传送装置及其面板支撑机构
EP3360809B1 (en) * 2011-10-24 2019-12-11 Remedi Technology Holdings, LLC Packaging system for pharmaceutical dispenser and associated method
JP5663638B2 (ja) 2012-10-11 2015-02-04 株式会社ティーイーエス 基板移送装置
CN103811385B (zh) * 2012-11-08 2016-06-29 沈阳新松机器人自动化股份有限公司 一种用于运送晶圆的机械手机构
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
US9149936B2 (en) * 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
JP6063776B2 (ja) * 2013-03-04 2017-01-18 東京エレクトロン株式会社 基板搬送経路の決定方法、基板搬送装置、基板処理装置及びプログラム
KR101515908B1 (ko) 2013-07-29 2015-04-29 주식회사 티이에스 기판이송장치
CN113270350A (zh) * 2014-01-17 2021-08-17 布鲁克斯自动化公司 衬底运输设备
JP6276090B2 (ja) * 2014-03-31 2018-02-07 株式会社ダイヘン 搬送装置、搬送システム
JP6474971B2 (ja) * 2014-07-03 2019-02-27 株式会社ダイヘン ワーク搬送装置
WO2016145305A2 (en) 2015-03-12 2016-09-15 Persimmon Technologies, Corp. Robot with slaved end effector motion
US10470841B2 (en) 2017-03-28 2019-11-12 Steris Inc. Robot-based rack processing system
JP1612908S (enExample) * 2018-03-29 2018-09-03
JP1612766S (enExample) * 2018-03-29 2018-09-03
JP1612912S (enExample) * 2018-03-29 2018-09-03
JP1619125S (enExample) * 2018-03-29 2018-11-26
USD892881S1 (en) * 2018-03-29 2020-08-11 Daihen Corporation Power transmission unit and power receiving unit of an industrial robot arm
TWI758595B (zh) 2018-03-31 2022-03-21 日商平田機工股份有限公司 腔室構造
CN110960807B (zh) * 2019-12-05 2022-03-04 上海联影医疗科技股份有限公司 一种医用直线加速器系统
JP7578486B2 (ja) * 2020-12-28 2024-11-06 ニデックインスツルメンツ株式会社 産業用ロボット
KR102348261B1 (ko) * 2021-05-31 2022-01-10 (주) 티로보틱스 진공 챔버에서 기판을 이송하기 위한 기판 이송 로봇

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
JP2023177257A (ja) * 2022-05-31 2023-12-13 智▲ウェイ▼資訊科技股▲ふん▼有限公司 体感シミュレート裝置及び作動システム
JP7510213B2 (ja) 2022-05-31 2024-07-03 智▲ウェイ▼資訊科技股▲ふん▼有限公司 体感シミュレート裝置及び作動システム

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US7306423B2 (en) 2007-12-11
JP2005125479A (ja) 2005-05-19
US20050036877A1 (en) 2005-02-17

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