JP4264823B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4264823B2
JP4264823B2 JP2004064071A JP2004064071A JP4264823B2 JP 4264823 B2 JP4264823 B2 JP 4264823B2 JP 2004064071 A JP2004064071 A JP 2004064071A JP 2004064071 A JP2004064071 A JP 2004064071A JP 4264823 B2 JP4264823 B2 JP 4264823B2
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Japan
Prior art keywords
insulating film
forming step
layer
sealing layer
semiconductor device
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Expired - Lifetime
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JP2004064071A
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English (en)
Japanese (ja)
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JP2005252169A (ja
JP2005252169A5 (enExample
Inventor
健二 長崎
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Lapis Semiconductor Co Ltd
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Oki Semiconductor Co Ltd
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Priority to JP2004064071A priority Critical patent/JP4264823B2/ja
Priority to US10/980,316 priority patent/US7122910B2/en
Priority to CN2004100974363A priority patent/CN1667801B/zh
Publication of JP2005252169A publication Critical patent/JP2005252169A/ja
Priority to US11/511,267 priority patent/US7687320B2/en
Publication of JP2005252169A5 publication Critical patent/JP2005252169A5/ja
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Publication of JP4264823B2 publication Critical patent/JP4264823B2/ja
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2004064071A 2004-03-08 2004-03-08 半導体装置の製造方法 Expired - Lifetime JP4264823B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004064071A JP4264823B2 (ja) 2004-03-08 2004-03-08 半導体装置の製造方法
US10/980,316 US7122910B2 (en) 2004-03-08 2004-11-04 Packaged semiconductor device
CN2004100974363A CN1667801B (zh) 2004-03-08 2004-11-15 半导体装置及其制造方法
US11/511,267 US7687320B2 (en) 2004-03-08 2006-08-29 Manufacturing method for packaged semiconductor device

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Application Number Priority Date Filing Date Title
JP2004064071A JP4264823B2 (ja) 2004-03-08 2004-03-08 半導体装置の製造方法

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JP2005252169A JP2005252169A (ja) 2005-09-15
JP2005252169A5 JP2005252169A5 (enExample) 2006-10-05
JP4264823B2 true JP4264823B2 (ja) 2009-05-20

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CN (1) CN1667801B (enExample)

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Publication number Priority date Publication date Assignee Title
WO2006054606A1 (ja) 2004-11-16 2006-05-26 Rohm Co., Ltd. 半導体装置および半導体装置の製造方法
JP4057017B2 (ja) * 2005-01-31 2008-03-05 富士通株式会社 電子装置及びその製造方法
JP4193897B2 (ja) * 2006-05-19 2008-12-10 カシオ計算機株式会社 半導体装置およびその製造方法
KR20080085380A (ko) * 2007-03-19 2008-09-24 삼성전자주식회사 재배선층을 구비하는 반도체 패키지 및 그의 제조방법
KR20090042574A (ko) * 2007-10-26 2009-04-30 삼성전자주식회사 반도체 모듈 및 이를 구비하는 전자 장치
JP5801989B2 (ja) * 2008-08-20 2015-10-28 ラピスセミコンダクタ株式会社 半導体装置および半導体装置の製造方法
JP5135246B2 (ja) 2009-01-30 2013-02-06 三洋電機株式会社 半導体モジュールおよびその製造方法、ならびに携帯機器
US10756040B2 (en) * 2017-02-13 2020-08-25 Mediatek Inc. Semiconductor package with rigid under bump metallurgy (UBM) stack
KR102543869B1 (ko) * 2018-08-07 2023-06-14 삼성전자주식회사 반도체 장치 및 이를 포함하는 반도체 패키지
KR102378837B1 (ko) * 2018-08-24 2022-03-24 삼성전자주식회사 반도체 장치 및 이를 포함하는 반도체 패키지

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