CN1667801A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
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- CN1667801A CN1667801A CNA2004100974363A CN200410097436A CN1667801A CN 1667801 A CN1667801 A CN 1667801A CN A2004100974363 A CNA2004100974363 A CN A2004100974363A CN 200410097436 A CN200410097436 A CN 200410097436A CN 1667801 A CN1667801 A CN 1667801A
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP64071/2004 | 2004-03-08 | ||
JP2004064071A JP4264823B2 (ja) | 2004-03-08 | 2004-03-08 | 半導体装置の製造方法 |
JP64071/04 | 2004-03-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1667801A true CN1667801A (zh) | 2005-09-14 |
CN1667801B CN1667801B (zh) | 2013-06-12 |
Family
ID=34909341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100974363A Active CN1667801B (zh) | 2004-03-08 | 2004-11-15 | 半导体装置及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7122910B2 (zh) |
JP (1) | JP4264823B2 (zh) |
CN (1) | CN1667801B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102306635A (zh) * | 2004-11-16 | 2012-01-04 | 罗姆股份有限公司 | 半导体装置及半导体装置的制造方法 |
CN102176433B (zh) * | 2006-05-19 | 2013-03-20 | 兆装微股份有限公司 | 具有低介电性绝缘膜的半导体器件及其制造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4057017B2 (ja) * | 2005-01-31 | 2008-03-05 | 富士通株式会社 | 電子装置及びその製造方法 |
KR20080085380A (ko) * | 2007-03-19 | 2008-09-24 | 삼성전자주식회사 | 재배선층을 구비하는 반도체 패키지 및 그의 제조방법 |
KR20090042574A (ko) * | 2007-10-26 | 2009-04-30 | 삼성전자주식회사 | 반도체 모듈 및 이를 구비하는 전자 장치 |
JP5801989B2 (ja) * | 2008-08-20 | 2015-10-28 | ラピスセミコンダクタ株式会社 | 半導体装置および半導体装置の製造方法 |
JP5135246B2 (ja) * | 2009-01-30 | 2013-02-06 | 三洋電機株式会社 | 半導体モジュールおよびその製造方法、ならびに携帯機器 |
US10756040B2 (en) * | 2017-02-13 | 2020-08-25 | Mediatek Inc. | Semiconductor package with rigid under bump metallurgy (UBM) stack |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582511A (ja) | 1991-09-19 | 1993-04-02 | Oki Electric Ind Co Ltd | 半導体素子およびその製造方法 |
CN1146976C (zh) * | 1997-10-30 | 2004-04-21 | 株式会社日产制作所 | 半导体装置及其制造方法 |
KR100269540B1 (ko) | 1998-08-28 | 2000-10-16 | 윤종용 | 웨이퍼 상태에서의 칩 스케일 패키지 제조 방법 |
US6181569B1 (en) * | 1999-06-07 | 2001-01-30 | Kishore K. Chakravorty | Low cost chip size package and method of fabricating the same |
JP2001168126A (ja) | 1999-12-06 | 2001-06-22 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
JP2001230341A (ja) * | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体装置 |
JP2001237348A (ja) | 2000-02-23 | 2001-08-31 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3792545B2 (ja) | 2001-07-09 | 2006-07-05 | カシオ計算機株式会社 | 半導体装置の製造方法 |
JP2003124392A (ja) | 2001-10-15 | 2003-04-25 | Sony Corp | 半導体装置及びその製造方法 |
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2004
- 2004-03-08 JP JP2004064071A patent/JP4264823B2/ja not_active Expired - Lifetime
- 2004-11-04 US US10/980,316 patent/US7122910B2/en active Active
- 2004-11-15 CN CN2004100974363A patent/CN1667801B/zh active Active
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2006
- 2006-08-29 US US11/511,267 patent/US7687320B2/en active Active
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102306635A (zh) * | 2004-11-16 | 2012-01-04 | 罗姆股份有限公司 | 半导体装置及半导体装置的制造方法 |
US8575764B2 (en) | 2004-11-16 | 2013-11-05 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US8786106B2 (en) | 2004-11-16 | 2014-07-22 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US8928156B2 (en) | 2004-11-16 | 2015-01-06 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US9111819B2 (en) | 2004-11-16 | 2015-08-18 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
CN102306635B (zh) * | 2004-11-16 | 2015-09-09 | 罗姆股份有限公司 | 半导体装置及半导体装置的制造方法 |
US9312228B2 (en) | 2004-11-16 | 2016-04-12 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US9601441B2 (en) | 2004-11-16 | 2017-03-21 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US10431516B2 (en) | 2004-11-16 | 2019-10-01 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US11069591B2 (en) | 2004-11-16 | 2021-07-20 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
US12057362B2 (en) | 2004-11-16 | 2024-08-06 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
CN102176433B (zh) * | 2006-05-19 | 2013-03-20 | 兆装微股份有限公司 | 具有低介电性绝缘膜的半导体器件及其制造方法 |
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US7687320B2 (en) | 2010-03-30 |
US20050194684A1 (en) | 2005-09-08 |
US7122910B2 (en) | 2006-10-17 |
US20060292742A1 (en) | 2006-12-28 |
JP4264823B2 (ja) | 2009-05-20 |
JP2005252169A (ja) | 2005-09-15 |
CN1667801B (zh) | 2013-06-12 |
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