JP4256256B2 - 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 - Google Patents

硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 Download PDF

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Publication number
JP4256256B2
JP4256256B2 JP2003504815A JP2003504815A JP4256256B2 JP 4256256 B2 JP4256256 B2 JP 4256256B2 JP 2003504815 A JP2003504815 A JP 2003504815A JP 2003504815 A JP2003504815 A JP 2003504815A JP 4256256 B2 JP4256256 B2 JP 4256256B2
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circuit board
hard
area
rigid
areas
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Expired - Fee Related
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JP2003504815A
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Japanese (ja)
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JP2004533879A5 (enExample
JP2004533879A (ja
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アブニ,ドブ
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Given Imaging Ltd
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Given Imaging Ltd
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/0002Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
    • A61B5/0031Implanted circuitry
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/041Capsule endoscopes for imaging
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Surgery (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Veterinary Medicine (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Radiology & Medical Imaging (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Endoscopes (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
JP2003504815A 2001-06-18 2002-06-18 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 Expired - Fee Related JP4256256B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29838701P 2001-06-18 2001-06-18
PCT/IL2002/000480 WO2002102224A2 (en) 2001-06-18 2002-06-18 In vivo sensing device with a circuit board having rigid sections and flexible sections

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006160087A Division JP4751772B2 (ja) 2001-06-18 2006-06-08 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置

Publications (3)

Publication Number Publication Date
JP2004533879A JP2004533879A (ja) 2004-11-11
JP2004533879A5 JP2004533879A5 (enExample) 2007-04-05
JP4256256B2 true JP4256256B2 (ja) 2009-04-22

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ID=23150276

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003504815A Expired - Fee Related JP4256256B2 (ja) 2001-06-18 2002-06-18 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置
JP2006160087A Expired - Fee Related JP4751772B2 (ja) 2001-06-18 2006-06-08 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006160087A Expired - Fee Related JP4751772B2 (ja) 2001-06-18 2006-06-08 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置

Country Status (8)

Country Link
US (1) US7998065B2 (enExample)
EP (2) EP1418833B1 (enExample)
JP (2) JP4256256B2 (enExample)
AT (2) ATE404114T1 (enExample)
AU (1) AU2002311613A1 (enExample)
DE (1) DE60228266D1 (enExample)
IL (2) IL159450A0 (enExample)
WO (1) WO2002102224A2 (enExample)

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* Cited by examiner, † Cited by third party
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EP1418833B1 (en) 2008-08-13
IL159450A0 (en) 2004-06-01
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US20040171914A1 (en) 2004-09-02
EP1982636A1 (en) 2008-10-22
DE60228266D1 (de) 2008-09-25
JP2006297119A (ja) 2006-11-02
EP1982636B2 (en) 2016-09-07
AU2002311613A1 (en) 2003-01-02
WO2002102224A2 (en) 2002-12-27
EP1418833A4 (en) 2005-04-13
ATE546086T1 (de) 2012-03-15
JP2004533879A (ja) 2004-11-11
ATE404114T1 (de) 2008-08-15
EP1982636B1 (en) 2012-02-22
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