JP4256256B2 - 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 - Google Patents
硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 Download PDFInfo
- Publication number
- JP4256256B2 JP4256256B2 JP2003504815A JP2003504815A JP4256256B2 JP 4256256 B2 JP4256256 B2 JP 4256256B2 JP 2003504815 A JP2003504815 A JP 2003504815A JP 2003504815 A JP2003504815 A JP 2003504815A JP 4256256 B2 JP4256256 B2 JP 4256256B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hard
- area
- rigid
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001727 in vivo Methods 0.000 title claims abstract description 11
- 238000005286 illumination Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 230000009747 swallowing Effects 0.000 claims 1
- 239000002775 capsule Substances 0.000 abstract description 15
- 238000003384 imaging method Methods 0.000 description 12
- 238000011503 in vivo imaging Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 210000001035 gastrointestinal tract Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0002—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
- A61B5/0031—Implanted circuitry
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/041—Capsule endoscopes for imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Surgery (AREA)
- Medical Informatics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Animal Behavior & Ethology (AREA)
- Public Health (AREA)
- Optics & Photonics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Radiology & Medical Imaging (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Endoscopes (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29838701P | 2001-06-18 | 2001-06-18 | |
| PCT/IL2002/000480 WO2002102224A2 (en) | 2001-06-18 | 2002-06-18 | In vivo sensing device with a circuit board having rigid sections and flexible sections |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006160087A Division JP4751772B2 (ja) | 2001-06-18 | 2006-06-08 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004533879A JP2004533879A (ja) | 2004-11-11 |
| JP2004533879A5 JP2004533879A5 (enExample) | 2007-04-05 |
| JP4256256B2 true JP4256256B2 (ja) | 2009-04-22 |
Family
ID=23150276
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003504815A Expired - Fee Related JP4256256B2 (ja) | 2001-06-18 | 2002-06-18 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
| JP2006160087A Expired - Fee Related JP4751772B2 (ja) | 2001-06-18 | 2006-06-08 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006160087A Expired - Fee Related JP4751772B2 (ja) | 2001-06-18 | 2006-06-08 | 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7998065B2 (enExample) |
| EP (2) | EP1418833B1 (enExample) |
| JP (2) | JP4256256B2 (enExample) |
| AT (2) | ATE404114T1 (enExample) |
| AU (1) | AU2002311613A1 (enExample) |
| DE (1) | DE60228266D1 (enExample) |
| IL (2) | IL159450A0 (enExample) |
| WO (1) | WO2002102224A2 (enExample) |
Families Citing this family (134)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7996067B2 (en) * | 1999-06-15 | 2011-08-09 | Given Imaging Ltd. | In-vivo imaging device, optical system and method |
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| US7106367B2 (en) * | 2002-05-13 | 2006-09-12 | Micron Technology, Inc. | Integrated CMOS imager and microcontroller |
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- 2002-06-18 EP EP02738602A patent/EP1418833B1/en not_active Expired - Lifetime
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- 2002-06-18 IL IL15945002A patent/IL159450A0/xx unknown
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- 2002-06-18 US US10/481,126 patent/US7998065B2/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4751772B2 (ja) | 2011-08-17 |
| EP1418833B1 (en) | 2008-08-13 |
| IL159450A0 (en) | 2004-06-01 |
| EP1418833A2 (en) | 2004-05-19 |
| US20040171914A1 (en) | 2004-09-02 |
| EP1982636A1 (en) | 2008-10-22 |
| DE60228266D1 (de) | 2008-09-25 |
| JP2006297119A (ja) | 2006-11-02 |
| EP1982636B2 (en) | 2016-09-07 |
| AU2002311613A1 (en) | 2003-01-02 |
| WO2002102224A2 (en) | 2002-12-27 |
| EP1418833A4 (en) | 2005-04-13 |
| ATE546086T1 (de) | 2012-03-15 |
| JP2004533879A (ja) | 2004-11-11 |
| ATE404114T1 (de) | 2008-08-15 |
| EP1982636B1 (en) | 2012-02-22 |
| IL159450A (en) | 2009-09-22 |
| WO2002102224A3 (en) | 2004-03-11 |
| US7998065B2 (en) | 2011-08-16 |
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