JP4160598B2 - 触媒前駆体樹脂組成物及びこれを利用した透光性電磁波遮蔽材の製造方法 - Google Patents
触媒前駆体樹脂組成物及びこれを利用した透光性電磁波遮蔽材の製造方法 Download PDFInfo
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- JP4160598B2 JP4160598B2 JP2005518227A JP2005518227A JP4160598B2 JP 4160598 B2 JP4160598 B2 JP 4160598B2 JP 2005518227 A JP2005518227 A JP 2005518227A JP 2005518227 A JP2005518227 A JP 2005518227A JP 4160598 B2 JP4160598 B2 JP 4160598B2
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- catalyst precursor
- resin composition
- acrylate
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- precursor resin
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- Expired - Lifetime
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- 239000012018 catalyst precursor Substances 0.000 title claims abstract description 88
- 239000000463 material Substances 0.000 title claims abstract description 50
- 239000011342 resin composition Substances 0.000 title claims description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 claims abstract description 32
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 239000000178 monomer Substances 0.000 claims abstract description 17
- 238000007772 electroless plating Methods 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 65
- 238000004070 electrodeposition Methods 0.000 claims description 47
- 229920000642 polymer Polymers 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000007639 printing Methods 0.000 claims description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 16
- 239000003999 initiator Substances 0.000 claims description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 12
- 150000002894 organic compounds Chemical class 0.000 claims description 12
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 6
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 claims description 4
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- 150000001336 alkenes Chemical group 0.000 claims description 3
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- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 claims description 3
- 125000004386 diacrylate group Chemical group 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical group OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 claims description 3
- JKDRQYIYVJVOPF-FDGPNNRMSA-L palladium(ii) acetylacetonate Chemical compound [Pd+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O JKDRQYIYVJVOPF-FDGPNNRMSA-L 0.000 claims description 3
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- MXFQRSUWYYSPOC-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical class C=CC(=O)OCC(C)(C)COC(=O)C=C MXFQRSUWYYSPOC-UHFFFAOYSA-N 0.000 claims description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 claims description 2
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- -1 benzyl dimethyl ketal Chemical compound 0.000 claims description 2
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 claims description 2
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 claims description 2
- WGOQVOGFDLVJAW-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCOC(N)=O WGOQVOGFDLVJAW-UHFFFAOYSA-N 0.000 claims description 2
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- 229940065472 octyl acrylate Drugs 0.000 claims description 2
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- PZKNFJIOIKQCPA-UHFFFAOYSA-N oxalic acid palladium Chemical compound [Pd].OC(=O)C(O)=O PZKNFJIOIKQCPA-UHFFFAOYSA-N 0.000 claims description 2
- PBDBXAQKXCXZCJ-UHFFFAOYSA-L palladium(2+);2,2,2-trifluoroacetate Chemical compound [Pd+2].[O-]C(=O)C(F)(F)F.[O-]C(=O)C(F)(F)F PBDBXAQKXCXZCJ-UHFFFAOYSA-L 0.000 claims description 2
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
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- 239000010949 copper Substances 0.000 description 10
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- 239000000126 substance Substances 0.000 description 8
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
- H01J2211/446—Electromagnetic shielding means; Antistatic means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
したがって、プラズマディスプレイパネルの駆動時に発生する電磁波などの有害波長を遮断するためにフィルターの設置が必須であり、そのフィルターは、ガラス上に、反射防止フィルム(ARフィルム)、近赤外線遮蔽層(NIRフィルム)、ネオン−カット層、電磁波遮蔽フィルム(EMIフィルム)などの複数のフィルムが積層された構造を有する。
本発明者等は、非電着性メッキ触媒の前駆物質として、VIIIB族又はIB族金属の有機又は無機化合物を溶媒に溶解した混合物を、基材に対して優れた付着力を示すことができる紫外線硬化型樹脂と混合して触媒前駆体樹脂組成物を製造した。この触媒前駆体樹脂組成物を非電着性メッキ反応の触媒として製造された透光性電磁波遮蔽材は、基材との付着力に優れた紫外線硬化型樹脂を使用するので、別途に基材を前処理する必要がないので電磁波遮蔽材の製造方法が簡単になり、製造単価を減少できるので経済的であるという点を見出し、本発明を完成するのに至った。
基材に格子状の触媒前駆体樹脂組成物パターンを印刷、乾燥し、紫外線を照射して硬化した後、非電着性メッキを実施すれば透光性伝導膜が形成される。この時、触媒前駆体樹脂組成物に溶解されている触媒前駆物質は、紫外線照射によって開始される反応を通じて非電着性メッキに適した触媒形態に変換される。
本発明の触媒前駆体樹脂組成物において、前記(a)反応性低重合体は、反応性、粘度、表面光沢、付着性、耐薬品性、及び耐汚染性など、触媒前駆体樹脂組成物の基本物性を決定する物質である。
イ.触媒前駆体樹脂組成物の製造
15gのパラジウムアセテートと35gのIrgacure 184を400gのメチルエチルケトンに溶解して溶液を作った。この溶液を攪拌しながら、反応性単量体として300gのトリプロピレングリコールジアクリレートと100gのペンタエリスリトルトリアクリレートを加え、溶液を製造した。この溶液が均一となった後、反応性低重合体として600gの脂肪族ウレタンアクリレート(Ebecryl 264、SK−ucb)を前記溶液に加えた。均一な溶液が生成されるまで攪拌して触媒前駆体組成物を製造した。製造された触媒前駆体樹脂組成物の粘度は室温で298cpsであった。
製造された触媒前駆体樹脂組成物を、グラビア印刷方法でポリエステル基材(SH34、SKC)に格子状パターンに印刷した。印刷された格子は線幅30μm、線間の間隔300μmの正四角形パターンであった。赤外線ランプで基材を80℃で1分間加熱して溶媒を乾燥させた後、直ちに紫外線を照射した。2分経過後、触媒前駆体樹脂組成物は硬化されて固体状になり、硬化された固体はパラジウムの銀灰色を示した。
紫外線を照射した基材を50℃の非電着性ニッケルメッキ溶液に浸漬した。5分経過後、印刷されたパターン表面で水素気体が発生した。これで非電着性ニッケル還元反応が開始されたことが分かった。30分がさらに経過した後、6μm厚さのニッケルがパターン表面に選択的に付着した。Nichiban tape testの結果、非電着性ニッケルメッキ層と基材は99/100の付着力を示した。完成された透光性電磁波遮蔽材の表面抵抗は120Ω/sq、光線透過率は78%であった。
イ.触媒前駆体樹脂組成物の製造
20gのパラジウムアセチルアセトネートと30gのIrgacure 184、及び5gのIrgacure TPOを400gのクロロホルムに溶解して溶液を製造した。この溶液を攪拌しながら、反応性単量体として、200gの1,6−ヘキサンジオールジアクリレート、250gのジプロピレングリコールジアクリレート、150gのトリエチレングリコールジアクリレート、及び300gのオクチル/デシルアクリレートを加えた。均一に混合し後、反応性低重合体として、100gのポリエステルアクリレート(CN2200、Sartomer)を添加して混合溶液を製造した。この混合溶液が均一となるまで攪拌して触媒前駆体樹脂組成物を製造した。製造された触媒前駆体樹脂組成物の粘度は室温で4.1cpsであった。
内部が空のインクジェット用インキカートリッジに調製された触媒前駆体樹脂組成物を注入した後、インクジェットプリンターに装着した。用いたプリンターとインキカートリッジは、Epson社のStylus980プリンターとT003インキカートリッジであった。格子状パターンはAutodesk社のAutoCAD2002を用い、コンピュータ上で線幅40μm、線間の間隔400μmの正四角形形態に作った。コンピュータを触媒前駆体樹脂組成物が注入されているプリンターに連結した後、ポリエステル基材に格子状パターンを印刷した。印刷後、赤外線ランプで基材を65℃で1分間加熱して溶媒を乾燥させ、直ちに紫外線を照射した。紫外線は光繊維を使用して照射した。1分経過した後、触媒前駆体樹脂組成物は硬化されて固体状に変わり、硬化された固体表面はパラジウムの銀灰色を示した。
紫外線を照射したポリエステル基材を46℃の非電着性銅メッキ溶液に浸漬した。5分経過した後、パターン表面でメッキ反応が開始された。30分がさらに経過した後、1.5μm厚さの銅がパターン表面に選択的に付着した。Nichiban tape testを実施した結果、非電着性銅メッキ層と基材は99/100の付着力を示した。完成された透光性電磁波遮蔽材の表面抵抗は15Ω/sq.、光線透過率は78%であった。
硫酸ニッケル(NiSO4)16.5−18.5g/L;クエン酸ナトリウム(NaC6H5O7)29−31g/L;酢酸ナトリウム(NaC2H3O2)8.9−9.1g/L;次亜リン酸ナトリウム(NaH2PO2)87−89g/L;水酸化カリウム(KOH)3.7−3.9g/L;温度47−53℃
硫酸銅(CuSO4)4.5−5.5g/L;水酸化ナトリウム(NaOH)7−8g/L;ホルマリン(HCHO)2−3.5g/L;EDTA30−36g/L;温度43−49℃
以上の実施例より、本発明の触媒前駆体樹脂組成物を基材上に印刷してパターンを形成し、乾燥した後に紫外線を照射し、非電着性メッキを実施すれば、ニッケルや銅のようなパターン形成金属がパターンの上にだけ非電着性メッキされ、別途の前処理作業が不要になるので、簡便に電磁波遮蔽材を製造することができた。また、製造された電磁波遮蔽材は、表面抵抗、光透過率などにおいても良好であった。
Claims (8)
- (a)アクリレート又はメタクリレート官能基を有し、分子量が500乃至5000である反応性低重合体;
(b)アクリレート又はメタクリレート官能基を有し、分子量が100乃至600である反応性単量体;
(c)α−ヒドロキシケトン、グリオキシル酸フェニル、ベンジルジメチルケタール、α−アミノケトン、モノアシルホスフィン、及びビスアシルホスフィン並びにそれらの混合物からなる群より選択される光重合開始剤;
(d)VIII B族金属の有機化合物又は I B族金属の有機化合物である非電着性メッキ用触媒前駆物質;及び
(e)クロロホルム、アセトニトリル、メチルエチルケトン、及びエチルアセテート並びにそれらの混合物からなる群より選択される溶媒
を含む触媒前駆体樹脂組成物。 - 前記(a)反応性低重合体は、ウレタンアクリレート、ウレタンジアクリレート、ウレタントリアクリレート、ウレタンメタクリレート、エポキシアクリレート、エポキシジアクリレート、ポリエステルアクリレート、及びアクリルアクリレート並びにそれらの混合物からなる群より選択される、請求項1に記載の触媒前駆体樹脂組成物。
- 前記(b)反応性単量体は、イソボルニルアクリレート、オクチルアクリレート、デシルアクリレート、1,6−ヘキサンジオールジアクリレート、ジプロピレングリコールジアクリレート、トリプロピレングリコールジアクリレート、トリエチレングリコールジアクリレート、テトラエチレングリコールジアクリレート、エトキシル化ネオペンチルグリコールジアクリレート、プロポキシル化ネオペンチルグリコールジアクリレート、2−フェノキシエチルアクリレート、プロポキシル化グリセリルトリアクリレート、エトキシル化トリメチロールプロパントリアクリレート、及びペンタエリスリトルトリアクリレート並びにそれらの混合物からなる群より選択される、請求項1に記載の触媒前駆体樹脂組成物。
- 前記(d)非電着性メッキ用触媒前駆物質は、パラジウム2価陽イオン(Pd2+)とカルボニル基もしくはオレフィン基を含む有機化合物の塩である、請求項1に記載の触媒前駆体樹脂組成物。
- 前記パラジウム2価陽イオン(Pd2+)とカルボニル基もしくはオレフィン基を含む有機化合物の塩は、パラジウムアセテート、パラジウムトリフルオロアセテート、シュウ酸パラジウム、及びパラジウムアセチルアセトネート並びにそれらの混合物からなる群より選択される、請求項4に記載の触媒前駆体樹脂組成物。
- (a)アクリレート又はメタクリレート官能基を有し、分子量が500乃至5000である反応性低重合体;(b)アクリレート又はメタクリレート官能基を有し、分子量が100乃至600である反応性単量体;(c)α−ヒドロキシケトン、グリオキシル酸フェニル、ベンジルジメチルケタール、α−アミノケトン、モノアシルホスフィン、及びビスアシルホスフィン並びにそれらの混合物からなる群より選択される光重合開始剤;(d)VIII B族金属の有機化合物又は I B族金属の有機化合物である非電着性メッキ用触媒前駆物質;及び(e)クロロホルム、アセトニトリル、メチルエチルケトン、及びエチルアセテート並びにそれらの混合物からなる群より選択される溶媒を含む触媒前駆体樹脂組成物を透明基材に格子状パターンに印刷し、紫外線を照射して硬化した後、硬化物の表面に非電着性メッキを実施する透光性電磁波遮蔽材の製造方法。
- 請求項6に記載の方法で製造された透光性電磁波遮蔽材。
- 下から基材、紫外線硬化物層、及びメッキ層の順に積層される、請求項7に記載の透光性電磁波遮蔽材。
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PCT/KR2004/001860 WO2005010234A1 (en) | 2003-07-29 | 2004-07-23 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
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EP1676937B1 (en) * | 2004-11-26 | 2016-06-01 | Rohm and Haas Electronic Materials, L.L.C. | UV curable catalyst compositions |
JP4914012B2 (ja) * | 2005-02-14 | 2012-04-11 | キヤノン株式会社 | 構造体の製造方法 |
KR101388558B1 (ko) * | 2005-05-18 | 2014-04-23 | 컨덕티브 잉크젯 테크놀로지 리미티드 | 기판 상의 층 형성 |
WO2006129568A1 (ja) * | 2005-06-03 | 2006-12-07 | Dainippon Ink And Chemicals, Inc. | 電磁波シールド材及びその製造方法 |
GB0516515D0 (en) * | 2005-08-11 | 2005-09-21 | Sun Chemical Bv | A jet ink and ink jet printing process |
KR101009732B1 (ko) * | 2006-04-13 | 2011-01-19 | 주식회사 엘지화학 | 전자파 차폐용 촉매 전구체 수지 조성물 및 이를 이용한금속패턴의 제조방법 |
KR100823718B1 (ko) * | 2006-04-13 | 2008-04-21 | 주식회사 엘지화학 | 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴 |
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EP1649077A1 (en) | 2006-04-26 |
US8053540B2 (en) | 2011-11-08 |
CN1701135A (zh) | 2005-11-23 |
EP1649077B1 (en) | 2008-10-15 |
US20080213506A1 (en) | 2008-09-04 |
ATE411412T1 (de) | 2008-10-15 |
KR100529371B1 (ko) | 2005-11-21 |
TWI267531B (en) | 2006-12-01 |
JP2006510809A (ja) | 2006-03-30 |
US7378478B2 (en) | 2008-05-27 |
DE602004017183D1 (de) | 2008-11-27 |
CN100427643C (zh) | 2008-10-22 |
US20050022692A1 (en) | 2005-02-03 |
KR20050013842A (ko) | 2005-02-05 |
WO2005010234A1 (en) | 2005-02-03 |
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