DE602004017183D1 - KATALYSATORVORLuUFERZUSAMMENSETZUNG F R DIE STROMLOSE METALLABSCHEIDUNG UND VERFAHREN ZUR HERSTELLUNG VON TRANSPARENTEM MATERIAL ZUR ABSCHIRMUNG GEGEN ELEKTROMAGNETISCHE INTERFERENZ UNTER VERWENDUNG DAVON - Google Patents
KATALYSATORVORLuUFERZUSAMMENSETZUNG F R DIE STROMLOSE METALLABSCHEIDUNG UND VERFAHREN ZUR HERSTELLUNG VON TRANSPARENTEM MATERIAL ZUR ABSCHIRMUNG GEGEN ELEKTROMAGNETISCHE INTERFERENZ UNTER VERWENDUNG DAVONInfo
- Publication number
- DE602004017183D1 DE602004017183D1 DE200460017183 DE602004017183T DE602004017183D1 DE 602004017183 D1 DE602004017183 D1 DE 602004017183D1 DE 200460017183 DE200460017183 DE 200460017183 DE 602004017183 T DE602004017183 T DE 602004017183T DE 602004017183 D1 DE602004017183 D1 DE 602004017183D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- transparent material
- electromagnetic interference
- catalyst preparation
- preparation composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000003054 catalyst Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 238000000926 separation method Methods 0.000 title 1
- 239000012780 transparent material Substances 0.000 title 1
- 239000012018 catalyst precursor Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 4
- 238000007772 electroless plating Methods 0.000 abstract 3
- 239000000178 monomer Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
- H01J2211/446—Electromagnetic shielding means; Antistatic means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Catalysts (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0052425A KR100529371B1 (ko) | 2003-07-29 | 2003-07-29 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
PCT/KR2004/001860 WO2005010234A1 (en) | 2003-07-29 | 2004-07-23 | Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004017183D1 true DE602004017183D1 (de) | 2008-11-27 |
Family
ID=36117779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200460017183 Expired - Lifetime DE602004017183D1 (de) | 2003-07-29 | 2004-07-23 | KATALYSATORVORLuUFERZUSAMMENSETZUNG F R DIE STROMLOSE METALLABSCHEIDUNG UND VERFAHREN ZUR HERSTELLUNG VON TRANSPARENTEM MATERIAL ZUR ABSCHIRMUNG GEGEN ELEKTROMAGNETISCHE INTERFERENZ UNTER VERWENDUNG DAVON |
Country Status (9)
Country | Link |
---|---|
US (2) | US7378478B2 (de) |
EP (1) | EP1649077B1 (de) |
JP (1) | JP4160598B2 (de) |
KR (1) | KR100529371B1 (de) |
CN (1) | CN100427643C (de) |
AT (1) | ATE411412T1 (de) |
DE (1) | DE602004017183D1 (de) |
TW (1) | TWI267531B (de) |
WO (1) | WO2005010234A1 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4266310B2 (ja) * | 2003-01-31 | 2009-05-20 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法 |
EP1676937B1 (de) * | 2004-11-26 | 2016-06-01 | Rohm and Haas Electronic Materials, L.L.C. | UV härtbare Katalysatormischung |
JP4914012B2 (ja) * | 2005-02-14 | 2012-04-11 | キヤノン株式会社 | 構造体の製造方法 |
US8642117B2 (en) * | 2005-05-18 | 2014-02-04 | Conductive Inkjet Technology Limited | Formation of layers on substrates |
JP4519914B2 (ja) * | 2005-06-03 | 2010-08-04 | Dic株式会社 | 電磁波シールド材及びその製造方法 |
GB0516515D0 (en) * | 2005-08-11 | 2005-09-21 | Sun Chemical Bv | A jet ink and ink jet printing process |
KR100823718B1 (ko) * | 2006-04-13 | 2008-04-21 | 주식회사 엘지화학 | 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴 |
KR101009732B1 (ko) * | 2006-04-13 | 2011-01-19 | 주식회사 엘지화학 | 전자파 차폐용 촉매 전구체 수지 조성물 및 이를 이용한금속패턴의 제조방법 |
US8231811B2 (en) * | 2006-07-22 | 2012-07-31 | Conductive Inkjet Technology Limited | Formation of conductive metal regions on substrates |
KR20090126264A (ko) * | 2007-03-05 | 2009-12-08 | 교도 기큰 케미칼 가부시키가이샤 | 도전성 고분자 탄성체 조성물 및 이 조성물로 이루어지는 전자파 실드 |
KR101009733B1 (ko) | 2007-05-15 | 2011-01-20 | 주식회사 엘지화학 | 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴 |
US7927454B2 (en) * | 2007-07-17 | 2011-04-19 | Samsung Mobile Display Co., Ltd. | Method of patterning a substrate |
US20100243572A1 (en) * | 2007-12-21 | 2010-09-30 | Stouffer Mark R | Liquid filtration systems |
KR20100072643A (ko) * | 2008-12-22 | 2010-07-01 | 삼성코닝정밀소재 주식회사 | 광학부재 및 이를 구비하는 디스플레이 장치용 광학 필터 |
US8492454B2 (en) | 2009-10-05 | 2013-07-23 | Creative Nail Design, Inc. | Removable color layer for artificial nail coatings and methods therefore |
US8263677B2 (en) * | 2009-09-08 | 2012-09-11 | Creative Nail Design, Inc. | Removable color gel basecoat for artificial nail coatings and methods therefore |
US8541482B2 (en) | 2009-10-05 | 2013-09-24 | Creative Nail Design, Inc. | Removable multilayer nail coating system and methods therefore |
JP5547568B2 (ja) * | 2010-07-02 | 2014-07-16 | 丸善石油化学株式会社 | 重合性組成物、これを用いる金属ナノ粒子の製造方法及びこの金属ナノ粒子を保持した硬化膜 |
JP5409575B2 (ja) * | 2010-09-29 | 2014-02-05 | 富士フイルム株式会社 | 金属膜材料の製造方法、及びそれを用いた金属膜材料 |
JP5697964B2 (ja) * | 2010-12-17 | 2015-04-08 | 丸善石油化学株式会社 | 光硬化性組成物並びにこれを用いた金属ナノ粒子分散膜及び導電性薄膜の製造方法 |
KR20140016315A (ko) | 2011-03-07 | 2014-02-07 | 크리에이티브 네일 디자인 인코포레이티드 | Uv-경화성 미용 손톱 코팅제를 위한 조성물 및 방법 |
DE102011080883A1 (de) * | 2011-08-12 | 2013-02-14 | Tesa Se | Temperaturbeständige laserbeschriftbare Folie |
CN104040026B (zh) * | 2011-10-05 | 2019-01-01 | 埃托特克德国有限公司 | 不含甲醛的化学镀镀铜溶液 |
WO2013059078A1 (en) * | 2011-10-19 | 2013-04-25 | Unipixel Displays, Inc. | Photo-patterning using a translucent cylindrical master to form microscopic conductive lines on a flexible substrate |
TW201332782A (zh) * | 2011-10-25 | 2013-08-16 | Unipixel Displays Inc | 使用膠版輪轉式印刷之製造電容式觸控感測電路之方法 |
CN106926561A (zh) * | 2012-05-04 | 2017-07-07 | 伊斯曼柯达公司 | 使用有机金属墨和带状网纹辊制造导电图案的方法 |
GB2514738A (en) * | 2012-05-04 | 2014-12-03 | Unipixel Displays Inc | High resolution conductive patterns having low variance through optimization of catalyst concentration |
JP2015523235A (ja) * | 2012-05-11 | 2015-08-13 | ユニピクセル ディスプレイズ,インコーポレーテッド | 高精細導電パターンを製造するためのインク組成物 |
KR101735223B1 (ko) | 2012-07-30 | 2017-05-12 | 이스트맨 코닥 캄파니 | 고해상도 전도성 패턴의 플렉소그래픽 인쇄용 잉크 제형 |
CN103773143B (zh) * | 2012-10-26 | 2017-02-22 | 比亚迪股份有限公司 | 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品 |
US20140248423A1 (en) * | 2013-03-04 | 2014-09-04 | Uni-Pixel Displays, Inc. | Method of roll to roll printing of fine lines and features with an inverse patterning process |
EP3094694A1 (de) * | 2014-01-13 | 2016-11-23 | Eastman Kodak Company | Katalytisch aktive zusammengesetzte tinten mit beschichteten nanopartikeln |
DE102014106230A1 (de) * | 2014-05-05 | 2015-11-05 | Preh Gmbh | Galvanisierverfahren für Inselstrukturen |
CN106687619B (zh) * | 2014-09-05 | 2019-12-31 | 日产化学工业株式会社 | 光固化性非电解镀基底剂 |
US20170240764A1 (en) * | 2014-09-05 | 2017-08-24 | Nissan Chemical Industries, Ltd. | Photosensitive electroless plating undercoat agent |
CN105828587A (zh) * | 2015-01-06 | 2016-08-03 | 富葵精密组件(深圳)有限公司 | 感光油墨及应用其的电磁屏蔽结构、电路板、电子装置 |
KR20160093403A (ko) * | 2015-01-29 | 2016-08-08 | 엘지이노텍 주식회사 | 전자파차폐구조물 |
WO2018009683A1 (en) | 2016-07-06 | 2018-01-11 | Eastman Chemical Company | (meth)acrylic oligomers |
CN115992354A (zh) * | 2022-11-16 | 2023-04-21 | 浙江鑫柔科技有限公司 | 一种柔性基板上形成金属膜的方法 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2331997A1 (de) * | 1973-06-21 | 1975-01-16 | Schering Ag | Verfahren zur herstellung von bicycloalkan-derivaten |
JPH0693540B2 (ja) | 1987-02-17 | 1994-11-16 | 株式会社日立製作所 | プリント回路板の製造方法 |
US5077085A (en) * | 1987-03-06 | 1991-12-31 | Schnur Joel M | High resolution metal patterning of ultra-thin films on solid substrates |
US5411795A (en) * | 1992-10-14 | 1995-05-02 | Monsanto Company | Electroless deposition of metal employing thermally stable carrier polymers |
JPH0730227A (ja) | 1992-12-17 | 1995-01-31 | Nec Corp | パラジウム含有フィルムコート材料とそれを用いた 配線形成方法 |
EP0612812B1 (de) * | 1993-02-24 | 2001-07-11 | Ibiden Co, Ltd. | Harzzusammensetzungen und Verfahren für Ihre Herstellung |
TW268011B (de) * | 1993-07-02 | 1996-01-11 | Ciba Geigy | |
US5685754A (en) * | 1994-06-30 | 1997-11-11 | Kimberly-Clark Corporation | Method of generating a reactive species and polymer coating applications therefor |
US6242057B1 (en) * | 1994-06-30 | 2001-06-05 | Kimberly-Clark Worldwide, Inc. | Photoreactor composition and applications therefor |
US5530079A (en) * | 1995-01-03 | 1996-06-25 | Xerox Corporation | Polymerization processes |
US6210537B1 (en) * | 1995-06-19 | 2001-04-03 | Lynntech, Inc. | Method of forming electronically conducting polymers on conducting and nonconducting substrates |
DE19631015A1 (de) * | 1995-08-11 | 1997-02-13 | Illinois Tool Works | UV-gehärtete wärmeaktivierte Labels für Substrate und Verfahren zu deren Herstellung |
US6232417B1 (en) * | 1996-03-07 | 2001-05-15 | The B. F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
US6344271B1 (en) * | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
JP3355963B2 (ja) | 1996-11-08 | 2002-12-09 | 株式会社日立製作所 | 配線基板の製造方法 |
US6479706B1 (en) * | 1997-02-04 | 2002-11-12 | Albemarle Corporation | Aminobenzophenones and photopolymerizable compositions including the same |
KR100452255B1 (ko) * | 1997-04-15 | 2004-10-12 | 이비덴 가부시키가이샤 | 무전해 도금용 접착제, 무전해 도금용 접착제 조제용의 원료조성물 및 프린트 배선판 |
EP0883156B9 (de) * | 1997-06-03 | 2005-09-21 | Hitachi Chemical Co., Ltd. | Klebefilm mit elektromagnetischer Abschirmung |
US5910394A (en) * | 1997-06-18 | 1999-06-08 | Shipley Company, L.L.C. | I-line photoresist compositions |
EP1376229B1 (de) * | 1997-08-08 | 2010-10-13 | Dai Nippon Printing Co., Ltd. | Lithographieplatte und Verfahren zu derer Herstellung |
US6136412A (en) * | 1997-10-10 | 2000-10-24 | 3M Innovative Properties Company | Microtextured catalyst transfer substrate |
KR100335346B1 (ko) * | 1997-11-11 | 2002-06-20 | 이사오 우치가사키 | 전자파차폐성접착필름,이필름을채용한전자파차폐성어셈블리및표시소자 |
SG81995A1 (en) * | 1998-08-10 | 2001-07-24 | Sumitomo Bakelite Co | Transparent electromagnetic wave shield |
DE69930948T2 (de) * | 1998-09-28 | 2006-09-07 | Kimberly-Clark Worldwide, Inc., Neenah | Chelate mit chinoiden gruppen als photoinitiatoren |
US6818153B2 (en) * | 1998-10-13 | 2004-11-16 | Peter Burnell-Jones | Photocurable thermosetting luminescent resins |
JP3614707B2 (ja) * | 1999-04-28 | 2005-01-26 | 住友大阪セメント株式会社 | 透光性導電膜の製造方法及び透光性導電膜 |
JP4013021B2 (ja) * | 1999-12-17 | 2007-11-28 | 松下電工株式会社 | 透視性電磁波シールド材及びその製造方法 |
FR2805273B1 (fr) * | 2000-02-18 | 2006-08-11 | Rhodia Chimie Sa | Traitement de surface de materiau plastique avec une composition a fonctions reactives polymerisable et/ou reticulable |
FR2805272B1 (fr) * | 2000-02-18 | 2006-08-25 | Rhodia Chimie Sa | Traitement de surface de materiau plastique avec une composition organique a fonctions reactives polymerisable et/ou reticulable |
JP2001303255A (ja) | 2000-04-27 | 2001-10-31 | Mitsuboshi Belting Ltd | メッキ触媒及びプラスチックメッキ基板の製造方法 |
JP5218713B2 (ja) * | 2000-07-28 | 2013-06-26 | 住友ベークライト株式会社 | 光学導波管を形成するためのポリマー組成物;それらから形成される光学導波管;およびそれを作製するための方法 |
GB0025989D0 (en) * | 2000-10-24 | 2000-12-13 | Shipley Co Llc | Plating catalysts |
JP2002185184A (ja) * | 2000-12-18 | 2002-06-28 | Dainippon Printing Co Ltd | 電磁波シールド材及びその製造方法 |
US6579664B2 (en) * | 2001-03-30 | 2003-06-17 | Napp Systems, Inc. | High performance, photoimageable resin compositions and printing plates prepared therefrom |
US6599681B2 (en) * | 2001-07-13 | 2003-07-29 | Shielding Express | Electromagnetic filter for display screens |
-
2003
- 2003-07-29 KR KR10-2003-0052425A patent/KR100529371B1/ko active IP Right Grant
-
2004
- 2004-07-23 WO PCT/KR2004/001860 patent/WO2005010234A1/en active Application Filing
- 2004-07-23 CN CNB2004800009320A patent/CN100427643C/zh not_active Expired - Lifetime
- 2004-07-23 DE DE200460017183 patent/DE602004017183D1/de not_active Expired - Lifetime
- 2004-07-23 JP JP2005518227A patent/JP4160598B2/ja not_active Expired - Lifetime
- 2004-07-23 AT AT04748475T patent/ATE411412T1/de not_active IP Right Cessation
- 2004-07-23 EP EP04748475A patent/EP1649077B1/de not_active Expired - Lifetime
- 2004-07-27 TW TW93122464A patent/TWI267531B/zh not_active IP Right Cessation
- 2004-07-28 US US10/900,622 patent/US7378478B2/en not_active Expired - Lifetime
-
2008
- 2008-04-14 US US12/102,095 patent/US8053540B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8053540B2 (en) | 2011-11-08 |
TW200505977A (en) | 2005-02-16 |
EP1649077B1 (de) | 2008-10-15 |
US20080213506A1 (en) | 2008-09-04 |
US20050022692A1 (en) | 2005-02-03 |
EP1649077A1 (de) | 2006-04-26 |
KR100529371B1 (ko) | 2005-11-21 |
JP2006510809A (ja) | 2006-03-30 |
TWI267531B (en) | 2006-12-01 |
WO2005010234A1 (en) | 2005-02-03 |
CN100427643C (zh) | 2008-10-22 |
JP4160598B2 (ja) | 2008-10-01 |
ATE411412T1 (de) | 2008-10-15 |
CN1701135A (zh) | 2005-11-23 |
US7378478B2 (en) | 2008-05-27 |
KR20050013842A (ko) | 2005-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602004017183D1 (de) | KATALYSATORVORLuUFERZUSAMMENSETZUNG F R DIE STROMLOSE METALLABSCHEIDUNG UND VERFAHREN ZUR HERSTELLUNG VON TRANSPARENTEM MATERIAL ZUR ABSCHIRMUNG GEGEN ELEKTROMAGNETISCHE INTERFERENZ UNTER VERWENDUNG DAVON | |
WO2007149422A3 (en) | Curable organosilicon composition | |
ATE504634T1 (de) | Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren | |
BR0211428A (pt) | Composição curável, produto fotocrÈmico curado, material óptico fotocrÈmico, e, processo para produzir o mesmo | |
TW200704675A (en) | Epoxy silane oligomer and coating composition containing same | |
WO2008140272A3 (en) | Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic patten using the same, and metallic pattern formed by the same method | |
DK1147098T3 (da) | Forbindelser omfattende acrylatgrupper og cykliske sekundære amin-rester | |
ATE356533T1 (de) | Uv-härtbare silberzusammensetzung und zugehöriges verfahren | |
ATE523479T1 (de) | Verfahren zur herstellung von cyclohexylbenzen | |
ATE419916T1 (de) | Verfahren zur herstellung von polymeren | |
DE602006015973D1 (de) | Härtbare verbindungen, verfahren und herstellung und verwendung davon und artikel daraus | |
DE602005015290D1 (de) | Verfahren zur herstellung von copolycarbonaten mit geringerer färbung | |
EP1801145A4 (de) | Verfahren zur herstellung eines gehärteten produkts aus lichtempfindlichem harz | |
BR0308167A (pt) | Método de preparação de uma composição de revestimento, composição de revestimento, e, método de revestimento de um artigo | |
TW200704654A (en) | Compositions for brightness enhancing films | |
ATE481429T1 (de) | Verfahren und vorrichtung zur lösungsmittelfreien herstellung von acrylathaftklebemassen | |
WO2006007917A8 (en) | Composition of fluorinated silicones, particularly but not exclusively for adhesive-releasing coatings, and preparation thereof | |
TW201109399A (en) | Adhesive sheet for plating | |
ATE348846T1 (de) | Verfahren zur herstellung von beschichtungsharzen mit hohen feststoffgehalten durch kontrollierte radikalpolymerisation | |
BRPI0519707A2 (pt) | composiÇço de revestimento em pà, revestimento, substrato e processo para o preparo de uma composiÇço de revestimento em pà | |
DE602005002564D1 (de) | Verfahren zur herstellung von geruchsarmem polyetherpolyol | |
DE50305771D1 (de) | Verfahren zur herstellung von (s)-3-methylamino-1-(thien-2-yl)propan-1-ol | |
CN100338119C (zh) | 一种彩色涂层钢板复合材料及其使用的胶粘剂 | |
DE602004011960D1 (de) | Verfahren zur herstellung von polycarbonat | |
ATE366738T1 (de) | Verfahren zur herstellung von übergangsmetallverbindungen und deren verwendung zur polymerisation von olefinen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |