ATE411412T1 - Katalysatorvorluuferzusammensetzung f r die stromlose metallabscheidung und verfahren zur herstellung von transparentem material zur abschirmung gegen elektromagnetische interferenz unter verwendung davon - Google Patents

Katalysatorvorluuferzusammensetzung f r die stromlose metallabscheidung und verfahren zur herstellung von transparentem material zur abschirmung gegen elektromagnetische interferenz unter verwendung davon

Info

Publication number
ATE411412T1
ATE411412T1 AT04748475T AT04748475T ATE411412T1 AT E411412 T1 ATE411412 T1 AT E411412T1 AT 04748475 T AT04748475 T AT 04748475T AT 04748475 T AT04748475 T AT 04748475T AT E411412 T1 ATE411412 T1 AT E411412T1
Authority
AT
Austria
Prior art keywords
catalyst
composition
same
preluminary
transparent material
Prior art date
Application number
AT04748475T
Other languages
English (en)
Inventor
Seung-Hun Eu
Jang-Hoon Lee
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Application granted granted Critical
Publication of ATE411412T1 publication Critical patent/ATE411412T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00Polymerisation catalysts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0094Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20Constructional details
    • H01J2211/34Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/44Optical arrangements or shielding arrangements, e.g. filters or lenses
    • H01J2211/446Electromagnetic shielding means; Antistatic means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Paints Or Removers (AREA)
  • Catalysts (AREA)
AT04748475T 2003-07-29 2004-07-23 Katalysatorvorluuferzusammensetzung f r die stromlose metallabscheidung und verfahren zur herstellung von transparentem material zur abschirmung gegen elektromagnetische interferenz unter verwendung davon ATE411412T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0052425A KR100529371B1 (ko) 2003-07-29 2003-07-29 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법

Publications (1)

Publication Number Publication Date
ATE411412T1 true ATE411412T1 (de) 2008-10-15

Family

ID=36117779

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04748475T ATE411412T1 (de) 2003-07-29 2004-07-23 Katalysatorvorluuferzusammensetzung f r die stromlose metallabscheidung und verfahren zur herstellung von transparentem material zur abschirmung gegen elektromagnetische interferenz unter verwendung davon

Country Status (9)

Country Link
US (2) US7378478B2 (de)
EP (1) EP1649077B1 (de)
JP (1) JP4160598B2 (de)
KR (1) KR100529371B1 (de)
CN (1) CN100427643C (de)
AT (1) ATE411412T1 (de)
DE (1) DE602004017183D1 (de)
TW (1) TWI267531B (de)
WO (1) WO2005010234A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4266310B2 (ja) * 2003-01-31 2009-05-20 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法
EP1676937B1 (de) * 2004-11-26 2016-06-01 Rohm and Haas Electronic Materials, L.L.C. UV härtbare Katalysatormischung
JP4914012B2 (ja) * 2005-02-14 2012-04-11 キヤノン株式会社 構造体の製造方法
WO2006123144A2 (en) * 2005-05-18 2006-11-23 Conductive Inkjet Technology Limited Formation of layers on substrates
KR100932150B1 (ko) * 2005-06-03 2009-12-16 디아이씨 가부시끼가이샤 전자파 쉴드재 및 그 제조 방법
GB0516515D0 (en) * 2005-08-11 2005-09-21 Sun Chemical Bv A jet ink and ink jet printing process
KR101009732B1 (ko) * 2006-04-13 2011-01-19 주식회사 엘지화학 전자파 차폐용 촉매 전구체 수지 조성물 및 이를 이용한금속패턴의 제조방법
KR100823718B1 (ko) * 2006-04-13 2008-04-21 주식회사 엘지화학 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴
WO2008012512A2 (en) * 2006-07-22 2008-01-31 Conductive Inkjet Technology Limited The formation of conductive metal regions on substrates
CN101622918A (zh) * 2007-03-05 2010-01-06 共同技研化学株式会社 导电性高分子弹性体组合物及由该组合物形成的电磁波屏蔽
KR101009733B1 (ko) 2007-05-15 2011-01-20 주식회사 엘지화학 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴
US7927454B2 (en) * 2007-07-17 2011-04-19 Samsung Mobile Display Co., Ltd. Method of patterning a substrate
KR101625237B1 (ko) * 2007-12-21 2016-05-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 액체 여과 시스템
KR20100072643A (ko) * 2008-12-22 2010-07-01 삼성코닝정밀소재 주식회사 광학부재 및 이를 구비하는 디스플레이 장치용 광학 필터
US8541482B2 (en) 2009-10-05 2013-09-24 Creative Nail Design, Inc. Removable multilayer nail coating system and methods therefore
US8492454B2 (en) 2009-10-05 2013-07-23 Creative Nail Design, Inc. Removable color layer for artificial nail coatings and methods therefore
US8263677B2 (en) 2009-09-08 2012-09-11 Creative Nail Design, Inc. Removable color gel basecoat for artificial nail coatings and methods therefore
JP5547568B2 (ja) * 2010-07-02 2014-07-16 丸善石油化学株式会社 重合性組成物、これを用いる金属ナノ粒子の製造方法及びこの金属ナノ粒子を保持した硬化膜
JP5409575B2 (ja) * 2010-09-29 2014-02-05 富士フイルム株式会社 金属膜材料の製造方法、及びそれを用いた金属膜材料
JP5697964B2 (ja) * 2010-12-17 2015-04-08 丸善石油化学株式会社 光硬化性組成物並びにこれを用いた金属ナノ粒子分散膜及び導電性薄膜の製造方法
KR20140016315A (ko) 2011-03-07 2014-02-07 크리에이티브 네일 디자인 인코포레이티드 Uv-경화성 미용 손톱 코팅제를 위한 조성물 및 방법
DE102011080883A1 (de) * 2011-08-12 2013-02-14 Tesa Se Temperaturbeständige laserbeschriftbare Folie
US20140242264A1 (en) * 2011-10-05 2014-08-28 Atotech Deutschland Gmbh Formaldehyde-free electroless copper plating solution
WO2013059078A1 (en) * 2011-10-19 2013-04-25 Unipixel Displays, Inc. Photo-patterning using a translucent cylindrical master to form microscopic conductive lines on a flexible substrate
TW201332782A (zh) * 2011-10-25 2013-08-16 Unipixel Displays Inc 使用膠版輪轉式印刷之製造電容式觸控感測電路之方法
WO2013165567A1 (en) * 2012-05-04 2013-11-07 Unipixel Displays, Inc. Manufacturing of high resolution conductive patterns using organometallic ink and banded anilox rolls
CN104334654A (zh) * 2012-05-04 2015-02-04 尤尼皮克塞尔显示器有限公司 通过优化催化剂浓度而具有低偏差的高分辨率导电图案
CN104412451A (zh) * 2012-05-11 2015-03-11 尤尼皮克塞尔显示器有限公司 用于制造高分辨率导电图案的墨合成物
EP2880680A4 (de) * 2012-07-30 2016-11-16 Eastman Kodak Co Tintenformulierungen für flexodruck hochauflösender leitmuster
CN106519740B (zh) 2012-10-26 2019-01-11 比亚迪股份有限公司 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品
US20140248423A1 (en) * 2013-03-04 2014-09-04 Uni-Pixel Displays, Inc. Method of roll to roll printing of fine lines and features with an inverse patterning process
EP3094694A1 (de) * 2014-01-13 2016-11-23 Eastman Kodak Company Katalytisch aktive zusammengesetzte tinten mit beschichteten nanopartikeln
DE102014106230A1 (de) * 2014-05-05 2015-11-05 Preh Gmbh Galvanisierverfahren für Inselstrukturen
CN106662812B (zh) * 2014-09-05 2020-10-02 日产化学工业株式会社 感光性非电解镀基底剂
WO2016035896A1 (ja) * 2014-09-05 2016-03-10 日産化学工業株式会社 光硬化性無電解めっき下地剤
CN105828587A (zh) * 2015-01-06 2016-08-03 富葵精密组件(深圳)有限公司 感光油墨及应用其的电磁屏蔽结构、电路板、电子装置
KR20160093403A (ko) * 2015-01-29 2016-08-08 엘지이노텍 주식회사 전자파차폐구조물
CN109642137A (zh) 2016-07-06 2019-04-16 伊士曼化工公司 (甲基)丙烯酸系低聚物
CN115992354A (zh) * 2022-11-16 2023-04-21 浙江鑫柔科技有限公司 一种柔性基板上形成金属膜的方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2331997A1 (de) * 1973-06-21 1975-01-16 Schering Ag Verfahren zur herstellung von bicycloalkan-derivaten
JPH0693540B2 (ja) 1987-02-17 1994-11-16 株式会社日立製作所 プリント回路板の製造方法
US5077085A (en) * 1987-03-06 1991-12-31 Schnur Joel M High resolution metal patterning of ultra-thin films on solid substrates
US5411795A (en) * 1992-10-14 1995-05-02 Monsanto Company Electroless deposition of metal employing thermally stable carrier polymers
JPH0730227A (ja) 1992-12-17 1995-01-31 Nec Corp パラジウム含有フィルムコート材料とそれを用いた 配線形成方法
DE69427665T2 (de) * 1993-02-24 2001-10-31 Ibiden Co Ltd Harzzusammensetzungen und Verfahren für Ihre Herstellung
TW268011B (de) * 1993-07-02 1996-01-11 Ciba Geigy
US6242057B1 (en) * 1994-06-30 2001-06-05 Kimberly-Clark Worldwide, Inc. Photoreactor composition and applications therefor
US5685754A (en) * 1994-06-30 1997-11-11 Kimberly-Clark Corporation Method of generating a reactive species and polymer coating applications therefor
US5530079A (en) * 1995-01-03 1996-06-25 Xerox Corporation Polymerization processes
US6210537B1 (en) * 1995-06-19 2001-04-03 Lynntech, Inc. Method of forming electronically conducting polymers on conducting and nonconducting substrates
DE19631015A1 (de) * 1995-08-11 1997-02-13 Illinois Tool Works UV-gehärtete wärmeaktivierte Labels für Substrate und Verfahren zu deren Herstellung
US6232417B1 (en) * 1996-03-07 2001-05-15 The B. F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
US6344271B1 (en) * 1998-11-06 2002-02-05 Nanoenergy Corporation Materials and products using nanostructured non-stoichiometric substances
JP3355963B2 (ja) 1996-11-08 2002-12-09 株式会社日立製作所 配線基板の製造方法
US6479706B1 (en) * 1997-02-04 2002-11-12 Albemarle Corporation Aminobenzophenones and photopolymerizable compositions including the same
EP1005261B1 (de) * 1997-04-15 2003-03-05 Ibiden Co., Ltd. Klebstoff zur stromlosen plattierung, ausgangszusammensetzung zur herstellung des klebstoffes zur stromlosen plattierung, und leiterplatte
US6207266B1 (en) * 1997-06-03 2001-03-27 Hitachi Chemical Company, Ltd. Electromagnetically shielding bonding film
US5910394A (en) * 1997-06-18 1999-06-08 Shipley Company, L.L.C. I-line photoresist compositions
EP1376225B1 (de) * 1997-08-08 2010-10-13 Dai Nippon Printing Co., Ltd. Struktur zur Musterbildung, Verfahren zur Musterbildung und deren Anwendung
US6136412A (en) * 1997-10-10 2000-10-24 3M Innovative Properties Company Microtextured catalyst transfer substrate
KR100335346B1 (ko) * 1997-11-11 2002-06-20 이사오 우치가사키 전자파차폐성접착필름,이필름을채용한전자파차폐성어셈블리및표시소자
MY123910A (en) * 1998-08-10 2006-06-30 Sumitomo Bakelite Co Transparent electromagnetic wave shield
CA2353685A1 (en) * 1998-09-28 2000-04-06 Kimberly-Clark Worldwide, Inc. Chelates comprising chinoid groups as photoinitiators
US6818153B2 (en) * 1998-10-13 2004-11-16 Peter Burnell-Jones Photocurable thermosetting luminescent resins
JP3614707B2 (ja) * 1999-04-28 2005-01-26 住友大阪セメント株式会社 透光性導電膜の製造方法及び透光性導電膜
JP4013021B2 (ja) * 1999-12-17 2007-11-28 松下電工株式会社 透視性電磁波シールド材及びその製造方法
FR2805273B1 (fr) * 2000-02-18 2006-08-11 Rhodia Chimie Sa Traitement de surface de materiau plastique avec une composition a fonctions reactives polymerisable et/ou reticulable
FR2805272B1 (fr) * 2000-02-18 2006-08-25 Rhodia Chimie Sa Traitement de surface de materiau plastique avec une composition organique a fonctions reactives polymerisable et/ou reticulable
JP2001303255A (ja) 2000-04-27 2001-10-31 Mitsuboshi Belting Ltd メッキ触媒及びプラスチックメッキ基板の製造方法
JP5218713B2 (ja) * 2000-07-28 2013-06-26 住友ベークライト株式会社 光学導波管を形成するためのポリマー組成物;それらから形成される光学導波管;およびそれを作製するための方法
GB0025989D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts
JP2002185184A (ja) * 2000-12-18 2002-06-28 Dainippon Printing Co Ltd 電磁波シールド材及びその製造方法
US6579664B2 (en) * 2001-03-30 2003-06-17 Napp Systems, Inc. High performance, photoimageable resin compositions and printing plates prepared therefrom
US6599681B2 (en) * 2001-07-13 2003-07-29 Shielding Express Electromagnetic filter for display screens

Also Published As

Publication number Publication date
CN1701135A (zh) 2005-11-23
EP1649077A1 (de) 2006-04-26
US7378478B2 (en) 2008-05-27
US8053540B2 (en) 2011-11-08
TWI267531B (en) 2006-12-01
KR100529371B1 (ko) 2005-11-21
JP2006510809A (ja) 2006-03-30
DE602004017183D1 (de) 2008-11-27
WO2005010234A1 (en) 2005-02-03
EP1649077B1 (de) 2008-10-15
CN100427643C (zh) 2008-10-22
KR20050013842A (ko) 2005-02-05
US20080213506A1 (en) 2008-09-04
JP4160598B2 (ja) 2008-10-01
TW200505977A (en) 2005-02-16
US20050022692A1 (en) 2005-02-03

Similar Documents

Publication Publication Date Title
ATE411412T1 (de) Katalysatorvorluuferzusammensetzung f r die stromlose metallabscheidung und verfahren zur herstellung von transparentem material zur abschirmung gegen elektromagnetische interferenz unter verwendung davon
BR0211428A (pt) Composição curável, produto fotocrÈmico curado, material óptico fotocrÈmico, e, processo para produzir o mesmo
WO2007149422A3 (en) Curable organosilicon composition
TW200505810A (en) Nano-structured surface coating process, nano-structured coatings and articles comprising the coating
TW200639269A (en) Plating method
BR0012208A (pt) Porocesso para a formação de uma camada polimérica orgânica aderente sobre um substrato polimérico orgânico,artigo e artigo fotocrÈmico
DE59910943D1 (de) Verfahren zur herstellung von pulverüberzügen
WO2007097835A3 (en) Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
DK1147098T3 (da) Forbindelser omfattende acrylatgrupper og cykliske sekundære amin-rester
TW200801799A (en) Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods
WO2008140272A3 (en) Resin composition containing catalyst precursor for electroless plating in forming electro-magnetic shielding layer, method of forming metallic patten using the same, and metallic pattern formed by the same method
WO2006007917A8 (en) Composition of fluorinated silicones, particularly but not exclusively for adhesive-releasing coatings, and preparation thereof
ATE481429T1 (de) Verfahren und vorrichtung zur lösungsmittelfreien herstellung von acrylathaftklebemassen
ATE348846T1 (de) Verfahren zur herstellung von beschichtungsharzen mit hohen feststoffgehalten durch kontrollierte radikalpolymerisation
BRPI0519707A2 (pt) composiÇço de revestimento em pà, revestimento, substrato e processo para o preparo de uma composiÇço de revestimento em pà
ATE504671T1 (de) Verfahren zur herstellung von münzrohlingen
WO2005059040A3 (en) Method of forming a radiation curable coating and coated article
ATE454363T1 (de) Beschichtungmaterial für eine glasform, verfahren zum beschichten einer glasform sowie beschichtete glasform
EP2153997A3 (de) Schutzbeschichtungen für Anwendungen fester Tintenstrahltinten
DE50305771D1 (de) Verfahren zur herstellung von (s)-3-methylamino-1-(thien-2-yl)propan-1-ol
ATE466061T1 (de) Transparente beschichtungszusammensetzung und verfahren zu deren herstellung sowie entsprechend transparent beschichtete substrate
MY134782A (en) Low temperature curable organopolysiloxane coatings
DE60203935D1 (de) Verfahren zur beschichtung
GB2437477A (en) A method for producing an aldehyde containing coating
WO2003068869A3 (de) Beschichtungen für trägermaterialien zur erreichung einer sauerstoffbarriere

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties