JP3935874B2 - パターナブル低誘電率材料およびulsi相互接続でのその使用 - Google Patents
パターナブル低誘電率材料およびulsi相互接続でのその使用 Download PDFInfo
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- JP3935874B2 JP3935874B2 JP2003421691A JP2003421691A JP3935874B2 JP 3935874 B2 JP3935874 B2 JP 3935874B2 JP 2003421691 A JP2003421691 A JP 2003421691A JP 2003421691 A JP2003421691 A JP 2003421691A JP 3935874 B2 JP3935874 B2 JP 3935874B2
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- silsesquioxane
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- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
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- H—ELECTRICITY
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
- H01L2221/1005—Formation and after-treatment of dielectrics
- H01L2221/1042—Formation and after-treatment of dielectrics the dielectric comprising air gaps
- H01L2221/1047—Formation and after-treatment of dielectrics the dielectric comprising air gaps the air gaps being formed by pores in the dielectric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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US10/338,945 US7041748B2 (en) | 2003-01-08 | 2003-01-08 | Patternable low dielectric constant materials and their use in ULSI interconnection |
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-
2003
- 2003-01-08 US US10/338,945 patent/US7041748B2/en not_active Expired - Lifetime
- 2003-12-08 KR KR1020030088568A patent/KR100562238B1/ko not_active IP Right Cessation
- 2003-12-18 JP JP2003421691A patent/JP3935874B2/ja not_active Expired - Lifetime
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US7306853B2 (en) | 2007-12-11 |
KR20040063769A (ko) | 2004-07-14 |
US20060105181A1 (en) | 2006-05-18 |
US7714079B2 (en) | 2010-05-11 |
US20080063880A1 (en) | 2008-03-13 |
JP2004212983A (ja) | 2004-07-29 |
TWI320515B (en) | 2010-02-11 |
US20040137241A1 (en) | 2004-07-15 |
TW200508803A (en) | 2005-03-01 |
US7041748B2 (en) | 2006-05-09 |
KR100562238B1 (ko) | 2006-03-22 |
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