JP3915779B2 - 導電性樹脂組成物およびこれを用いた電子部品 - Google Patents

導電性樹脂組成物およびこれを用いた電子部品 Download PDF

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Publication number
JP3915779B2
JP3915779B2 JP2003538251A JP2003538251A JP3915779B2 JP 3915779 B2 JP3915779 B2 JP 3915779B2 JP 2003538251 A JP2003538251 A JP 2003538251A JP 2003538251 A JP2003538251 A JP 2003538251A JP 3915779 B2 JP3915779 B2 JP 3915779B2
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JP
Japan
Prior art keywords
silver
group
powder
copper powder
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2003538251A
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English (en)
Japanese (ja)
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JPWO2003035739A1 (ja
Inventor
健博 清水
秀一 松浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corporation
Showa Denko Materials Co Ltd
Original Assignee
Resonac Corporation
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corporation, Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Resonac Corporation
Publication of JPWO2003035739A1 publication Critical patent/JPWO2003035739A1/ja
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Publication of JP3915779B2 publication Critical patent/JP3915779B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2003538251A 2001-10-19 2002-10-18 導電性樹脂組成物およびこれを用いた電子部品 Expired - Lifetime JP3915779B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2001322321 2001-10-19
JP2001322320 2001-10-19
JP2001322321 2001-10-19
JP2001322320 2001-10-19
JP2001333650 2001-10-31
JP2001333650 2001-10-31
JP2001333649 2001-10-31
JP2001333649 2001-10-31
PCT/JP2002/010830 WO2003035739A1 (fr) 2001-10-19 2002-10-18 Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition

Publications (2)

Publication Number Publication Date
JPWO2003035739A1 JPWO2003035739A1 (ja) 2005-02-10
JP3915779B2 true JP3915779B2 (ja) 2007-05-16

Family

ID=27482633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003538251A Expired - Lifetime JP3915779B2 (ja) 2001-10-19 2002-10-18 導電性樹脂組成物およびこれを用いた電子部品

Country Status (4)

Country Link
JP (1) JP3915779B2 (ko)
KR (1) KR100616368B1 (ko)
TW (1) TWI253457B (ko)
WO (1) WO2003035739A1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4529404B2 (ja) * 2003-09-30 2010-08-25 日本ケミコン株式会社 固体電解コンデンサの製造方法
JP4720076B2 (ja) * 2003-09-30 2011-07-13 日本ケミコン株式会社 固体電解コンデンサ及びその製造方法
JP4529403B2 (ja) * 2003-09-30 2010-08-25 日本ケミコン株式会社 固体電解コンデンサの製造方法
JP4914769B2 (ja) * 2007-05-31 2012-04-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
JP5374788B2 (ja) * 2009-08-31 2013-12-25 シャープ株式会社 導電性ペースト、太陽電池セル用電極、太陽電池セルおよび太陽電池セルの製造方法
KR102417311B1 (ko) * 2014-07-22 2022-07-07 알파 어셈블리 솔루션스 인크. 가요성 전자 표면을 위한 연신성 상호접속재
WO2017035709A1 (en) 2015-08-28 2017-03-09 E.I. Du Pont De Nemours And Company Coated copper particles and use thereof
CN107922802B (zh) 2015-08-28 2020-09-25 杜邦公司 导电粘合剂
CN107922801B (zh) * 2015-08-28 2020-06-19 杜邦公司 导电粘合剂
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
JP2021105135A (ja) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 熱伝導性組成物
EP4144801A1 (en) * 2020-05-01 2023-03-08 Shoei Chemical Inc. Electroconductive resin composition and manufacturing method for electronic component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431338B2 (ja) * 1994-11-22 2003-07-28 松下電器産業株式会社 半田付着構造体及びこれに用いる導電性組成物
JP3467872B2 (ja) * 1994-12-02 2003-11-17 株式会社村田製作所 多層セラミック基板の製造方法
JP2000007824A (ja) * 1998-06-22 2000-01-11 Jsr Corp 導電性組成物および電極形成用転写フィルム
JP2001351436A (ja) * 2000-06-06 2001-12-21 Hitachi Chem Co Ltd 導電性ペースト組成物及びこれを用いた電子部品

Also Published As

Publication number Publication date
KR100616368B1 (ko) 2006-08-28
WO2003035739A1 (fr) 2003-05-01
TWI253457B (en) 2006-04-21
JPWO2003035739A1 (ja) 2005-02-10
KR20040058202A (ko) 2004-07-03

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