TWI253457B - Electroconductive resin composition and electronic parts using the same - Google Patents

Electroconductive resin composition and electronic parts using the same Download PDF

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Publication number
TWI253457B
TWI253457B TW091124102A TW91124102A TWI253457B TW I253457 B TWI253457 B TW I253457B TW 091124102 A TW091124102 A TW 091124102A TW 91124102 A TW91124102 A TW 91124102A TW I253457 B TWI253457 B TW I253457B
Authority
TW
Taiwan
Prior art keywords
silver
group
powder
copper powder
plated copper
Prior art date
Application number
TW091124102A
Other languages
English (en)
Chinese (zh)
Inventor
Takehiro Shimizu
Hidekazu Matsuura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TWI253457B publication Critical patent/TWI253457B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW091124102A 2001-10-19 2002-10-18 Electroconductive resin composition and electronic parts using the same TWI253457B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001322320 2001-10-19
JP2001322321 2001-10-19
JP2001333649 2001-10-31
JP2001333650 2001-10-31

Publications (1)

Publication Number Publication Date
TWI253457B true TWI253457B (en) 2006-04-21

Family

ID=27482633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091124102A TWI253457B (en) 2001-10-19 2002-10-18 Electroconductive resin composition and electronic parts using the same

Country Status (4)

Country Link
JP (1) JP3915779B2 (ko)
KR (1) KR100616368B1 (ko)
TW (1) TWI253457B (ko)
WO (1) WO2003035739A1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4529404B2 (ja) * 2003-09-30 2010-08-25 日本ケミコン株式会社 固体電解コンデンサの製造方法
JP4720076B2 (ja) * 2003-09-30 2011-07-13 日本ケミコン株式会社 固体電解コンデンサ及びその製造方法
JP4529403B2 (ja) * 2003-09-30 2010-08-25 日本ケミコン株式会社 固体電解コンデンサの製造方法
JP4914769B2 (ja) * 2007-05-31 2012-04-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
JP5374788B2 (ja) * 2009-08-31 2013-12-25 シャープ株式会社 導電性ペースト、太陽電池セル用電極、太陽電池セルおよび太陽電池セルの製造方法
WO2016012753A1 (en) 2014-07-22 2016-01-28 Alpha Metals, Inc. Stretchable interconnects for flexible electronic surfaces
US10629323B2 (en) * 2015-08-28 2020-04-21 Dupont Electronics, Inc. Electrically conductive adhesives
US10967428B2 (en) 2015-08-28 2021-04-06 Dupont Electronics, Inc. Coated copper particles and use thereof
US10611931B2 (en) 2015-08-28 2020-04-07 Dupont Electronics, Inc. Electrically conductive adhesives
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
JP2021105135A (ja) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 熱伝導性組成物
KR20230006863A (ko) * 2020-05-01 2023-01-11 쇼에이 가가쿠 가부시키가이샤 도전성 수지 조성물 및 전자 부품의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431338B2 (ja) * 1994-11-22 2003-07-28 松下電器産業株式会社 半田付着構造体及びこれに用いる導電性組成物
JP3467872B2 (ja) * 1994-12-02 2003-11-17 株式会社村田製作所 多層セラミック基板の製造方法
JP2000007824A (ja) * 1998-06-22 2000-01-11 Jsr Corp 導電性組成物および電極形成用転写フィルム
JP2001351436A (ja) * 2000-06-06 2001-12-21 Hitachi Chem Co Ltd 導電性ペースト組成物及びこれを用いた電子部品

Also Published As

Publication number Publication date
JPWO2003035739A1 (ja) 2005-02-10
KR20040058202A (ko) 2004-07-03
KR100616368B1 (ko) 2006-08-28
JP3915779B2 (ja) 2007-05-16
WO2003035739A1 (fr) 2003-05-01

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