WO2003035739A1 - Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition - Google Patents

Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition Download PDF

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Publication number
WO2003035739A1
WO2003035739A1 PCT/JP2002/010830 JP0210830W WO03035739A1 WO 2003035739 A1 WO2003035739 A1 WO 2003035739A1 JP 0210830 W JP0210830 W JP 0210830W WO 03035739 A1 WO03035739 A1 WO 03035739A1
Authority
WO
WIPO (PCT)
Prior art keywords
electroconductive
powder
resin composition
group
organic solvent
Prior art date
Application number
PCT/JP2002/010830
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Takehiro Shimizu
Hidekazu Matsuura
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to JP2003538251A priority Critical patent/JP3915779B2/ja
Priority to KR1020047005635A priority patent/KR100616368B1/ko
Publication of WO2003035739A1 publication Critical patent/WO2003035739A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2002/010830 2001-10-19 2002-10-18 Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition WO2003035739A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003538251A JP3915779B2 (ja) 2001-10-19 2002-10-18 導電性樹脂組成物およびこれを用いた電子部品
KR1020047005635A KR100616368B1 (ko) 2001-10-19 2002-10-18 도전성 수지조성물 및 이것을 사용한 전자부품

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001322320 2001-10-19
JP2001322321 2001-10-19
JP2001/322320 2001-10-19
JP2001/322321 2001-10-19
JP2001333649 2001-10-31
JP2001/333649 2001-10-31
JP2001/333650 2001-10-31
JP2001333650 2001-10-31

Publications (1)

Publication Number Publication Date
WO2003035739A1 true WO2003035739A1 (fr) 2003-05-01

Family

ID=27482633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/010830 WO2003035739A1 (fr) 2001-10-19 2002-10-18 Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition

Country Status (4)

Country Link
JP (1) JP3915779B2 (ko)
KR (1) KR100616368B1 (ko)
TW (1) TWI253457B (ko)
WO (1) WO2003035739A1 (ko)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109078A (ja) * 2003-09-30 2005-04-21 Nippon Chemicon Corp 固体電解コンデンサの製造方法
JP2005109265A (ja) * 2003-09-30 2005-04-21 Nippon Chemicon Corp 固体電解コンデンサ及びその製造方法
JP2005109077A (ja) * 2003-09-30 2005-04-21 Nippon Chemicon Corp 固体電解コンデンサの製造方法
JP2008300637A (ja) * 2007-05-31 2008-12-11 E I Du Pont De Nemours & Co 固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
WO2011024587A1 (ja) * 2009-08-31 2011-03-03 シャープ株式会社 導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
JP2021105135A (ja) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 熱伝導性組成物
JPWO2021220976A1 (ko) * 2020-05-01 2021-11-04

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016012753A1 (en) 2014-07-22 2016-01-28 Alpha Metals, Inc. Stretchable interconnects for flexible electronic surfaces
US10629323B2 (en) * 2015-08-28 2020-04-21 Dupont Electronics, Inc. Electrically conductive adhesives
US10967428B2 (en) 2015-08-28 2021-04-06 Dupont Electronics, Inc. Coated copper particles and use thereof
US10611931B2 (en) 2015-08-28 2020-04-07 Dupont Electronics, Inc. Electrically conductive adhesives

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08161930A (ja) * 1994-12-02 1996-06-21 Murata Mfg Co Ltd 導電ペースト並びにそれを用いた導電体および多層セラミック基板
JPH08199041A (ja) * 1994-11-22 1996-08-06 Matsushita Electric Ind Co Ltd 半田付着構造体及びこれに用いる導電性組成物
JP2000007824A (ja) * 1998-06-22 2000-01-11 Jsr Corp 導電性組成物および電極形成用転写フィルム
JP2001351436A (ja) * 2000-06-06 2001-12-21 Hitachi Chem Co Ltd 導電性ペースト組成物及びこれを用いた電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08199041A (ja) * 1994-11-22 1996-08-06 Matsushita Electric Ind Co Ltd 半田付着構造体及びこれに用いる導電性組成物
JPH08161930A (ja) * 1994-12-02 1996-06-21 Murata Mfg Co Ltd 導電ペースト並びにそれを用いた導電体および多層セラミック基板
JP2000007824A (ja) * 1998-06-22 2000-01-11 Jsr Corp 導電性組成物および電極形成用転写フィルム
JP2001351436A (ja) * 2000-06-06 2001-12-21 Hitachi Chem Co Ltd 導電性ペースト組成物及びこれを用いた電子部品

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4720076B2 (ja) * 2003-09-30 2011-07-13 日本ケミコン株式会社 固体電解コンデンサ及びその製造方法
JP4529404B2 (ja) * 2003-09-30 2010-08-25 日本ケミコン株式会社 固体電解コンデンサの製造方法
JP2005109077A (ja) * 2003-09-30 2005-04-21 Nippon Chemicon Corp 固体電解コンデンサの製造方法
JP2005109078A (ja) * 2003-09-30 2005-04-21 Nippon Chemicon Corp 固体電解コンデンサの製造方法
JP4529403B2 (ja) * 2003-09-30 2010-08-25 日本ケミコン株式会社 固体電解コンデンサの製造方法
JP2005109265A (ja) * 2003-09-30 2005-04-21 Nippon Chemicon Corp 固体電解コンデンサ及びその製造方法
JP2008300637A (ja) * 2007-05-31 2008-12-11 E I Du Pont De Nemours & Co 固体電解コンデンサ電極用導体ペーストおよび該導体ペーストを使用した固体電解コンデンサの電極の製造方法
WO2011024587A1 (ja) * 2009-08-31 2011-03-03 シャープ株式会社 導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法
JP2011054313A (ja) * 2009-08-31 2011-03-17 Sharp Corp 導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法
EP3236479A1 (en) 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
WO2017182621A1 (en) 2016-04-21 2017-10-26 Henkel Ag & Co. Kgaa An electrically conductive, hot-melt adhesive or moulding composition
IT201800021346A1 (it) 2018-12-28 2020-06-28 Enrico Luigi Seveso Resina di tipo hot-melt per dissipare calore, non conduttiva elettricamente e/o isolante elettricamente.
JP2021105135A (ja) * 2019-12-26 2021-07-26 住友金属鉱山株式会社 熱伝導性組成物
JPWO2021220976A1 (ko) * 2020-05-01 2021-11-04
WO2021220976A1 (ja) * 2020-05-01 2021-11-04 昭栄化学工業株式会社 導電性樹脂組成物及び電子部品の製造方法
JP7078194B2 (ja) 2020-05-01 2022-05-31 昭栄化学工業株式会社 電子部品の電極形成用導電性樹脂組成物

Also Published As

Publication number Publication date
JPWO2003035739A1 (ja) 2005-02-10
TWI253457B (en) 2006-04-21
KR20040058202A (ko) 2004-07-03
KR100616368B1 (ko) 2006-08-28
JP3915779B2 (ja) 2007-05-16

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