DE60022286D1 - Leitfähige Beschichtung auf einem nichtleitenden, flexiblen Substrat - Google Patents

Leitfähige Beschichtung auf einem nichtleitenden, flexiblen Substrat

Info

Publication number
DE60022286D1
DE60022286D1 DE60022286T DE60022286T DE60022286D1 DE 60022286 D1 DE60022286 D1 DE 60022286D1 DE 60022286 T DE60022286 T DE 60022286T DE 60022286 T DE60022286 T DE 60022286T DE 60022286 D1 DE60022286 D1 DE 60022286D1
Authority
DE
Germany
Prior art keywords
conductive coating
nonconductive
flexible substrate
conductive
emi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60022286T
Other languages
English (en)
Other versions
DE60022286T2 (de
Inventor
Alexander Botrie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemque Inc
Original Assignee
Chemque Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemque Inc filed Critical Chemque Inc
Application granted granted Critical
Publication of DE60022286D1 publication Critical patent/DE60022286D1/de
Publication of DE60022286T2 publication Critical patent/DE60022286T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/064—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces the packing combining the sealing function with other functions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/021—Sealings between relatively-stationary surfaces with elastic packing
    • F16J15/022—Sealings between relatively-stationary surfaces with elastic packing characterised by structure or material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0041—Foam properties having specified density
    • C08G2110/005—< 50kg/m3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0075—Foam properties prepared with an isocyanate index of 60 or lower
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
DE60022286T 1999-10-20 2000-10-19 Leitfähige Beschichtung auf einem nichtleitenden, flexiblen Substrat Expired - Fee Related DE60022286T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US421559 1999-10-20
US09/421,559 US6670545B2 (en) 1999-10-20 1999-10-20 Conductive coating on a non-conductive flexible substrate

Publications (2)

Publication Number Publication Date
DE60022286D1 true DE60022286D1 (de) 2005-10-06
DE60022286T2 DE60022286T2 (de) 2006-06-29

Family

ID=23671057

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60022286T Expired - Fee Related DE60022286T2 (de) 1999-10-20 2000-10-19 Leitfähige Beschichtung auf einem nichtleitenden, flexiblen Substrat

Country Status (6)

Country Link
US (1) US6670545B2 (de)
EP (1) EP1094257B1 (de)
AT (1) ATE303538T1 (de)
CA (1) CA2323323A1 (de)
DE (1) DE60022286T2 (de)
PT (1) PT1094257E (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0965255B2 (de) 1997-03-05 2010-10-20 Bernd Tiburtius Verfahren zur herstellung eines abschirmgehäuses
US6646199B2 (en) 1999-10-20 2003-11-11 Chemque, Inc. Polymeric foam gaskets and seals
US6784363B2 (en) 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US7039361B1 (en) * 2002-02-01 2006-05-02 Ciena Corporation System and method for reducing electromagnetic interference
US7060348B2 (en) 2002-03-08 2006-06-13 Laird Technologies, Inc. Flame retardant, electrically conductive shielding materials and methods of making the same
US6777026B2 (en) * 2002-10-07 2004-08-17 Lord Corporation Flexible emissive coatings for elastomer substrates
US6723916B2 (en) 2002-03-15 2004-04-20 Parker-Hannifin Corporation Combination EMI shielding and environmental seal gasket construction
US20040104835A1 (en) * 2002-10-09 2004-06-03 Takeyuki Ojima Microwave absorbent devices and materials
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
US6818822B1 (en) * 2004-04-08 2004-11-16 International Business Machines Corporation Conductive gasket including internal contact-enhancing strip
US8545974B2 (en) 2005-02-09 2013-10-01 Laird Technologies, Inc. Flame retardant EMI shields
ATE525422T1 (de) 2006-09-28 2011-10-15 3M Innovative Properties Co Verfahren, system und dessen verwendung zur bekämpfung der rollneigung bei mehrschichtigen bahnen
US20080280125A1 (en) * 2007-05-08 2008-11-13 Gary Allen Denton Components with A Conductive Copper Sulfide Skin
US20090008431A1 (en) * 2007-07-03 2009-01-08 Kossi Zonvide Solderable EMI Gasket and Grounding Pad
US20090176082A1 (en) * 2008-01-03 2009-07-09 International Business Machines Corporation Electrically conducting gasket, method of manufacture thereof and articles comprising the same
GB0800757D0 (en) 2008-01-17 2008-02-27 Airbus Uk Ltd Elastomeric sealing member
EP2338319B1 (de) * 2008-09-26 2015-02-11 Parker-Hannifin Corporation Emi-abschirmung aus elektrisch leitendem schaumstoff
DE102009022334B4 (de) * 2009-05-13 2023-01-05 Parker Hannifin Gmbh Dichtung mit L-förmigem Querschnitt
DE102009044533A1 (de) * 2009-11-16 2011-05-19 Contitech Antriebssysteme Gmbh Artikel mit einer reflektierenden Schutzschicht und Verfahren zu dessen Herstellung
US8952258B2 (en) * 2012-09-21 2015-02-10 International Business Machines Corporation Implementing graphene interconnect for high conductivity applications
US9892945B2 (en) * 2012-10-09 2018-02-13 Nippon Valqua Industries, Ltd. Composite seal
US9089074B2 (en) * 2012-11-16 2015-07-21 International Business Machines Corporation Heat sink structure with radio frequency absorption
US20140272375A1 (en) * 2013-03-15 2014-09-18 Texas A&M University System Electrically conductive and dissipative polyurethane foams

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3140342A (en) * 1963-07-05 1964-07-07 Chomerics Inc Electrical shielding and sealing gasket
US4652695A (en) 1983-06-20 1987-03-24 Pawling Corporation Mesh-covered core strip for high frequency RFI/EMI radiation shielding
US4857668A (en) 1988-04-15 1989-08-15 Schlegel Corporation Multi-function gasket
US4931479B1 (en) 1988-11-07 2000-10-10 Parker Intangibles Inc Foam in place conductive polyurethane foam
US5141770A (en) 1988-11-10 1992-08-25 Vanguard Products Corporation Method of making dual elastomer gasket shield for electromagnetic shielding
US4968854A (en) 1988-11-10 1990-11-06 Vanguard Products Corporation Dual elastomer gasket shield for electronic equipment
US5045635A (en) * 1989-06-16 1991-09-03 Schlegel Corporation Conductive gasket with flame and abrasion resistant conductive coating
US5061566A (en) 1989-12-28 1991-10-29 Chomerics, Inc. Corrosion inhibiting emi/rfi shielding coating and method of its use
WO1993023226A1 (en) 1992-05-13 1993-11-25 Chomerics, Inc. Injection co-molded emi/rfi shielding gasket
DE9209035U1 (de) 1992-07-06 1992-09-10 Knürr-Mechanik für die Elektronik AG, 8000 München Hochfrequenz-Abschirm- und Dichtungsvorrichtung
US5545474A (en) 1994-03-01 1996-08-13 Martin Marietta Corporation Electromagnetic-attenuating coating materials
DE19529624C2 (de) 1995-08-11 1999-07-01 Knuerr Mechanik Ag Verfahren und Vorrichtung zum Herstellen einer Abschirmdichtung
US6075205A (en) * 1997-10-27 2000-06-13 Parker-Hannifin Corporation Tubular extrusion gasket profile exhibiting a controlled deflection response for improved environmental sealing and EMI shielding

Also Published As

Publication number Publication date
PT1094257E (pt) 2005-11-30
US6670545B2 (en) 2003-12-30
EP1094257B1 (de) 2005-08-31
EP1094257A2 (de) 2001-04-25
ATE303538T1 (de) 2005-09-15
US20030010515A1 (en) 2003-01-16
DE60022286T2 (de) 2006-06-29
EP1094257A3 (de) 2002-10-23
CA2323323A1 (en) 2001-04-20

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee