BR0007094A - Placa e estrutura de blindagem eletromagnética e sistema de entretenimento - Google Patents

Placa e estrutura de blindagem eletromagnética e sistema de entretenimento

Info

Publication number
BR0007094A
BR0007094A BR0007094-7A BR0007094A BR0007094A BR 0007094 A BR0007094 A BR 0007094A BR 0007094 A BR0007094 A BR 0007094A BR 0007094 A BR0007094 A BR 0007094A
Authority
BR
Brazil
Prior art keywords
electromagnetic shielding
shielding plate
plate
entertainment system
connecting strip
Prior art date
Application number
BR0007094-7A
Other languages
English (en)
Inventor
Toshikatsu Hama
Osamu Murasawa
Original Assignee
Sony Comp Entertaiment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Comp Entertaiment Inc filed Critical Sony Comp Entertaiment Inc
Publication of BR0007094A publication Critical patent/BR0007094A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Golf Clubs (AREA)

Abstract

"PLACA E ESTRUTURA DE BLINDAGEM ELETROMAGNéTICA E SISTEMA DE ENTRETENIMENTO". Uma placa de blindagem eletromagnética possuindo elevado efeito de blindagem é provida. Uma placa de blindagem eletromagnética (100) composta de uma placa condutora plana elástica compreende uma peça de conexão (104) tendo uma extremidade dianteira projetando-se a partir da placa e dobrada e uma porção de suporte (105) em uma borda da placa (100). Quando a placa de blindagem eletromagnética (100) é acoplada a um painel impresso (200) a peça de conexão (104) entra em contato com um padrão de aterramento (201) sobre o painel impresso (200), produzindo deste modo um alto efeito de blindagem.
BR0007094-7A 1999-09-10 2000-09-11 Placa e estrutura de blindagem eletromagnética e sistema de entretenimento BR0007094A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25779199A JP3270028B2 (ja) 1999-09-10 1999-09-10 電磁シールド板、電磁シールド構造体及びエンタテインメント装置
PCT/JP2000/006192 WO2001020963A1 (fr) 1999-09-10 2000-09-11 Plaque et structure de blindage contre les champs electromagnetiques, et dispositif recreatif

Publications (1)

Publication Number Publication Date
BR0007094A true BR0007094A (pt) 2001-07-31

Family

ID=17311167

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0007094-7A BR0007094A (pt) 1999-09-10 2000-09-11 Placa e estrutura de blindagem eletromagnética e sistema de entretenimento

Country Status (12)

Country Link
US (1) US6930891B1 (pt)
EP (1) EP1130953B1 (pt)
JP (1) JP3270028B2 (pt)
KR (1) KR100708056B1 (pt)
CN (1) CN1285247C (pt)
AT (1) ATE512575T1 (pt)
AU (1) AU6877500A (pt)
BR (1) BR0007094A (pt)
CA (1) CA2351204A1 (pt)
RU (1) RU2001116590A (pt)
TW (1) TWM250700U (pt)
WO (1) WO2001020963A1 (pt)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298283A (ja) * 2002-03-28 2003-10-17 Seiko Epson Corp 電磁波シールド部材、記録装置
EP1359794A1 (en) 2002-04-30 2003-11-05 Sony Ericsson Mobile Communications AB A method for soldering a shield can to a PCB and shield can therefor
WO2003094588A1 (en) * 2002-04-30 2003-11-13 Sony Ericsson Mobile Communications Ab A method for attaching a shield can to a pcb and a shield can therefor
JP4195975B2 (ja) * 2002-10-16 2008-12-17 パナソニック株式会社 高周波装置
EP1446000B1 (en) * 2003-02-07 2011-11-09 Sony Ericsson Mobile Communications AB A shield can for shielding electronic components on a PWB
FI20035178A (fi) * 2003-10-03 2005-04-04 Nokia Corp Häiriösuojattu matkaviestin sekä vastaava menetelmä ja järjestely matkaviestimen häiriösuojauksessa
EP1603381B1 (de) * 2004-03-12 2012-10-31 Hirschmann Car Communication GmbH Federblech in einem Gehäuse als Abschirmung für ein elektronisches hochfrequenztechnisches Gerät
CN2757512Y (zh) * 2004-12-04 2006-02-08 鸿富锦精密工业（深圳）有限公司 防磁盖
US6992901B1 (en) * 2005-03-18 2006-01-31 Inventec Appliances Corp. Shielding device for an electronic apparatus
JP4530091B2 (ja) * 2006-03-20 2010-08-25 株式会社村田製作所 シールド構造
JP4844883B2 (ja) * 2006-07-20 2011-12-28 日本電気株式会社 電子機器及びプリント基板のｇｎｄ接続方法
JP2008164330A (ja) * 2006-12-27 2008-07-17 Matsushita Electric Ind Co Ltd 超音波流量計
GB2445378B (en) * 2007-01-04 2009-06-17 Motorola Inc Electronic component housing assembly and a method of its manufacture
US7488902B2 (en) 2007-01-25 2009-02-10 Laird Technologies, Inc. Electromagnetic interference shielding apparatus and methods of making the same
US8218335B2 (en) * 2007-07-11 2012-07-10 Finisar Corporation Spider clip for securing a circuit board within a communications module
JP5386500B2 (ja) * 2007-11-12 2014-01-15 トムソン ライセンシング チューナーハウジング
CN101453826B (zh) * 2007-11-28 2011-12-21 深圳富泰宏精密工业有限公司 印刷电路板堆叠结构
JP2009177059A (ja) * 2008-01-28 2009-08-06 Mitsubishi Electric Corp 電子回路のシールド構造
CN101257526B (zh) * 2008-04-07 2015-04-22 Tcl天一移动通信（深圳）有限公司 一种移动通信终端的组合式电池盖侧面接地结构
JP5005091B2 (ja) * 2008-06-05 2012-08-22 三菱電機株式会社 基板の保持・固定構造
JP5107158B2 (ja) * 2008-06-30 2012-12-26 シャープ株式会社 電子機器モジュール
US8363861B2 (en) * 2009-03-20 2013-01-29 Brian Hughes Entertainment system for use during the operation of a magnetic resonance imaging device
JP2010272747A (ja) * 2009-05-22 2010-12-02 Kyocera Corp 基板ユニット及び電子機器、並びに回路基板用金属部品
EP2285200B1 (en) * 2009-08-07 2013-05-29 Cinterion Wireless Modules GmbH One-piece shielding hood with one or more pins
JPWO2011074383A1 (ja) * 2009-12-14 2013-04-25 新日鐵住金株式会社 誘導加熱装置の制御装置、誘導加熱システム及び誘導加熱装置の制御方法
CN101801169A (zh) * 2009-12-29 2010-08-11 闻泰集团有限公司 一种电磁屏蔽装置
JP5149320B2 (ja) * 2010-03-17 2013-02-20 株式会社ソニー・コンピュータエンタテインメント 電子機器
CN102223783A (zh) * 2010-04-19 2011-10-19 鸿富锦精密工业（深圳）有限公司 屏蔽罩及具有屏蔽罩的电子装置
JP5383740B2 (ja) 2011-04-18 2014-01-08 株式会社ソニー・コンピュータエンタテインメント 電子機器
JP5236771B2 (ja) 2011-04-18 2013-07-17 株式会社ソニー・コンピュータエンタテインメント 電子機器
JP5328058B2 (ja) * 2011-07-14 2013-10-30 任天堂株式会社 メモリカートリッジ
JP2013089313A (ja) * 2011-10-13 2013-05-13 Tyco Electronics Japan Kk コネクタ
US8724342B2 (en) * 2012-03-21 2014-05-13 Gentex Corporation Shield with resilient spring snaps for removable attachment to an electrical circuit board without the use of adhesive or solder
EP2943049B1 (en) * 2014-03-13 2020-10-07 Huawei Device Co., Ltd. Electronic device
FR3020742B1 (fr) * 2014-05-05 2016-05-27 Valeo Systemes De Controle Moteur Systeme electrique avec blindage
KR102350499B1 (ko) * 2015-02-17 2022-01-14 삼성전자주식회사 전자장치용 전자기 쉴드 구조
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
KR102444053B1 (ko) * 2015-11-20 2022-09-19 삼성전자주식회사 차폐 구조를 구비하는 전자 장치
KR102475280B1 (ko) 2016-02-04 2022-12-07 삼성전자주식회사 반도체 패키지 및 반도체 장치
US10342167B2 (en) 2016-11-01 2019-07-02 Gentex Corporation Electromagnetic shield for rearview assembly
JP6691495B2 (ja) * 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
FI128396B (en) * 2017-11-15 2020-04-30 Teknologian Tutkimuskeskus Vtt Oy Method of providing lighting, source of electromagnetic radiation providing illumination and uses of said source
EP3487274A1 (en) * 2017-11-20 2019-05-22 Valeo Comfort and Driving Assistance Electronic device comprising a structral piece with a cage positionned over an electronic component
KR102665774B1 (ko) 2019-08-07 2024-05-14 삼성전자주식회사 쉴드캔 구조를 포함하는 전자 장치
JP7456829B2 (ja) * 2020-03-27 2024-03-27 ラピスセミコンダクタ株式会社 シールドケース及び電子回路モジュール
CN115884583A (zh) * 2021-09-30 2023-03-31 荣耀终端有限公司 电路板组件以及电子设备
US20240057292A1 (en) * 2022-08-09 2024-02-15 Harman International Industries, Incorporated Systems and methods for an electronic device

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4833717A (en) 1985-11-21 1989-05-23 Ricoh Company, Ltd. Voice spectrum analyzing system and method
JPS6310597A (ja) 1986-07-01 1988-01-18 松下電器産業株式会社 カバ−の取付装置
JPS6310597U (pt) * 1986-07-08 1988-01-23
US4754101A (en) * 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
JPS63153598U (pt) * 1987-03-30 1988-10-07
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US5373101A (en) 1991-05-03 1994-12-13 Motorola, Inc. Electrical interconnect apparatus
US5365410A (en) * 1991-10-22 1994-11-15 Nokia Mobile Phones Ltd. Electromagnetic compatibility enclosure
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
JPH0672296A (ja) 1992-08-28 1994-03-15 Toyota Motor Corp 車両の自動パーキング装置
JPH0672296U (ja) * 1993-03-26 1994-10-07 株式会社セガ・エンタープライゼス カートリッジ着脱用コネクター部の取付け構造
GB2285181A (en) * 1993-12-23 1995-06-28 Hitec Sheet Metal Limited Electromagnetic radiation shielding for printed circuit boards
EP0755177B1 (en) 1995-07-21 1999-01-20 Molex Incorporated Shield cover and shielding method using the same
JP2734439B2 (ja) 1995-12-29 1998-03-30 日本電気株式会社 プリント基板のシールド構造
US5748455A (en) * 1996-04-23 1998-05-05 Ericsson, Inc. Electromagnetic shield for a radiotelephone
JP2809211B2 (ja) 1996-07-26 1998-10-08 日本電気株式会社 電子機器のシールド構造
DE19649516A1 (de) * 1996-11-29 1998-06-04 Bosch Gmbh Robert Elektrisch leitfähiges Gehäuse für ein elektrisches Gerät
GB2320815B (en) * 1996-12-23 2001-12-12 Nokia Mobile Phones Ltd Antenna assembly
GB2322012B (en) * 1997-02-05 2001-07-11 Nokia Mobile Phones Ltd Self securing RF screened housing
JPH1130961A (ja) 1997-07-11 1999-02-02 Daikashiya:Kk 価額表示ボード
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US6180045B1 (en) * 1998-05-20 2001-01-30 Delco Electronics Corporation Method of forming an overmolded electronic assembly
US6239359B1 (en) * 1999-05-11 2001-05-29 Lucent Technologies, Inc. Circuit board RF shielding
US6330167B1 (en) * 1999-05-21 2001-12-11 Intel Corporation Electronic assembly with an electromagnetic radiation shielding cap
TW411037U (en) * 1999-06-11 2000-11-01 Ind Tech Res Inst Integrated circuit packaging structure with dual directions of thermal conduction path
US6320121B1 (en) * 1999-09-14 2001-11-20 Lucent Technologies Inc. Radio frequency shield can cover with internal fingers
US6288330B1 (en) * 1999-10-08 2001-09-11 Compal Electronics, Inc. Cover device adapted to provide electromagnetic interference shielding to an electronic component that is received in a housing of an electrical appliance

Also Published As

Publication number Publication date
RU2001116590A (ru) 2003-06-10
AU6877500A (en) 2001-04-17
JP3270028B2 (ja) 2002-04-02
EP1130953B1 (en) 2011-06-08
ATE512575T1 (de) 2011-06-15
KR100708056B1 (ko) 2007-04-16
CN1285247C (zh) 2006-11-15
WO2001020963A1 (fr) 2001-03-22
JP2001085884A (ja) 2001-03-30
EP1130953A1 (en) 2001-09-05
TWM250700U (en) 2004-11-21
EP1130953A4 (en) 2005-10-12
US6930891B1 (en) 2005-08-16
CN1327712A (zh) 2001-12-19
KR20010080934A (ko) 2001-08-25
CA2351204A1 (en) 2001-03-22

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]