WO2021220976A1 - 導電性樹脂組成物及び電子部品の製造方法 - Google Patents
導電性樹脂組成物及び電子部品の製造方法 Download PDFInfo
- Publication number
- WO2021220976A1 WO2021220976A1 PCT/JP2021/016514 JP2021016514W WO2021220976A1 WO 2021220976 A1 WO2021220976 A1 WO 2021220976A1 JP 2021016514 W JP2021016514 W JP 2021016514W WO 2021220976 A1 WO2021220976 A1 WO 2021220976A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive resin
- resin composition
- mass
- metal powder
- electrode
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 226
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 271
- 239000011347 resin Substances 0.000 claims abstract description 271
- 229910052751 metal Inorganic materials 0.000 claims abstract description 135
- 239000002184 metal Substances 0.000 claims abstract description 135
- 239000000843 powder Substances 0.000 claims abstract description 135
- 229920002050 silicone resin Polymers 0.000 claims abstract description 106
- 239000011230 binding agent Substances 0.000 claims abstract description 80
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 55
- 239000003822 epoxy resin Substances 0.000 claims description 45
- 229920000647 polyepoxide Polymers 0.000 claims description 45
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 230000035699 permeability Effects 0.000 claims description 21
- 229920001187 thermosetting polymer Polymers 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- 239000003990 capacitor Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 229920002799 BoPET Polymers 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000008213 purified water Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 232
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 42
- 239000000203 mixture Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 26
- 239000003795 chemical substances by application Substances 0.000 description 22
- 238000007747 plating Methods 0.000 description 19
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 19
- 239000002245 particle Substances 0.000 description 16
- 235000019445 benzyl alcohol Nutrition 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 12
- 238000013461 design Methods 0.000 description 12
- 238000000518 rheometry Methods 0.000 description 11
- 239000007784 solid electrolyte Substances 0.000 description 11
- 229910052799 carbon Inorganic materials 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 5
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 4
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 4
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 239000002518 antifoaming agent Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- HORIEOQXBKUKGQ-UHFFFAOYSA-N bis(7-methyloctyl) cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1CCCCC1C(=O)OCCCCCCC(C)C HORIEOQXBKUKGQ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 238000004438 BET method Methods 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000004806 diisononylester Substances 0.000 description 2
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 2
- 229960001826 dimethylphthalate Drugs 0.000 description 2
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- FFQALBCXGPYQGT-UHFFFAOYSA-N 2,4-difluoro-5-(trifluoromethyl)aniline Chemical compound NC1=CC(C(F)(F)F)=C(F)C=C1F FFQALBCXGPYQGT-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- HBNHCGDYYBMKJN-UHFFFAOYSA-N 2-(4-methylcyclohexyl)propan-2-yl acetate Chemical compound CC1CCC(C(C)(C)OC(C)=O)CC1 HBNHCGDYYBMKJN-UHFFFAOYSA-N 0.000 description 1
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 241000862969 Stella Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 1
- VAWSWDPVUFTPQO-UHFFFAOYSA-N calcium strontium Chemical compound [Ca].[Sr] VAWSWDPVUFTPQO-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
Definitions
- the present invention is an electrode of an electronic component for manufacturing an electronic component by forming an electrode on a electrode-forming body for an electronic component such as a laminate for a laminated electronic component and a cathode-formed body for a solid electrolytic capacitor.
- the present invention relates to a conductive resin composition for forming.
- the present invention also relates to a method for manufacturing an electronic component using the conductive resin composition.
- Patent Document 1 discloses a laminated electronic component including an external electronic electrode in which a conductive resin layer is formed on a base metal layer formed by plating.
- the conductive resin layer since the conductive resin layer is formed on the underlying metal layer, the conductive resin layer relieves stress even if the substrate on which the laminated electronic component is mounted is bent. By doing so, the occurrence of cracks can be suppressed.
- Patent Document 2 discloses a conductive resin composition containing a conductive filler, a chelate-forming substance, a phenol resin, a modified epoxy resin, and a boron compound.
- the conductive resin layer formed of the conductive tree composition containing epoxy resin as the main component of the resin has a certain degree of moisture resistance, it has high moisture resistance required for electronic parts used in mobile devices and automobiles. It was inadequate for sex.
- a first object of the present invention is to provide a conductive resin composition for forming electrodes of electronic components having high moisture resistance.
- a second object of the present invention is to provide a conductive resin composition for forming electrodes of electronic components, which has high moisture resistance, few restrictions on design and manufacturing, and high manufacturing efficiency. ..
- the present inventors have used a conductive resin composition containing a predetermined amount of silicone resin as a resin binder to make the electrode-formed body for electronic parts conductive.
- a resin binder By forming the resin layer, an electronic component having excellent moisture resistance can be obtained and design restrictions can be reduced as compared with the case of using a conductive resin composition containing an epoxy resin as a main component of a resin binder.
- the present invention (1) includes a preparatory step for preparing an electrode-formed body for an electronic component and a preparatory step.
- the metal powder, the resin binder, and the organic solvent are contained, and 20.0% by mass or more of the metal powder is flake-shaped metal powder, and 70.0% by mass of the resin binder.
- the conductive resin layer is formed on the electrode-formed body for electronic parts.
- the present invention provides a method for manufacturing an electronic component, which is characterized by the above.
- the present invention (2) contains a metal powder, a resin binder, and an organic solvent.
- the metal powder 20.0% by mass or more is flaky metal powder.
- 70.0% by mass or more of the resin binder is a silicone resin.
- the present invention provides a conductive resin composition characterized by the above.
- the present invention (3) provides the conductive resin composition of (2), wherein 80.0% by mass or more of the resin binder is a silicone resin.
- the present invention (4) is characterized in that the content of the resin binder is 2.5 to 35.0 parts by mass with respect to 100.0 parts by mass of the metal powder (2) or (3). ) Is provided.
- the present invention (5) provides the conductive resin composition according to any one of (2) to (4), wherein the silicone resin has an epoxy group.
- the present invention (6) provides the conductive resin composition according to any one of (2) to (4), wherein the silicone resin has a hydroxyl group.
- the present invention (7) provides the conductive resin composition according to any one of (2) to (4), wherein the silicone resin is a thermosetting silicone resin.
- the present invention (8) is characterized in that, of the resin binder, more than 0.0% by mass and 20.0% by mass or less is an epoxy resin, which is the conductive resin according to any one of (2) to (7). It provides a composition.
- the present invention (9) provides the conductive resin composition according to any one of (2) to (8), wherein the flake-shaped metal powder has an aspect ratio of 1.5 to 50.0. It is a thing.
- the metal powder is a powder containing one or more of silver, copper, nickel, palladium, platinum, gold and aluminum, and a powder containing an alloy containing one or more of these.
- the present invention provides the conductive resin composition according to any one of (2) to (9), which is at least one powder selected from silver-coated copper powder and silver-coated nickel powder.
- the present invention (11) further provides a conductive resin composition according to any one of (2) to (10), which further contains a plasticizer.
- the value of the phase difference ⁇ between the strain and the stress generated by the strain is 32 to 88. It provides the conductive resin composition according to any one of (2) to (11), which is characterized by being in the range of °.
- the ratio of the viscosity of the conductive resin composition at a shear rate of 0.4 (1 / s) to the viscosity at a shear rate of 40 (1 / s) is 1.4 to 60.0.
- the present invention provides the conductive resin composition according to any one of (2) to (12), which is in the range of (2) to (12).
- the present invention (14) provides the conductive resin composition according to any one of (2) to (13), wherein the conductive resin composition is for forming an external electrode of a laminated electronic component. Is what you do.
- the present invention provides the conductive resin composition according to any one of (2) to (13), wherein the conductive resin composition is for forming a cathode of a solid electrolytic capacitor. Is.
- the present invention (16) provides the conductive resin composition of (14), wherein the conductive resin composition is for dip printing.
- the present invention (17) provides the conductive resin composition according to any one of (2) to (16), wherein the moisture permeability determined by the following moisture permeability measurement test is 80.0 mg or less. Is what you do.
- ⁇ Moisture permeability measurement test> The conductive resin composition was cast on a PET film to a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes. The obtained cured film was cut into a circle with a diameter of 7.5 mm, and a 5 ml glass bottle containing 2 g of silica gel was contained.
- the present invention is a conductive resin composition containing a metal powder, a resin binder, and an organic solvent.
- the metal powder is 100.0 parts by mass
- the content of the resin binder is 5.0 to 25.0 parts by mass.
- 80.0% by mass or more is a silicone resin.
- the metal powder 20.0% by mass or more is a flake-shaped metal powder.
- the ratio of the viscosity of the conductive resin composition to the viscosity at a shear rate of 40 (1 / s) at a shear rate of 0.4 (1 / s) is in the range of 1.5 to 20.0.
- the present invention provides the conductive resin composition according to (3).
- a conductive resin composition for forming electrodes of electronic components having high moisture resistance it is possible to provide a conductive resin composition for forming electrodes of electronic components having high moisture resistance. Further, according to the present invention, it is possible to provide a conductive resin composition for forming an electrode of an electronic component having high moisture resistance, few restrictions on design and manufacturing, and high manufacturing efficiency.
- the conductive resin composition of the present invention contains a metal powder, a resin binder, and an organic solvent.
- a metal powder 20.0% by mass or more is flaky metal powder.
- 70.0% by mass or more of the resin binder is a silicone resin. It is a conductive resin composition characterized by.
- FIG. 1 is a schematic perspective view showing a laminated electronic component.
- FIG. 2 is a schematic cross-sectional view showing a laminated electronic component mounted on a substrate.
- the laminated electronic component 10 is formed on an outer surface on both ends of a laminated electronic component laminate 1 composed of a plurality of ceramic layers and a plurality of internal electrode layers, and an internal electrode. It consists of external terminal electrodes 2 and 3 that are electrically connected to the layer.
- the external terminal electrodes 2 and 3 are a metal layer 4 formed on the outer surface of the laminated body 1 for laminated electronic components, a conductive resin layer 5 formed on the surface of the metal layer 4, and a conductive resin. It is composed of a plating layer 6 formed on the surface of the layer 5. That is, in the external terminal electrodes 2 and 3, the conductive resin layer 5 is arranged between the metal layer 4 and the plating layer 6. Then, the laminated electronic component 10 is mounted on the substrate 8 by the solder 7.
- the conductive resin composition of the present invention contains a metal powder, a resin binder, and an organic solvent.
- the conductive resin composition of the present invention contains metal powder as a conductive material.
- the metal powder include powder containing at least one of silver powder, copper powder, nickel powder, palladium powder, platinum powder, gold powder, aluminum powder and the like, silver, copper, nickel, palladium, platinum, gold and the like.
- Examples include powders containing one or more alloys of aluminum, silver-coated copper powders, and silver-coated nickel powders.
- the conductive resin composition of the present invention 20.0% by mass or more of the total metal powder is flaky metal powder.
- the content ratio of the flake-shaped metal powder to the entire metal powder is 20.0 to 100.0% by mass, preferably 40.0 to 100.0% by mass, and particularly preferably 60.0 to 100.0% by mass.
- the conductivity and adhesiveness of the obtained conductive resin layer are increased.
- the aspect ratio of the flake-like metal powder is preferably 1.5 to 50.0, more preferably 2.0 to 30.0, and particularly preferably 5.0 to 20.0.
- the aspect ratio of the flake-shaped metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased.
- the aspect ratio of the flake-shaped metal powder is 50 metals arbitrarily selected in the scanning electron microscope (SEM) image observation with the particle diameter (thickness / particle diameter) relative to the particle thickness as the aspect ratio. The aspect ratio of the powder was measured and the average value was calculated.
- the number average particle size of the flake-shaped metal powder as measured using a scanning electron microscope (SEM) is preferably 0.1 to 20.0 ⁇ m, more preferably 0.3 to 15.0 ⁇ m, and even more preferably 0. It is .5 to 10.0 ⁇ m, particularly preferably 1.0 to 5.0 ⁇ m.
- the number average particle diameter of the flake-shaped metal powder when measured using a scanning electron microscope (SEM) is an SEM (scanning electron microscope) image observation with the diameter of the longest part of the particles as the particle diameter.
- the particle size of 50 metal powders arbitrarily selected in the above was measured, and the average value thereof was determined as a number average particle size.
- the specific surface area of the flake-shaped metal powder is preferably 0.5 to 5.0 m 2 / g, particularly preferably 0.6 to 4.0 m 2 / g.
- the specific surface area of the flake-shaped metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased.
- the metal powder contains flake-shaped metal powder and spherical metal powder, and "the content ratio of the spherical metal powder to the total metal powder is 80.0% by mass or less, and the content of the flake-shaped metal powder to the total metal powder". Is preferably 20.0% by mass or more, and "the content ratio of the spherical metal powder to the entire metal powder is 60.0% by mass or less, and the content of the flake-shaped metal powder to the entire metal powder is 40. It is particularly preferable that it is 0.0% by mass or more. When the content ratio of the flake-shaped metal powder and the spherical metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are enhanced.
- the volume-based cumulative 50% particle size (D 50 ) of the spherical metal powder is preferably 0.01 to 7.0 ⁇ m, particularly preferably 0.03 to 5.0 ⁇ m.
- D 50 of the spherical metal powder is in the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased.
- a 50% value (D 50 ) in the volume-based integrated fraction was determined by using a laser diffraction type particle size distribution measuring device.
- the specific surface area of the spherical metal powder is preferably 0.2 to 3.0 m 2 / g, particularly preferably 0.3 to 2.5 m 2 / g.
- the conductivity and adhesiveness of the obtained conductive resin layer are increased.
- the conductive resin composition of the present invention contains at least a silicone resin as a resin binder.
- the conductive resin composition of the present invention 70.0% by mass or more of the total resin binder is a silicone resin.
- the content ratio of the silicone resin to the total resin binder is 70.0 to 100.0% by mass, preferably 80.0 to 100.0% by mass, and more preferably 90.0 to 90.0 to 10% by mass. It is 100.0% by mass, particularly preferably 95.0 to 100.0% by mass.
- the silicone resin examples include a thermosetting silicone resin and a thermoplastic silicone resin, and among these, a thermosetting silicone resin is preferable.
- thermosetting silicone resin examples include a self-curing type resin that is cured by heating without using a curing agent and a curing agent curing type resin that is cured by a curing agent.
- self-curing silicone resin examples include a silicone resin having a hydroxyl group as a reactive functional group and undergoing a dehydration condensation reaction by heating to cure.
- the curing agent-curable silicone resin examples include silicone resins that are cured by the progress of a cross-linking reaction with a hydrocarbon group such as an alkenyl group when a catalyst is added and heated.
- the thermosetting silicone resin is not particularly limited.
- the skeleton of the resin has a structure such as a silicone oligomer, an organosiloxane, a diorganosiloxane, an organopolysiloxane, or a diorganopolysiloxane, and the resin has a structure. Examples thereof include those having a skeleton portion having one or more reactive functional groups.
- organopolysiloxane and diorganopolysiloxane are preferable in that the moisture resistance of the conductive resin layer is increased.
- the skeleton portion of the thermosetting silicone resin may be linear or branched.
- the reactive functional group of the thermosetting silicone resin is not particularly limited, and for example, a hydroxyl group, an alkenyl group, a hydrogensilyl group, a (meth) acryloyl group, an epoxy group, an amino group, a carbinol group, a mercapto group, and the like. Examples include a carboxy group and a phenol group.
- a hydroxy group and an alkenyl group are preferable in terms of moisture resistance, and an epoxy group is preferable in terms of adhesiveness.
- thermosetting silicone resin can have a functional group such as an alkyl group, an alkenyl group, or an aromatic group in the side chain in addition to the reactive functional group.
- a methyl group and a phenyl group are preferable because the moisture resistance of the conductive resin layer is increased.
- the curing agent of the curing agent-curable thermosetting silicone resin is not particularly limited, and for example, a platinum-based curing agent, a titanium-based curing agent, an aluminum-based curing agent, a zinc-based curing agent, an iron-based curing agent, and phosphorus. Acid-based curing agents and the like can be mentioned.
- a known curing agent used for the epoxy resin can be used, for example, an amine-based curing agent such as ethylenediamine, oxalic acid or the like. Examples thereof include acid anhydrides such as organic acids and phthalic anhydrides.
- the molecular weight (weight average molecular weight Mw) of the thermosetting silicone resin is not particularly limited, but is preferably 1000 to 300,000, particularly preferably 2000 to 200,000.
- the conductive resin composition of the present invention may contain a resin binder other than the silicone resin as long as the effects of the present invention are not impaired.
- Resin binders other than silicone resin include epoxy resin, butyral resin, acetal resin, acrylic resin, polybutadiene resin, cellulose resin, (meth) acrylic resin, styrene resin, phenol resin, polyurethane resin, polyamide resin, and polyimide resin. Examples thereof include polyamideimide resin and alkyd resin.
- the content ratio of the epoxy resin to the total resin binder ((epoxy resin / total resin binder (silicone resin + resin other than silicone resin)) ⁇ 100) is It is preferably 25.0% by mass or less, more preferably 20.0% by mass or less, more preferably 10% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass.
- the content ratio of the epoxy resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design of the electronic component can be reduced, and the moldability is improved, so that the manufacturing efficiency can be increased.
- the content ratio of the epoxy resin to the total resin binder in the conductive resin composition of the present invention ((Epoxy resin / total resin binder (silicone resin)). + Resins other than silicone resin))) ⁇ 100) are preferably more than 0.0% by mass and 20.0% by mass or less, more preferably more than 0.0% by mass and 10.0% by mass or less, still more preferably 0. An epoxy resin exceeding 0.0% by mass and 5.0% by mass or less may be contained.
- the content ratio of the epoxy resin to the total resin binder in the conductive resin composition is within the above range, it is possible to improve the adhesion of the conductive resin layer while maintaining high moisture resistance of the conductive resin layer. ..
- the content ratio of the butyral resin to the total resin binder ((butyral resin / total resin binder (silicone resin + resin other than silicone resin)) ⁇ 100) is determined. It is preferably 20.0% by mass or less, more preferably 10.0% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass.
- the content ratio of the butyral resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design and manufacturing of electronic components can be reduced.
- the content of the resin binder increases the conductivity and adhesiveness of the obtained conductive resin layer.
- it is preferably 2.5 to 35.0 parts by mass, more preferably 5.0 to 25.0 parts by mass, based on 100.0 parts by mass of the metal powder, in that it becomes a rheology suitable for the dip method. It is preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass.
- the content of the resin binder (all resin binders (silicone resin + other than silicone resin)). 2. It can also be used in an amount of 5 to 35.0 parts by mass, preferably 5.0 to 25.0 parts by mass, more preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass. .. Further, when the conductive resin composition of the present invention is applied to a laminate for a laminated electronic component to form a conductive resin layer, the content of the resin binder (all resin binders (other than silicone resin + silicone resin)).
- the content of (resin)) is preferably higher than 100.0 parts by mass of the metal powder in that the obtained conductive resin layer has high conductivity and adhesiveness and is a rheology suitable for the dip method. It is 5.0 to 25.0 parts by mass, more preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass.
- the content of the curing agent in the conductive resin composition is appropriately selected depending on the content of the thermosetting resin in the conductive resin composition. However, it is usually 0.01 to 10.0% by mass.
- the organic solvent according to the conductive resin composition of the present invention is not particularly limited, and examples thereof include tertpineol, dihydroterpineol, dihydroterpineol acetate, secondary butyl alcohol, butyl carbitol, butyl carbitol acetate, and benzyl alcohol.
- the conductive resin composition of the present invention may contain additives such as a defoaming agent, a plasticizer, a dispersant, and a rheology adjuster, if necessary, in addition to the above components.
- Plasticizers include dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-2-ethylhexyl phthalate, dinormal octyl phthalate, butyl benzyl phthalate, dioctyl adipate, diisononyl adipate, dibutyl sebacate, sebacic acid.
- Examples thereof include diethyl, dioctyl sebacate, tricresyl phosphate, chlorinated paraffin, cyclohexane 1,2 dicarboxylic acid diisononyl ester (DINCH) and the like.
- the conductive resin composition of the present invention is suitably used for forming a cathode of a solid electrolytic capacitor and for dip printing a laminate for a laminated electronic component.
- the rheology adjuster include silica powder.
- the content of the silica powder in the conductive resin composition of the present invention is preferably 0.0 to 3 with respect to 100 parts by mass of the metal powder. It is 0.0 parts by mass, particularly preferably 0.0 to 2.0 parts by mass.
- the content of the organic solvent is appropriately selected according to the type and content of the metal powder, the type and content of the resin binder, the rheology required for each application, and the like.
- a value of the phase difference ⁇ between the strain and the stress generated by the strain when a strain amount of 1% is applied to the conductive resin composition at an angular frequency of 1 Hz is preferably in a predetermined range.
- the amount of the conductive resin composition in which the ratio of the viscosity at the shear rate of 0.4 (1 / s) to the viscosity at the shear rate of 40 (1 / s) is within a predetermined range is appropriately selected.
- the value of the phase difference ⁇ between the strain and the stress generated by the strain when a strain amount of 1% is applied to the conductive composition of the conductive resin composition of the present invention at an angular frequency of 1 Hz is preferable.
- the above-mentioned value of the phase difference ⁇ is not particularly limited, but the above-mentioned Regarding the lower limit of the value of the phase difference ⁇ of, 45 ° or more is preferable, 47 ° or more is more preferable, 49 ° or more is particularly preferable, 50 ° or more is further preferable, and 51 ° or more is preferable, in terms of high moldability.
- the upper limit of the above-mentioned value of the phase difference ⁇ is preferably 87 ° or less, more preferably 85 ° or less, particularly preferably 83 ° or less, and further preferably 81 ° or less in terms of high moldability. It is preferable, and 80 ° or less is more preferable.
- the upper limit and the lower limit of the phase difference ⁇ can be arbitrarily combined.
- the above-mentioned range of the value of the phase difference ⁇ is preferably in the range of 45 to 87 °, more preferably in the range of 47 to 85 °, and particularly preferably in the range of 49 to 83 ° in that the moldability is improved.
- the range of 51 to 81 ° is more preferable.
- the above-mentioned value of the phase difference ⁇ is not particularly limited.
- the lower limit of the above-mentioned value of the phase difference ⁇ 32 ° or more is preferable, 37 ° or more is more preferable, 45 ° or more is more preferable, 47 ° or more is more preferable, and 49 ° or more is preferable in terms of high moldability.
- the upper limit of the above-mentioned value of the phase difference ⁇ is preferably 87 ° or less, more preferably 85 ° or less, and 83 ° or less in terms of high moldability. Is particularly preferable, 81 ° or less is further preferable, and 80 ° or less is further preferable.
- the upper limit and the lower limit of the phase difference ⁇ can be arbitrarily combined.
- the above-mentioned range of the value of the phase difference ⁇ is preferably in the range of 32 to 87 °, more preferably in the range of 37 to 87 °, and more preferably in the range of 45 to 87 ° in that the moldability is improved.
- the value of the phase difference ⁇ of the conductive resin composition of the present invention is 40 mm in diameter under the conditions of 25 ° C., an angular frequency of 1 Hz, and a strain amount of 1% using a rheometer (manufactured by TA instrument, model number: AR2000). Measured using a parallel plate.
- a rheometer manufactured by TA instrument, model number: AR2000.
- the ratio (mass ratio) of the spherical powder, the flake-like powder, the resin, and the solvent in the conductive resin composition is adjusted. Addition of a rheology modifier may be mentioned.
- the conductive resin composition of the present invention has an angular frequency of 1 Hz in that the moldability is improved when the electrode-formed body for electronic parts is formed with an electrode using the conductive resin composition.
- the lower limit of the ratio of the viscosity at a shear rate of 0.4 (1 / s) to the viscosity at a shear rate of 40 (1 / s) when a strain amount of 1% is added is preferably 1.4 or more, preferably 1.5.
- the above is more preferable, 2.0 or more is more preferable, 2.5 or more is particularly preferable, and the shear rate is 40 (1 / s) when a strain amount of 1% is added to the conductive composition at an angular frequency of 1 Hz.
- the upper limit of the ratio of the viscosity at the shear rate of 0.4 (1 / s) is preferably 60.0 or less, more preferably 30.0 or less, more preferably 20.0 or less, and 15.0 or less. Is particularly preferable.
- the shear rate of the conductive resin composition of the present invention is 0.4 (1) with respect to the viscosity at a shear rate of 40 (1 / s) when a strain amount of 1% is applied to the conductive composition at an angular frequency of 1 Hz.
- the range of the viscosity ratio at / s) is that the moldability is improved when the electrode-formed body for electronic parts is formed with an electrode using the conductive resin composition, and is preferably 1.4 to, for example.
- the range of 60.0 more preferably the range of 1.5 to 60.0, more preferably the range of 1.5 to 30.0, more preferably the range of 2.0 to 20.0, more preferably 2.
- Examples thereof include a range of 5 to 20.0, particularly preferably a range of 2.5 to 15.0, and even more preferably a range of 3.0 to 15.0.
- the above-mentioned viscosity ratio is not particularly limited, but the above-mentioned viscosity Regarding the lower limit of the ratio, 1.5 or more is preferable, 2.0 or more is more preferable, 2.5 or more is particularly preferable, and the upper limit of the above-mentioned viscosity ratio is 20 in terms of increasing moldability. It is preferably 0.0 or less, more preferably 15.0 or less, and particularly preferably 12.0 or less.
- the above-mentioned viscosity ratio range is preferably in the range of 1.5 to 20.0, more preferably in the range of 2.0 to 20.0, and particularly preferably in the range of 2.0 to 20.0 in that the moldability is high.
- the range of 2.5 to 15.0, more preferably the range of 2.5 to 12.0 can be mentioned.
- the above-mentioned viscosity ratio is not particularly limited, but the above-mentioned Regarding the lower limit of the viscosity ratio, 1.5 or more is preferable, 2.0 or more is more preferable, 2.5 or more is particularly preferable, and the above-mentioned upper limit of the viscosity ratio is about the upper limit of the viscosity ratio. , 60.0 or less is preferable, 50.0 or less is more preferable, 35.0 or less is more preferable, 20.0 or less is more preferable, and 15.0 or less is particularly preferable.
- the above-mentioned viscosity ratio range is preferably in the range of 1.5 to 60.0, more preferably in the range of 2.0 to 50.0, and more preferably in the range of high moldability.
- examples thereof include a range of 2.0 to 35.0, more preferably a range of 2.0 to 20.0, and particularly preferably a range of 2.5 to 15.0.
- the viscosity ratio of the conductive resin composition of the present invention is a shear rate of 0.4 (1 / s) and shear at 25 ° C. using a rotational viscometer (manufactured by Brookfield, model number: HADV-II + Pro). By measuring the viscosity under the condition of the velocity 40 (1 / s), the ratio of the viscosity of the shear rate 0.4 (1 / s) to the viscosity of the shear rate 40 (1 / s) is calculated.
- the ratio (mass ratio) of spherical powder, flake-like powder, resin, and solvent in the conductive resin composition is adjusted, and a rheology adjuster is added. To do.
- the moisture permeability of the conductive resin composition of the present invention determined by the following moisture permeability measurement test is 80.0 mg or less, preferably 40.0 mg or less, and more preferably 20.0 mg or less.
- an electronic component having excellent moisture resistance can be obtained when the conductive resin layer is formed using the conductive resin composition of the present invention.
- ⁇ Moisture permeability measurement test> The conductive resin composition was cast on a PET film to a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes. The obtained cured film was cut into a circle with a diameter of 7.5 mm, and a 5 ml glass bottle containing 2 g of silica gel was contained.
- the conductive resin composition of the first embodiment of the present invention described below is used when an electrode-forming body for an electronic component is formed with an electrode using the conductive resin composition.
- the moldability is high, especially when the conductive resin layer is formed on the laminated body for laminated electronic parts by the dip method.
- the conductive resin composition of the first embodiment of the present invention is a conductive resin composition containing a metal powder, a resin binder, and an organic solvent.
- the metal powder is 100.0 parts by mass
- the content of the resin binder is 5.0 to 25.0 parts by mass.
- 80.0% by mass or more is a silicone resin.
- the metal powder 20.0% by mass or more is a flake-shaped metal powder.
- the ratio of the viscosity of the conductive resin composition to the viscosity at a shear rate of 40 (1 / s) at a shear rate of 0.4 (1 / s) is in the range of 1.5 to 20.0. It is a conductive resin composition characterized by.
- resin binder silicone resin, thermosetting silicone resin, curing agent, thermoplastic silicone resin, silicone resin according to the conductive resin composition of the first embodiment of the present invention.
- Resin binders, epoxy resins, butyral resins, organic solvents, and additives used as necessary, such as antifoaming agents, plasticizing agents, dispersants, and rheology adjusters, relate to the above-mentioned conductive resin composition of the present invention.
- the conductive resin composition of the first aspect of the present invention 20.0% by mass or more of the total metal powder is flaky metal powder.
- the content ratio of the flake-shaped metal powder to the entire metal powder is 20.0 to 100.0% by mass, preferably 40.0 to 100.0% by mass, and particularly preferably 60.0 to 100.0% by mass.
- the conductivity and adhesiveness of the obtained conductive resin layer are increased.
- the conductive resin composition of the first aspect of the present invention 80.0% by mass or more of the total resin binder is a silicone resin.
- the content ratio of the silicone resin to the total resin binder is preferably 80.0 to 100.0% by mass, more preferably 90.0 to 100.0% by mass. , Particularly preferably 95.0 to 100.0% by mass.
- the content ratio of the epoxy resin to the total resin binder (((epoxy resin / total resin binder (silicone resin + resin other than silicone resin))).
- ⁇ 100) is preferably 25.0% by mass or less, more preferably 20.0% by mass or less, more preferably 10% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass. Is.
- the content ratio of the epoxy resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design of the electronic component can be reduced, and the moldability is improved, so that the manufacturing efficiency can be increased.
- the content ratio of the epoxy resin to the total resin binder in the conductive resin composition of the first embodiment of the present invention ((epoxy resin / total).
- the resin binder (silicone resin + resin other than silicone resin)) ⁇ 100) is preferably more than 0.0% by mass and 20.0% by mass or less, more preferably more than 0.0% by mass and 10% by mass or less, and further.
- the epoxy resin may be contained in an amount of more than 0.0% by mass and not more than 5.0% by mass.
- the content ratio of butyral resin to the total resin binder ((butyral resin / total resin binder (silicone resin + resin other than silicone resin)) X100) is preferably 20.0% by mass or less, more preferably 10.0% by mass or less, still more preferably 5.0% by mass or less, and particularly preferably 0.0% by mass.
- the content ratio of the butyral resin to the total resin binder in the conductive resin composition is within the above range, the moisture resistance of the conductive resin layer is increased, and the rate of change in the amount of moisture permeation with respect to the change in film thickness is small. Therefore, restrictions on the design and manufacturing of electronic components can be reduced.
- the content of the resin binder is based on 100.0 parts by mass of the metal powder. It is 5.0 to 25.0 parts by mass, preferably 7.0 to 23.0 parts by mass, and particularly preferably 11.0 to 20.0 parts by mass.
- the content of the resin content in the conductive resin composition is within the above range, the conductivity and adhesiveness of the obtained conductive resin layer are increased, and the rheology is suitable for the dip method.
- the conductive resin composition of the first aspect of the present invention contains a thermosetting resin as a silicone resin
- a curing agent can be contained.
- the content of the curing agent in the conductive resin composition depends on the content of the thermosetting resin in the conductive resin composition. , Appropriately selected, but usually 0.01 to 10.0% by mass.
- the conductive resin composition of the first embodiment of the present invention may contain additives such as an antifoaming agent, a plasticizer, a dispersant, and a rheology adjuster, if necessary, in addition to the above components.
- Plasticizers include dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di-2-ethylhexyl phthalate, dinormal octyl phthalate, butyl benzyl phthalate, dioctyl adipate, diisononyl adipate, dibutyl sebacate, sebacic acid.
- the conductive resin composition of the present invention contains silica powder
- the content of the silica powder in the conductive resin composition of the present invention is preferably 0.0 to 3 with respect to 100 parts by mass of the metal powder. It is 0.0 parts by mass, particularly preferably 0.0 to 2.0 parts by mass.
- the value of the phase difference ⁇ between the strain and the stress generated by the strain is 45 to 87 °.
- the range is preferably 47 to 85 °, particularly preferably 49 to 83 °, and even more preferably 51 to 81 °.
- the ratio of the viscosity of the conductive resin composition of the first embodiment of the present invention to the viscosity at a shear rate of 40 (1 / s) at a shear rate of 0.4 (1 / s) is 1.5 to 20.0.
- the range is preferably in the range of 2.0 to 20.0, more preferably in the range of 2.5 to 15.0.
- the conductive resin composition of the present invention (including the conductive resin composition of the first aspect of the present invention) is an electrode-formed body (hereinafter, a cover for electronic parts) on which an electrode is formed in the manufacture of electronic parts. It is also described as an electrode-forming body), and is suitable as a conductive resin composition for forming an electrode.
- the conductive resin composition of the present invention (including the conductive resin composition of the first embodiment of the present invention) is a conductive resin composition for forming an external electrode of a laminate for a laminated electronic component. Is particularly suitable.
- the method for manufacturing an electronic component of the present invention is to manufacture an electronic component in which an electrode is formed on the electronic component by using the conductive resin composition of the present invention (including the conductive resin composition of the first aspect of the present invention). It is a method, and includes a preparatory step of preparing an electrode-formed body for an electronic component and an electrode forming step of forming an electrode on the outer surface of the electrode-formed body for an electronic component. , The conductive resin composition of the present invention is used to form a conductive resin layer on the electrode-formed body for electronic components to form an electrode.
- the method for manufacturing an electronic component of the present invention includes a preparatory step for preparing an electrode-formed body for an electronic component and a preparatory step.
- the metal powder, the resin binder, and the organic solvent are contained, and 20.0% by mass or more of the metal powder is flake-shaped metal powder, and 70.0% by mass of the resin binder.
- a conductive resin composition in which% or more is a silicone resin the conductive resin layer is formed on the electrode-formed body for electronic parts. It is a manufacturing method of an electronic component characterized by.
- the preparation process is a process of preparing an electrode-formed body for electronic components.
- the electrode-formed body for an electronic component refers to an object on which an electrode is formed in a manufacturing process of an electronic component.
- the electrode-formed body for electronic components includes a laminated body for laminated electronic components composed of a plurality of ceramic layers and a plurality of internal electrode layers, and a solid electrolytic capacitor covering composed of an anode and a dielectric layer formed on the surface of the anode. Examples thereof include a cathode forming body and an electrode-bearing body for a chip resistor provided with an end face electrode.
- the laminated body for laminated electronic components is composed of a plurality of ceramic layers and a plurality of internal electrode layers. In the laminated body for laminated electronic components, adjacent ceramic layers are connected to each other by an internal electrode layer interposed between them.
- Examples of the laminated body for laminated electronic components include a laminated body for a laminated ceramic capacitor, a laminated body for a laminated ceramic inductor, and a laminated body for a piezoelectric actuator.
- Examples of the material for forming the ceramic layer constituting the laminate for the laminated electronic component include barium titanate, strontium titanate, calcium titanate, barium zirconate, strontium zirconate, calcium zirconate, calcium strontium titanate and the like. ..
- the material for forming the internal electrode layer constituting the laminated body for laminated electronic parts is any one of nickel, palladium, silver, copper, gold and the like, or an alloy containing one or more of these (for example, with silver). (Alloy with palladium, etc.).
- the cathode-forming body for a solid electrolytic capacitor is composed of an anode and a dielectric layer formed on the surface of the anode.
- Examples of the combination of the body forming the anode and the dielectric layer include tantalum and tantalum pentoxide, aluminum and aluminum oxide, niobium and niobium pentoxide, and the like.
- the electrode forming step is a step of forming an electrode on the outer surface of the electrode-formed body for electronic parts.
- forming the conductive resin layer on the electrode-forming body for electronic parts means forming the conductive resin layer directly on the surface of the electrode-forming body for electronic parts, and forming the conductive resin layer directly on the surface of the electrode-forming body for electronic parts. This includes both cases where another layer or film (for example, a metal layer, a conductor layer) or the like is first formed on the electrode forming body, and a conductive resin layer is formed on the surface thereof.
- the conductive resin layer is formed with another layer or film (for example, a metal layer, a conductor layer) or the like interposed therebetween.
- the position and method of forming the electrode, the thickness of the electrode, the number of electrodes, the type of metal constituting the electrode, the shape of the metal powder used for forming the electrode, etc. are appropriately selected depending on the electronic component to be manufactured. NS.
- the conductive resin composition of the present invention is used to form a conductive resin layer on the electrode-formed body for electronic parts.
- the conductive resin composition of the present invention is applied to the electrode-formed body for electronic parts, so that the conductive resin composition of the present invention is placed at a predetermined position on the electrode-formed body for electronic parts. Then, the conductive resin composition of the present invention is cured to form a conductive resin layer.
- the conductive resin composition of the present invention is directly applied to the surface of the electrode-formed body for electronic parts, so that the conductive resin layer is directly applied to the surface of the electrode-formed body for electronic parts. Can be formed. Further, in the electrode forming step, an appropriate step can be provided depending on the type of the electronic component before forming the conductive resin layer on the electrode-formed body for the electronic component. For example, in the case of a laminated electronic component, in the electrode forming step, after forming a metal layer at a predetermined position of the electrode-formed body for the electronic component, the conductive resin composition of the present invention is applied to the surface of the metal layer.
- a layer of the conductive resin composition of the present invention is formed at a predetermined position on the electrode-formed body for electronic parts, and then the conductive resin composition of the present invention is cured to obtain a metal.
- a conductive resin layer is formed on the surface of the layer.
- a conductive layer made of a carbon layer is formed at a predetermined position on the cathode-formed body for a solid electrolytic capacitor, and then the conductivity of the present invention is formed on the surface of the conductive layer.
- the conductive resin composition layer of the present invention is formed at a predetermined position on the electrode-formed body for electronic parts, and then the conductive resin composition of the present invention is cured. By doing so, a conductive resin layer is formed on the surface of the conductive layer.
- an appropriate step can be provided depending on the type of the electronic component. For example, in the case of a laminated electronic component, in the electrode forming step, a conductive resin layer is formed at a predetermined position of the electrode-formed body for the electronic component, and then a plating layer is formed on the surface of the conductive resin layer.
- an electrode can be formed by forming a conductive resin layer on the electrode-formed body for electronic parts. That is, in this form, the electrode is composed of only the conductive resin layer.
- the electrode-forming body for electronic parts is subjected to the present by the dip method.
- the conductive resin composition of the present invention can be applied to form a layer of the conductive resin composition of the present invention at a predetermined position on the electrode-formed body for electronic parts. Since the conductive resin composition of the present invention is excellent in moldability, the conductive resin composition layer of the present invention can be quickly formed at a predetermined position by a dip method. Therefore, according to the conductive resin composition of the present invention, the production efficiency can be increased by applying the conductive resin composition of the present invention to the electrode-formed body for electronic components by the dip method.
- the electrode-formed body for electronic parts is a laminated body for laminated electronic parts composed of a ceramic layer and an internal electrode layer.
- the electrode forming step (1) is a conductive resin layer forming step (1) in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the laminate for laminated electronic components.
- the electrode forming step (1) there is a conductive resin layer forming step (1) in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the laminate for laminated electronic parts.
- the present invention is not particularly limited, and examples thereof include an electrode forming step (1A) including a metal layer forming step, a conductive resin layer forming step (1A), and a plating layer forming step.
- the metal layer forming step is a step of forming a metal layer electrically connected to the internal electrode layer on the outer surface of the laminated body for laminated electronic components.
- the metal forming the metal layer include at least one of Cu, Ag, Pd, Ni, Sn, Al, Au and Pt, or an alloy containing one or more of these.
- the method for forming the metal layer is not particularly limited, and examples thereof include a dip method, a plating method, a roll coating method, a screen printing method, and a sputtering method. The thickness, shape, position, number, etc. of the metal layer are appropriately selected.
- the conductive resin layer forming step (1A) is a step of forming a conductive resin layer on the surface of the metal layer formed by performing the metal layer forming step by using the conductive resin composition of the present invention.
- the conductive resin composition of the present invention is applied to the surface of the metal layer formed by performing the metal layer forming step, whereby the present invention is applied to the surface of the metal layer.
- a layer of the conductive resin composition is formed, and then the conductive resin composition of the present invention is cured to form a conductive resin layer.
- the method for forming the conductive resin composition layer of the present invention is not particularly limited, and examples thereof include a dip method, a screen printing method, and a roll coating method. Of these, the dip method is preferable.
- the thickness, shape, position, number, and the like of the conductive resin composition layer of the present invention are appropriately selected.
- the plating layer forming step is a step of forming a plating layer on the surface of the conductive resin layer.
- the metal forming the plating layer include alloys containing at least one of Ni, Cu, Sn, Ag and Au, or one or more of these.
- the method for forming the plating layer is not particularly limited, and examples thereof include electrolytic plating and electroless plating. The thickness, shape, position, number, etc. of the plating layer are appropriately selected.
- the second form of the electrode forming step (hereinafter, also referred to as an electrode forming step (2)) is an electrode forming step when the electrode-formed body for electronic components is a cathode-forming body for a solid electrolytic capacitor. .. Then, the electrode forming step (2) is a conductive resin layer forming step (2) in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the cathode forming body for a solid electrolytic capacitor. At least. As the electrode forming step (2), a conductive resin layer forming step (2) is performed in which the conductive resin composition of the present invention is used to form a conductive resin layer on the outer surface of the cathode forming body for a solid electrolytic capacitor. If it has, it is not particularly limited, and for example, an electrode forming step (2) including at least a solid electrolyte layer forming step, a carbon layer forming step, and a conductive resin layer forming step (2A). A) can be mentioned.
- the solid electrolyte layer forming step is a step of forming a solid electrolyte layer on the outer surface of the cathode forming body for a solid electrolytic capacitor.
- the method for forming the solid electrolyte layer is not particularly limited and can be formed by a known solid electrolyte produced by a chemical method.
- the solid electrolyte includes, for example, a conductive polymer such as polypyrrole, polyaniline, polythiophene, or polyacetylene. Can be mentioned.
- the carbon layer forming step is a step of forming a carbon layer on the solid electrolyte layer.
- the method for forming the carbon layer is not particularly limited, and for example, a method in which a carbon paste containing a resin, a solvent, and carbon powder is applied onto the solid electrolyte layer by a dip method, and then dried and / or cured. Can be mentioned.
- the carbon powder is not particularly limited, but graphite powder is preferable.
- the conductive resin layer forming step (2A) is a step of forming a conductive resin layer on a carbon layer using a conductive resin composition containing a silicone resin.
- the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by a dip method, a screen printing method, a roll coating method, or the like, and then a silicone resin is applied. Examples thereof include a method of curing the contained conductive resin composition.
- the electrode forming step (3) includes at least a step of forming a conductive resin layer on the end face electrode.
- the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by a dip method, a screen printing method, a roll coating method, or the like, and then a silicone resin is applied. Examples thereof include a method of curing the contained conductive resin composition.
- the electrode-formed body for a chip resistor including the end face electrode is, for example, an insulating substrate, a pair of top electrodes formed on the insulating substrate, a resistor formed between the pair of top electrodes, and a pair of top electrodes.
- a protective layer formed so as to cover a part of the resistor and an end face electrode formed on the end face of the insulating substrate are provided.
- the electrode forming step (4) includes at least a step of forming a conductive resin layer on the substrate.
- the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by screen printing, inkjet printing, or dispenser printing, and then the silicone resin is contained. Examples thereof include a method of curing the conductive composition.
- the substrate include an alumina substrate, a glass epoxy substrate, a paper phenol substrate, and a paper epoxy substrate.
- the electrode forming step (5) includes at least a step of forming a conductive resin layer on the film.
- the method for forming the conductive resin layer is not particularly limited, and for example, a conductive resin composition containing a silicone resin is applied by screen printing, inkjet printing, or dispenser printing, and then the silicone resin is contained. Examples thereof include a method of curing the conductive composition.
- the film include a polyimide film and a PET film.
- the specific resistance of the conductive resin layer obtained by using the conductive resin composition of the present invention is preferably 1000 ⁇ ⁇ cm or less, more preferably 500 ⁇ ⁇ cm or less, and particularly preferably 200 ⁇ ⁇ cm or less.
- the elongation rate of the conductive resin layer obtained by using the conductive resin composition of the present invention is preferably 0.2% or more, particularly preferably 0.3% or more. Since the conductive resin layer having the elongation rate in the above range is formed between the metal layer and the plating layer of the external electrode of the laminated electronic component, cracks and interfacial peeling occur at the connection portion between the substrate and the electronic component. Since it is difficult and cracks are unlikely to occur in the electronic component itself, the impact resistance of the electronic component is improved. Therefore, the impact resistance of the electronic component can be enhanced by forming the conductive resin composition of the present invention between the metal layer and the plating layer of the external electrode of the laminated electronic component.
- the elongation of the conductive resin layer is such that the cured film obtained by casting the conductive resin composition on a PET film with a thickness of 250 ⁇ m and curing it at 200 ° C. for 60 minutes is cut into a rectangle having a width of 5 mm.
- a viscoelasticity measuring device manufactured by Hitachi High-Tech Science Co., Ltd., model number: DMA-7100 is used to measure the coating film length when a tensile load of 9.8 N is applied in the long axis direction of the cured film, and a load is applied. It is calculated as the ratio of the length extended when a load is applied to the previous length of 10 mm.
- the adhesion strength of the conductive resin layer obtained by using the conductive resin composition of the present invention is preferably 0.2 MPa or more, more preferably 0.3 MPa or more, and particularly preferably 0.4 MPa or more.
- the adhesion strength of the conductive resin layer is within the above range, the impact resistance of the electronic component can be increased.
- the conductive resin composition is cast on a slide glass substrate with a thickness of 50 ⁇ m, an aluminum cylinder having a diameter of 3 mm is placed on the slide glass substrate, and the conductive resin layer is cured at 200 ° C. for 60 minutes. It is measured by pulling in the vertical direction at a speed of 0.5 mm / s using a Seishin Shoji Co., Ltd. model number: SS-30WD) and measuring the value at the time of breakage.
- the conductive resin composition of the present invention uses a silicone resin as all or part of the resin binder, the conductivity obtained is higher than that of the conductive resin composition using an epoxy resin as the main component of the resin binder.
- the moisture resistance of the resin layer is increased, and the heat resistance of the obtained conductive resin layer is increased as compared with the conductive resin composition containing a large amount of butyral resin as a resin binder.
- the conductive resin composition of the present invention a silicone resin is used as the resin binder and a predetermined amount of the silicone resin is contained, so that the obtained conductive resin layer requires stress relaxation and the like. Easy to meet. Therefore, according to the conductive resin composition of the present invention, it is possible to obtain a conductive resin layer having higher heat resistance as a resin binder than the conductive resin composition containing an epoxy resin as a main component and butyral. ..
- the conductive resin layer obtained by using the conductive resin composition of the present invention is compared with the conductive resin layer obtained from the conductive resin composition containing an epoxy resin as a main component of the resin binder and containing butyral. , The rate of change in the amount of moisture permeation with respect to the change in film thickness is small.
- the film thickness of the conductive resin layer to be formed on the object to be formed of the conductive resin layer varies depending on the type of electronic component. Then, as the film thickness becomes thinner, the amount of moisture permeation increases, so it is necessary to cover the increase in the amount of moisture permeation by increasing the ratio of the resin in the conductive resin layer. Then, as the rate of change in the amount of moisture permeation increases with respect to the change in film thickness, the amount of increase in the amount of moisture permeation does not increase significantly, so that many measures are required to cover the increase in the amount of moisture permeation.
- the silver powders 1 and 2 shown in Table 1 were prepared based on the spray pyrolysis method described in Tokushu Sho 63-31522. That is, for silver powder 1, an aqueous solution in which a silver salt was dissolved was spray-pyrolyzed, and the collected silver powder was classified to adjust the value of D 50. For the obtained silver powder, a 50% value (D 50 ) in a volume-based integrated fraction was determined using a laser diffraction type particle size distribution measuring device. In addition, the specific surface area was measured by the BET method.
- Spherical silver powder was produced by the method described above, and the obtained spherical silver powder was pulverized with a ball mill using stearic acid as a lubricant to produce flake-shaped silver powder.
- the particle size and aspect ratio of 50 silver powders arbitrarily selected in the SEM (scanning electron microscope) image observation were measured, and the average value was obtained.
- the specific surface area was measured by the BET method.
- a silver-coated copper powder coated with silver so as to have a ratio of 10 parts by mass to 90 parts by mass was produced, and the obtained silver-coated copper powder was used.
- a flake-shaped silver-coated copper powder was produced by pulverizing with a ball mill using palmitic acid as a lubricant.
- the specific surface area was measured by the BET method.
- a conductive resin composition was prepared by blending a metal powder, a silicone resin, and an epoxy resin in the blending ratios shown in Tables 1 and 2.
- Examples 1 to 8 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
- the obtained resin liquid, metal powder 1, and metal powder 2 were mixed at the ratios shown in Table 1 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to obtain a paste-like composition. ..
- the obtained paste-like composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s, and then the following evaluation was performed. The results are shown in Table 1.
- Examples 9 to 13, Comparative Examples 1 to 4 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
- the obtained resin liquid, metal powder 3, and epoxy resin 1 were mixed at the ratios shown in Table 2 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to obtain a paste-like composition. ..
- the obtained paste-like composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s, and then the following evaluation was performed. The results are shown in Table 2.
- Viscosity ratio The viscosity of the conductive resin composition was measured at 25 ° C. using a rotational viscometer (manufactured by Brookfield, model number: HADV-II + Pro) at a shear rate of 0.4 (1 / s) and a shear rate of 40 (1 / s). ) was measured. The ratio of the viscosity of the shear rate of 0.4 (1 / s) to the viscosity of the shear rate of 40 (1 / s) was calculated as the viscosity ratio.
- Phase difference ⁇ Measured using a rheometer (manufactured by TA instrument, model number: AR2000) at 25 ° C., an angular frequency of 1 Hz, and a strain amount of 1% using a parallel plate having a diameter of 40 mm. The value of the phase difference ⁇ was obtained.
- the conductive resin composition was cast on a PET film at a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes to obtain a cured film.
- the obtained cured film was cut into a circle having a diameter of 7.5 mm, and fixed with an adhesive so as to cover a 5 ml glass bottle containing 2 g of silica gel. Then, the glass bottle was placed in a 750 ml container containing 100 ml of purified water so that the cured film did not come into contact with the purified water, and the bottle was placed in a dryer set at 65 ° C. and allowed to stand for 15 hours.
- the weight of the glass bottle before and after putting it in the dryer was measured, and the weight increase was taken as the amount of moisture permeation. If the moisture permeation amount exceeds 160 mg, "Score: 1, Fail, Unusable, Moisture resistance is extremely low", and if it exceeds 80.0 mg and 160 mg or less, "Score: 2, Fail, Unusable, Moisture resistance""Lowproperty", more than 40.0 mg and 80.0 mg or less "Score 3: Pass, usable”, and more than 20.0 mg and 40.0 mg or less "Score 4: Pass, usable, moisture resistance""High” and 20.0 mg or less were rated as "Score 5: Passed, usable, extremely high moisture resistance”.
- the conductive resin composition was cast on a PET film at a thickness of 250 ⁇ m and cured at 200 ° C. for 60 minutes to obtain a cured film.
- the obtained cured film is cut into a rectangle with a width of 5 mm, and a coating film when a tensile load of 9.8 N is applied in the long axis direction using a viscoelasticity measuring device (manufactured by Hitachi High-Tech Science Co., Ltd., model number: DMA-7100). The length was measured. The ratio of the length stretched when the load was applied to the length 10 mm before the load was calculated was calculated and used as the elongation rate.
- the conductive resin composition was cast on a slide glass substrate at a width of 1 cm, a length of 5 cm, and a thickness of 50 ⁇ m, and cured at 200 ° C. for 60 minutes to obtain a cured film.
- the resistivity of the surface of the cured film was measured by the 4-terminal method using a digital multimeter (Keithley Instruments, KEITHLEY 2002), and the specific resistance was calculated from the obtained value and the sample thickness.
- the conductive resin composition was cast on a slide glass substrate to a thickness of 50 ⁇ m, an aluminum cylinder having a diameter of 3 mm was placed on the slide glass substrate, and the mixture was cured at 200 ° C. for 60 minutes.
- a bond tester manufactured by Seishin Shoji Co., Ltd., model number: SS-30WD was used to pull in the vertical direction at a speed of 0.5 mm / s, and the value at the time of breakage was measured.
- Silicone resin content ratio Content ratio of silicone resin to total resin content in the conductive resin composition containing silicone resin (%) ((Silicone resin / total resin content (silicone resin + resin other than silicone resin)) ⁇ 100)
- Example 14 A paste-like composition was obtained in the same manner as in Example 4. The obtained paste-like composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s. Next, the moisture permeability was evaluated in the same manner as above, except that the thickness of the conductive resin composition when cast on the PET film was adjusted and the film thickness of the cured film was as shown in Table 3. .. The results are shown in Table 3 and FIG.
- Examples 15 to 26 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
- the obtained resin liquid, metal powder 1, metal powder 2, silica powder 1, and benzyl alcohol are mixed at the ratios shown in Tables 5 and 6, and then used on a three-roll mill (manufactured by Inoue Seisakusho). The mixture was kneaded to obtain a paste-like composition.
- the obtained composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 4 Pa ⁇ s, and then the above evaluation was performed. The results are shown in Tables 5 and 6.
- Examples 27 to 31 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
- the obtained resin liquid, metal powder 1, and metal powder 2 were mixed at the ratios shown in Table 7 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to obtain a paste-like composition. ..
- the obtained composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 40 Pa ⁇ s, and then the above evaluation was performed. The results are shown in Table 7.
- Examples 32 to 34, Comparative Example 6 135 parts by mass of silicone resin 1 as a resin solid content and 165 parts by mass of benzyl alcohol (manufactured by Gordo Co., Ltd.) were mixed, and solvent substitution was carried out under the conditions of 130 ° C., 30 Pa, and 1 hour to obtain a resin solution.
- the obtained resin liquid, metal powder 1, metal powder 2, and epoxy resin 1 are mixed at the ratios shown in Table 2 and then kneaded using a three-roll mill (manufactured by Inoue Seisakusho) to form a paste.
- the composition was obtained.
- the obtained composition was diluted with benzyl alcohol and adjusted so that the viscosity at 25 ° C. and a shear rate of 4 (1 / s) was 30 Pa ⁇ s, and then the above evaluation was performed.
- Table 8 The results are shown in Table 8.
- Electrode-formed body there are a plurality of dielectric layers containing barium titanate and internal electrode layers containing nickel, which are substantially rectangular parallelepiped as shown in FIG. 1 having a length of 3.2 mm, a width of 2.5 mm, and a height of 2.5 mm.
- a laminated body was prepared.
- a conductive resin composition containing copper powder was applied to both end faces of the laminate in the vertical direction by a dip method, and then held in an air atmosphere at 150 ° C. for 10 minutes.
- the temperature was raised at a heating rate of 50 ° C./min until the temperature reached 780 ° C., and after reaching 780 ° C., the temperature was maintained for 15 minutes to form copper terminals.
- the conductive resin composition shown in Table 4 or Table 8 is applied to the copper terminals formed on both end faces of the laminate by the dip method with the vertical direction in the vertical direction, and the conductive resin composition shown in Table 4 or Table 8 is applied under the conditions of an air atmosphere and 200 ° C.
- the applied conductive resin composition was cured by holding for 60 minutes to form a conductive resin layer on the above-mentioned copper terminals.
- a laminated ceramic capacitor was produced as a laminated electronic component.
- the length of the portion where the distance from the boundary between the plating layer and the conductive resin layer to the boundary between the conductive resin layer and the base layer (copper terminal) is the shortest is defined as the end face corner thickness. Further, in the end face portion of the laminate, the portion where the distance from the boundary between the conductive resin layer and the plating layer to the boundary between the conductive resin layer and the base layer (copper terminal) when a perpendicular line is drawn from the boundary between the conductive resin layer and the plating layer toward the laminate is the longest. The length of was taken as the end face thickness.
- An end face corner thickness of less than 2.5 ⁇ m and / or an end face thickness of more than 300 ⁇ m is “score: 1, rejected, unusable, inferior in manufacturability”, end face corner thickness of 5.0 ⁇ m or more, and end face thickness. 200 ⁇ m or less was evaluated as “Score: 3, Pass, Usable, Excellent Manufacturability”, and others were evaluated as “Score: 2, Pass, Usable, Good Manufacturability”.
- the shape of the sex resin layer is shown in Table 4 or Table 8.
- the electrode-formed body is a cover composed of a substantially rectangular parallelepiped anode made of tantalum having a length of 0.5 mm, a width of 3.7 mm, and a height of 5.4 mm, and a dielectric layer made of tantalum pentoxide formed on the surface of the anode.
- a cathode forming body was prepared. After forming a solid electrolyte layer on the solid electrolyte layer and forming a carbon layer on the solid electrolyte layer, the conductive resin shown in Table 5 or Table 6 is formed by a dip method with the height direction in the vertical direction.
- the composition was applied onto the carbon layer and held in an air atmosphere at 170 ° C. for 60 minutes to cure the applied conductive resin composition to form a conductive resin layer. After that, it was connected to a terminal and a resin outer layer was formed by a resin molding method to prepare a tantalum capacitor as a solid electrolytic capacitor.
- a resin molding method to prepare a tantalum capacitor as a solid electrolytic capacitor.
- the horizontal cross section of the solid electrolytic capacitor is observed by SEM, and the thickness of the conductive resin layer at the corners on the side surface of the cathode-forming body (side corner thickness) and the thickness of the conductive resin layer on the side surface of the cathode-forming body. (Side thickness) was measured.
- the length of the portion where the distance from the boundary between the resin outer layer and the conductive resin layer to the boundary between the conductive resin layer and the base layer (cathode formed body) is the shortest is defined as the side corner thickness. .. Further, in the side surface portion of the cathode-formed body, the length of the portion where the distance from the boundary between the resin outer layer and the conductive resin layer to the boundary between the conductive resin layer and the base layer (cathode-forming body) is the longest is defined as the side surface thickness. bottom.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
該電子部品用被電極形成体の外表面上に、電極を形成させる電極形成工程と、
を有し、
該電極形成工程において、金属粉末と、樹脂バインダーと、有機溶媒と、を含有し、該金属粉末のうち20.0質量%以上がフレーク状金属粉末であり、該樹脂バインダーのうち70.0質量%以上がシリコーン樹脂である導電性樹脂組成物を用いて、該電子部品用被電極形成体に導電性樹脂層を形成させること、
を特徴とする電子部品の製造方法を提供するものである。
該金属粉末のうち20.0質量%以上がフレーク状金属粉末であり、
該樹脂バインダーのうち70.0質量%以上がシリコーン樹脂であること、
を特徴とする導電性樹脂組成物を提供するものである。
<透湿量測定試験>
導電性樹脂組成物をPETフィルム上に厚さ250μmでキャスティングし、200℃、60分の条件で硬化させ、得られた硬化膜を直径7.5mmの円形に切り出し、シリカゲル2gが入った5mlガラス瓶に蓋をするように接着剤で固定し、精製水を100ml入れた750ml容器内に前記硬化膜が精製水に接触しないように該ガラス瓶を入れ密閉した状態で、65℃に設定した乾燥機に入れて15時間静置し、次いで、下記式(1):
透湿量(重量増加量)=乾燥機に入れた後のガラス瓶の重量-乾燥機に入れる前のガラス瓶の重量 (1)
により、透湿量を算出する。
前記金属粉末を100.0質量部としたときの前記樹脂バインダーの含有量が5.0~25.0質量部であり、
前記樹脂バインダーのうち80.0質量%以上がシリコーン樹脂であり、
前記金属粉末のうち20.0質量%以上が、フレーク状の金属粉末であり、
前記導電性樹脂組成物に角周波数1Hzでひずみ量1%を加えたときの、該ひずみと該ひずみで生じた応力との位相差δの値が45~87°の範囲にあり、
前記導電性樹脂組成物の、せん断速度40(1/s)における粘度に対するせん断速度0.4(1/s)における粘度の比が1.5~20.0の範囲にあること、
を特徴とする(3)の導電性樹脂組成物を提供するものである。
該金属粉末のうち20.0質量%以上がフレーク状金属粉末であり、
該樹脂バインダーのうち70.0質量%以上がシリコーン樹脂であること、
を特徴とする導電性樹脂組成物である。
<透湿量測定試験>
導電性樹脂組成物をPETフィルム上に厚さ250μmでキャスティングし、200℃、60分の条件で硬化させ、得られた硬化膜を直径7.5mmの円形に切り出し、シリカゲル2gが入った5mlガラス瓶に蓋をするように接着剤で固定し、精製水を100ml入れた750ml容器内に前記硬化膜が精製水に接触しないように該ガラス瓶を入れ密閉した状態で、65℃に設定した乾燥機に入れて15時間静置し、次いで、下記式(1):
透湿量(重量増加量)=乾燥機に入れた後のガラス瓶の重量-乾燥機に入れる前のガラス瓶の重量 (1)
により、透湿量を算出する。
前記金属粉末を100.0質量部としたときの前記樹脂バインダーの含有量が5.0~25.0質量部であり、
前記樹脂バインダーのうち80.0質量%以上がシリコーン樹脂であり、
前記金属粉末のうち20.0質量%以上が、フレーク状の金属粉末であり、
前記導電性樹脂組成物に角周波数1Hzでひずみ量1%を加えたときの、該ひずみと該ひずみで生じた応力との位相差δの値が45~87°の範囲にあり、
前記導電性樹脂組成物の、せん断速度40(1/s)における粘度に対するせん断速度0.4(1/s)における粘度の比が1.5~20.0の範囲にあること、
を特徴とする導電性樹脂組成物である。
該電子部品用被電極形成体の外表面上に、電極を形成させる電極形成工程と、
を有し、
該電極形成工程において、金属粉末と、樹脂バインダーと、有機溶媒と、を含有し、該金属粉末のうち20.0質量%以上がフレーク状金属粉末であり、該樹脂バインダーのうち70.0質量%以上がシリコーン樹脂である導電性樹脂組成物を用いて、該電子部品用被電極形成体に導電性樹脂層を形成させること、
を特徴とする電子部品の製造方法である。
A)が挙げられる。
先ず、特公昭63-31522号に記載されている噴霧熱分解法に基づいて、表1に記載された銀粉末1及び2を準備した。すなわち、銀粉末1については、銀塩を溶解させた水溶液を噴霧熱分解し、捕集した銀粉末を分級処理して、D50の値を調節した。
なお、得られた銀粉末について、レーザー回折式粒度分布測定装置を用いて、体積基準の積算分率における50%値(D50)を求めた。また、BET法により比表面積を測定した。
前述の方法で球状銀粉を製造し、得られた球状の銀粉を、滑剤としてステアリン酸を用いてボールミルで粉砕してフレーク状銀粉を製造した。SEM(走査電子顕微鏡)像観察において任意に選んだ50個の銀粉末の粒子径及びアスペクト比を測定し、その平均値を求めた。また、BET法により比表面積を測定した。
球状の銅粉(三井金属製、型番:MA-CO3K)90質量部に対して10質量部の比率となるように銀で被覆した銀コート銅粉を製造し、得られた銀コート銅粉を、滑剤としてパルミチン酸を用いてボールミルで粉砕してフレーク状銀コート銅粉を製造した。SEM像観察において任意に選んだ50個の銀粉末の粒子径及びアスペクト比を測定し、その平均値を求めた。また、BET法により比表面積を測定した。
表1及び表2に示す配合割合で、金属粉、シリコーン樹脂、エポキシ樹脂を配合し、導電性樹脂組成物を調製した。
・金属粉1
球状銀粉、D50:2.3μm、比表面積:0.5m2/g
・金属粉2
フレーク状銀粉、アスペクト比:30、数平均粒子径:6.0μm、比表面積:1.0m2/g
・金属粉3
フレーク状銀コート銅粉、アスペクト比:20、D50:8.0μm、比表面積:1.5m2/g
・シリコーン樹脂1
熱硬化性シリコーン樹脂、自己硬化型、信越化学工業株式会社社製、型番:ES-1001N、反応性官能基:水酸基、エポキシ基
・エポキシ樹脂1
熱硬化性エポキシ樹脂、DIC社製、型番:EXA4816
・ブチラール樹脂1
ブチラール樹脂、積水化学工業社製、型番:KS-10
・シリカ粉末1
ヒュームドシリカ、トクヤマ社製、型番:HM-20L
なお、以下表中の樹脂の量は、溶剤を除く樹脂自体の量を指す。
シリコーン樹脂1を樹脂固形分として135質量部とベンジルアルコール(ゴードー社製)を165質量部混合し、130℃、30Pa、1時間の条件で、溶剤置換を行い、樹脂液を得た。得られた樹脂液と、金属粉1と、金属粉2とを、表1に記載の比率で混合後、三本ロールミル(井上製作所製)用いて混錬し、ペースト状の組成物を得た。
得られたペースト状の組成物をベンジルアルコール希釈し、25℃、せん断速度4(1/s)における粘度が30Pa・sとなるよう調整した上で、以下の評価を行った。その結果を表1に示す。
シリコーン樹脂1を樹脂固形分として135質量部とベンジルアルコール(ゴードー社製)を165質量部混合し、130℃、30Pa、1時間の条件で、溶剤置換を行い、樹脂液を得た。得られた樹脂液と、金属粉3と、エポキシ樹脂1とを、表2に記載の比率で混合後、三本ロールミル(井上製作所製)用いて混錬し、ペースト状の組成物を得た。
得られたペースト状の組成物をベンジルアルコール希釈し、25℃、せん断速度4(1/s)における粘度が30Pa・sとなるよう調整した上で、以下の評価を行った。その結果を表2に示す。
(粘度比)
導電性樹脂組成物の粘度を、回転粘度計(ブルックフィールド社製、型番:HADV-II+Pro)を用いて、25℃において、せん断速度0.4(1/s)およびせん断速度40(1/s)の条件で測定した。せん断速度40(1/s)の粘度に対するせん断速度0.4(1/s)の粘度の比を粘度比として算出した。
レオメーター(TA instrument社製、型番:AR2000)を用いて、25℃、角周波数1Hz、ひずみ量1%の条件で、直径40mmのパラレルプレートを使用して測定し、導電性樹脂組成物の位相差δの値を得た。
導電性樹脂組成物をPETフィルム上に厚さ250μmでキャスティングし、200℃、60分の条件で硬化させて硬化膜を得た。得られた硬化膜を直径7.5mmの円形に切り出し、シリカゲル2gが入った5mlガラス瓶に蓋をするように接着剤で固定した。その後、精製水を100ml入れた750ml容器内に前記硬化膜が精製水に接触しないように上記ガラス瓶を入れ密閉した状態で、65℃に設定した乾燥機に入れて15時間静置した。乾燥機に入れる前と入れた後のガラス瓶の重量を測定し、重量増加分を透湿量とした。透湿量が、160mgを超えるものを「評点:1、不合格、使用不可、耐湿性が極めて低い」、80.0mgを超え160mg以下のものを「評点:2、不合格、使用不可、耐湿性が低い」、40.0mgを超え80.0mg以下のものを「評点3:合格、使用可」、20.0mgを超え40.0mg以下のものを「評点4:合格、使用可、耐湿性が高い」、20.0mg以下のものを「評点5:合格、使用可、耐湿性が極めて高い」とした。
導電性樹脂組成物をPETフィルム上に厚さ250μmでキャスティングし、200℃、60分の条件で硬化させて硬化膜を得た。得られた硬化膜を幅5mmの長方形に切り出し、粘弾性測定装置(日立ハイテクサイエンス社製、型番:DMA-7100)を用いて長軸方向に9.8Nの引張り荷重をかけたときの塗膜長さを測定した。加重をかける前の長さ10mmに対する、荷重をかけたときに伸張した長さの比率を算出し、伸び率とした。
導電性樹脂組成物をスライドガラス基板上に幅1cm、長さ5cm、厚さ50μmでキャスティングし、200℃、60分の条件で硬化させて硬化膜を得た。デジタルマルチメータ(Keithley Instruments社製、KEITHLEY2002)を用いて4端子法により硬化膜表面の抵抗を測定し、得られた値と試料厚さから比抵抗を算出した。
導電性樹脂組成物をスライドガラス基板上に厚さ50μmでキャスティングし、直径3mmのアルミシリンダーをのせて、200℃、60分の条件で硬化させた。ボンドテスター(西進商事社製、型番:SS-30WD)を用いて0.5mm/sの速さで垂直方向に引張り、破断したときの値を計測した。
また、表2の結果より、実施例9~13は、透湿量が少ない導電性樹脂層が得られており、且つ、導電性樹脂層に求められる密着強度を有しているので、シリコーン樹脂を含有する導電性樹脂組成物を用いることにより、エポキシ樹脂を樹脂分として33.3質量%以上含有する導電性樹脂組成物を用いる場合に比べ、高い耐湿性を有する電子部品を製造することが可能であることがわかった。
実施例4と同様の方法でペースト状の組成物を得た。得られたペースト状の組成物をベンジルアルコール希釈し、25℃、せん断速度4(1/s)における粘度が30Pa・sとなるよう調整した。
次いで、導電性樹脂組成物をPETフィルム上にキャスティングする際の厚さを調節し、硬化膜の膜厚を表3に示す通りとしたこと以外は、上記と同様に透湿性の評価を行った。その結果を表3及び図3に示す。
金属粉1と、金属粉2と、エポキシ樹脂1と、ブチラール樹脂1と、ベンジルアルコールと、三フッ化ホウ素モノエチルアミン(ステラケミファ株式会社製)とを、40:60:9:9:31:0.4の比率(質量比)で混合後(エポキシ樹脂とブチラール樹脂は樹脂固形分としての比率)、三本ロールミル(井上製作所製)を用いて混錬し、ペースト状の組成物を得た。得られたペースト状の組成物をベンジルアルコール希釈し、25℃、せん断速度4(1/s)における粘度が30Pa・sとなるよう調整した。
次いで、膜厚を表3に示す通りとすること以外は、上記と同様に透湿性の評価を行った。その結果を表3及び図3に示す。
シリコーン樹脂1を樹脂固形分として135質量部とベンジルアルコール(ゴードー社製)を165質量部混合し、130℃、30Pa、1時間の条件で、溶剤置換を行い、樹脂液を得た。得られた樹脂液と、金属粉1と、金属粉2と、シリカ粉末1と、ベンジルアルコールとを、表5及び表6に記載の比率で混合後、三本ロールミル(井上製作所製)用いて混錬し、ペースト状の組成物を得た。
得られた組成物をベンジルアルコールで希釈し、25℃、せん断速度4(1/s)における粘度が4Pa・sとなるよう調整した上で、上記評価を行った。その結果を表5及び表6に示す。
シリコーン樹脂1を樹脂固形分として135質量部とベンジルアルコール(ゴードー社製)を165質量部混合し、130℃、30Pa、1時間の条件で、溶剤置換を行い、樹脂液を得た。得られた樹脂液と、金属粉1と、金属粉2とを、表7に記載の比率で混合後、三本ロールミル(井上製作所製)用いて混錬し、ペースト状の組成物を得た。
得られた組成物をベンジルアルコールで希釈し、25℃、せん断速度4(1/s)における粘度が40Pa・sとなるよう調整した上で、上記評価を行った。その結果を表7に示す。
シリコーン樹脂1を樹脂固形分として135質量部とベンジルアルコール(ゴードー社製)を165質量部混合し、130℃、30Pa、1時間の条件で、溶剤置換を行い、樹脂液を得た。得られた樹脂液と、金属粉1と、金属粉2と、エポキシ樹脂1とを、表2に記載の比率で混合後、三本ロールミル(井上製作所製)用いて混錬し、ペースト状の組成物を得た。
得られた組成物をベンジルアルコールで希釈し、25℃、せん断速度4(1/s)における粘度が30Pa・sとなるよう調整した上で、上記評価を行った。その結果を表8に示す。
<積層型電子部品の製造>
被電極形成体として、縦3.2mm、横2.5mm、高さ2.5mmの、図1に示すような略直方体の、チタン酸バリウムを含む誘電体層とニッケルを含む内部電極層が複数層積層された積層体を準備した。
上記積層体の両端面に、縦方向を鉛直方向にして、ディップ法により銅粉末を含む導電性樹脂組成物を塗布後、大気雰囲気、150℃の条件で10分保持した。その後、窒素雰囲気において、780℃になるまで50℃/分の昇温速度で昇温し、780℃に到達後、15分間保持することで銅端子を形成した。
積層体の両端面に形成された銅端子に、縦方向を鉛直方向にして、ディップ法により、表4又は表8に記載の導電性樹脂組成物を塗布し、大気雰囲気、200℃の条件で60分間保持することで塗布した導電性樹脂組成物を硬化させ、前述の銅端子上に導電性樹脂層を形成した。
更に、導電性樹脂層上にニッケルメッキを層形成し、ニッケルメッキ層上にスズメッキ層を形成することで、積層型電子部品として積層セラミックコンデンサを作製した。
<製造性の評価>
上記積層型電子部品の鉛直方向に沿う断面をSEMで観察し、積層体の端面のコーナー部における導電性樹脂層の厚み(端面コーナー厚み)と、積層体の端面部における導電性樹脂層の厚み(端面厚み)を計測した。積層体のコーナー部において、メッキ層と導電性樹脂層の境界から導電性樹脂層と下地層(銅端子)の境界までの距離が最も短い部分の長さを端面コーナー厚みとした。また、積層体の端面部において、導電性樹脂層とメッキ層の境界から積層体に向かって垂線を引いたときの導電性樹脂層と下地層(銅端子)の境界までの距離が最も長い部分の長さを端面厚みとした。端面コーナー厚みが、2.5μm未満及び/又は端面厚みが300μm超のものを「評点:1、不合格、使用不可、製造性に劣る」、端面コーナー厚みが5.0μm以上、且つ、端面厚みが200μm以下のものを「評点:3、合格、使用可、製造性に優れる」、それら以外を「評点:2、合格、使用可、製造性が良好である」として評価を行ったところ、導電性樹脂層の形状は表4又は表8に示す結果となった。
<固体電解コンデンサの製造>
被電極形成体として、縦0.5mm、横3.7mm、高さ5.4mmの、略直方体の、タンタルからなる陽極と、陽極表面に形成された五酸化タンタルからなる誘電体層からなる被陰極形成体を準備した。
上記被陰極形成体上に固体電解質層を形成し、固体電解質層上にカーボン層を形成した後、高さ方向を鉛直方向にして、ディップ法により、表5又は表6に記載の導電性樹脂組成物をカーボン層上に塗布し、大気雰囲気、170℃の条件で60分間保持することで塗布した導電性樹脂組成物を硬化させ、導電性樹脂層を形成した。
その後、端子に接続し、樹脂モールド法により樹脂外層を形成して固体電解コンデンサとしてタンタルコンデンサを作製した。
<製造性の評価>
上記固体電解コンデンサの水平断面をSEMで観察し、被陰極形成体の側面のコーナー部における導電性樹脂層の厚み(側面コーナー厚み)と、被陰極形成体の側面部における導電性樹脂層の厚み(側面厚み)を計測した。被陰極形成体のコーナー部において、樹脂外層と導電性樹脂層の境界から導電性樹脂層と下地層(被陰極形成体)の境界までの距離が最も短い部分の長さを側面コーナー厚みとした。また、被陰極形成体の側面部において、樹脂外層と導電性樹脂層の境界から導電性樹脂層と下地層(被陰極形成体)の境界までの距離が最も長い部分の長さを側面厚みとした。側面コーナー厚みが5μm以上且つ側面厚みが20μm以下のものを「評点:3、合格、使用可、製造性に優れる」、側面コーナー厚みが2.5μm未満及び/又は側面厚みが40μm超のものを「評点:1、不合格、使用不可、製造性に劣る」、それら以外を「評点:2、合格、使用可、製造性が良好である」として評価を行ったところ、導電性樹脂層の形状は表5又は表6に示す結果となった。
<スクリーン印刷による導電性樹脂層の形成>
アルミナ基板(1インチ角)を準備した。この基板上に、表7に記載の導電性組成物を線幅150μmでスクリーン印刷し、大気雰囲気、200℃の条件で60分間保持することで印刷した導電性組成物を硬化させ、導電性樹脂層を形成した。
<導電性樹脂層の形状の評価>
上記導電性樹脂層を形成後、ニジミやカスレが見られず形状が良好であったものを「評点:3、合格、使用可、成形性に優れる」、若干のニジミやカスレが見られたが使用が可能なレベルであったものを「評点:2、合格、使用可」、ニジミやカスレが顕著に見られ使用が不可能なレベルであったものを「評点:1、不合格、使用不可、成形性に劣る」として評価を行ったところ、導電性樹脂層の形状は表7に示す結果となった。
Claims (18)
- 電子部品用被電極形成体を準備する準備工程と、
該電子部品用被電極形成体の外表面上に、電極を形成させる電極形成工程と、
を有し、
該電極形成工程において、金属粉末と、樹脂バインダーと、有機溶媒と、を含有し、該金属粉末のうち20.0質量%以上がフレーク状金属粉末であり、該樹脂バインダーのうち70.0質量%以上がシリコーン樹脂である導電性樹脂組成物を用いて、該電子部品用被電極形成体に導電性樹脂層を形成させること、
を特徴とする電子部品の製造方法。 - 金属粉末と、樹脂バインダーと、有機溶媒と、を含有し、
該金属粉末のうち20.0質量%以上がフレーク状金属粉末であり、
該樹脂バインダーのうち70.0質量%以上がシリコーン樹脂であること、
を特徴とする導電性樹脂組成物。 - 前記樹脂バインダーのうち80.0質量%以上がシリコーン樹脂であることを特徴とする請求項2記載の導電性樹脂組成物。
- 前記樹脂バインダーの含有量が、前記金属粉末100.0質量部に対し、2.5~35.0質量部であることを特徴とする請求項2又は3記載の導電性樹脂組成物。
- 前記シリコーン樹脂がエポキシ基を有することを特徴とする請求項2~4いずれか1項記載の導電性樹脂組成物。
- 前記シリコーン樹脂が水酸基を有することを特徴とする請求項2~4いずれか1項記載の導電性樹脂組成物。
- 前記シリコーン樹脂が熱硬化性シリコーン樹脂であることを特徴とする請求項2~4いずれか1項記載の導電性樹脂組成物。
- 前記樹脂バインダーのうち0.0質量%を超え20.0質量%以下がエポキシ樹脂であることを特徴とする請求項2~7いずれか1項記載の導電性樹脂組成物。
- 前記フレーク状金属粉末のアスペクト比が1.5~50.0であることを特徴とする請求項2~8いずれか1項記載の導電性樹脂組成物。
- 前記金属粉末が、銀、銅、ニッケル、パラジウム、白金、金及びアルミニウムのうちの1種以上の粉末、これらのうちの1種以上を含む合金を含む粉末、銀被覆銅粉末及び銀被覆ニッケル粉末から選ばれる少なくとも1種以上の粉末であることを特徴とする請求項2~9いずれか1項記載の導電性樹脂組成物。
- 更に、可塑剤を含有することを特徴とする請求項2~10いずれか1項記載の導電性樹脂組成物。
- 前記導電性樹脂組成物に角周波数1Hzでひずみ量1%を加えたときの、該ひずみと該ひずみで生じた応力との位相差δの値が32~88°の範囲にあることを特徴とする請求項2~11いずれか1項記載の導電性樹脂組成物。
- 前記導電性樹脂組成物の、せん断速度40(1/s)における粘度に対するせん断速度0.4(1/s)における粘度の比が1.4~60.0の範囲にあることを特徴とする請求項2~12いずれか1項記載の導電性樹脂組成物。
- 前記導電性樹脂組成物が、積層型電子部品の外部電極形成用であることを特徴とする請求項2~13いずれか1項記載の導電性樹脂組成物。
- 前記導電性樹脂組成物が、固体電解コンデンサの陰極形成用であることを特徴とする請求項2~13いずれか1項記載の導電性樹脂組成物。
- 前記導電性樹脂組成物が、ディップ印刷用であることを特徴とする請求項14又は15記載の導電性樹脂組成物。
- 下記透湿量測定試験により求められる透湿量が80.0mg以下であることを特徴とする請求項2~16いずれか1項記載の導電性樹脂組成物。
<透湿量測定試験>
導電性樹脂組成物をPETフィルム上に厚さ250μmでキャスティングし、200℃、60分の条件で硬化させ、得られた硬化膜を直径7.5mmの円形に切り出し、シリカゲル2gが入った5mlガラス瓶に蓋をするように接着剤で固定し、精製水を100ml入れた750ml容器内に前記硬化膜が精製水に接触しないように該ガラス瓶を入れ密閉した状態で、65℃に設定した乾燥機に入れて15時間静置し、次いで、下記式(1):
透湿量(重量増加量)=乾燥機に入れた後のガラス瓶の重量-乾燥機に入れる前のガラス瓶の重量 (1)
により、透湿量を算出する。 - 金属粉末と、樹脂バインダーと、有機溶媒と、を含有する導電性樹脂組成物であって、
前記金属粉末を100.0質量部としたときの前記樹脂バインダーの含有量が5.0~25.0質量部であり、
前記樹脂バインダーのうち80.0質量%以上がシリコーン樹脂であり、
前記金属粉末のうち20.0質量%以上が、フレーク状の金属粉末であり、
前記導電性樹脂組成物に角周波数1Hzでひずみ量1%を加えたときの、該ひずみと該ひずみで生じた応力との位相差δの値が45~87°の範囲にあり、
前記導電性樹脂組成物の、せん断速度40(1/s)における粘度に対するせん断速度0.4(1/s)における粘度の比が1.5~20.0の範囲にあること、
を特徴とする請求項3記載の導電性樹脂組成物。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020227040843A KR20230006863A (ko) | 2020-05-01 | 2021-04-23 | 도전성 수지 조성물 및 전자 부품의 제조 방법 |
EP21797474.0A EP4144801A1 (en) | 2020-05-01 | 2021-04-23 | Electroconductive resin composition and manufacturing method for electronic component |
US17/922,585 US20230170105A1 (en) | 2020-05-01 | 2021-04-23 | Conductive resin composition and method for manufacturing electronic component |
JP2022504007A JP7078194B2 (ja) | 2020-05-01 | 2021-04-23 | 電子部品の電極形成用導電性樹脂組成物 |
CN202180032455.XA CN115516589A (zh) | 2020-05-01 | 2021-04-23 | 导电性树脂组合物和电子部件的制造方法 |
US18/346,538 US20230343481A1 (en) | 2020-05-01 | 2023-07-03 | Conductive resin composition |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020081191 | 2020-05-01 | ||
JP2020081190 | 2020-05-01 | ||
JP2020-081190 | 2020-05-01 | ||
JP2020-081191 | 2020-05-01 | ||
JP2020087085 | 2020-05-19 | ||
JP2020087086 | 2020-05-19 | ||
JP2020-087085 | 2020-05-19 | ||
JP2020-087086 | 2020-05-19 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/922,585 A-371-Of-International US20230170105A1 (en) | 2020-05-01 | 2021-04-23 | Conductive resin composition and method for manufacturing electronic component |
US18/346,538 Division US20230343481A1 (en) | 2020-05-01 | 2023-07-03 | Conductive resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021220976A1 true WO2021220976A1 (ja) | 2021-11-04 |
Family
ID=78373196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/016514 WO2021220976A1 (ja) | 2020-05-01 | 2021-04-23 | 導電性樹脂組成物及び電子部品の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20230170105A1 (ja) |
EP (1) | EP4144801A1 (ja) |
JP (2) | JP7078194B2 (ja) |
KR (1) | KR20230006863A (ja) |
CN (1) | CN115516589A (ja) |
TW (1) | TW202213407A (ja) |
WO (1) | WO2021220976A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220122776A1 (en) * | 2020-10-21 | 2022-04-21 | Tdk Corporation | Electronic component |
US20220199328A1 (en) * | 2020-12-18 | 2022-06-23 | Samsung Electro-Mechanics Co., Ltd. | Multilayered electronic component and method of manufacturing the same |
WO2023119843A1 (ja) * | 2021-12-22 | 2023-06-29 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ素子および固体電解コンデンサ |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6331522A (ja) | 1986-07-25 | 1988-02-10 | Kao Corp | 吸湿剤 |
JPH11213756A (ja) * | 1998-01-28 | 1999-08-06 | Hitachi Chem Co Ltd | 導電性ペースト組成物及びこれを用いた電子部品 |
JP2000133043A (ja) * | 1998-10-22 | 2000-05-12 | Three Bond Co Ltd | 接続抵抗値を改善する導電性組成物 |
WO2003035739A1 (fr) * | 2001-10-19 | 2003-05-01 | Hitachi Chemical Co., Ltd. | Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition |
JP2004168966A (ja) * | 2002-11-22 | 2004-06-17 | Hitachi Chem Co Ltd | 導電性樹脂組成物及びこれを用いた電子部品 |
JP2009295602A (ja) | 2006-08-22 | 2009-12-17 | Murata Mfg Co Ltd | 積層型電子部品、および積層型電子部品の製造方法。 |
JP2014135463A (ja) * | 2013-01-09 | 2014-07-24 | Samsung Electro-Mechanics Co Ltd | 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法 |
WO2016104232A1 (ja) | 2014-12-26 | 2016-06-30 | ハリマ化成株式会社 | 導電性ペースト |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3650546B2 (ja) * | 1998-08-28 | 2005-05-18 | 松下電器産業株式会社 | 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法 |
JP4367631B2 (ja) | 2004-04-12 | 2009-11-18 | 信越化学工業株式会社 | 室温硬化型導電性シリコーンゴム組成物 |
JP2006213909A (ja) | 2005-01-06 | 2006-08-17 | Shieldtechs Inc | 防錆性および/または導電性に優れた樹脂組成物並びに樹脂組成物被覆部材 |
JP4951948B2 (ja) * | 2005-12-02 | 2012-06-13 | 昭栄化学工業株式会社 | 導体形成方法 |
JP5201734B2 (ja) | 2009-03-06 | 2013-06-05 | 旭化成ケミカルズ株式会社 | 導電性樹脂組成物、それを用いた半導体装置及び導電性樹脂組成物の製造方法 |
JP2021099912A (ja) * | 2019-12-20 | 2021-07-01 | 株式会社ノリタケカンパニーリミテド | 導電性ペースト |
-
2021
- 2021-04-23 JP JP2022504007A patent/JP7078194B2/ja active Active
- 2021-04-23 EP EP21797474.0A patent/EP4144801A1/en active Pending
- 2021-04-23 KR KR1020227040843A patent/KR20230006863A/ko active Search and Examination
- 2021-04-23 WO PCT/JP2021/016514 patent/WO2021220976A1/ja unknown
- 2021-04-23 US US17/922,585 patent/US20230170105A1/en active Pending
- 2021-04-23 CN CN202180032455.XA patent/CN115516589A/zh active Pending
- 2021-04-29 TW TW110115470A patent/TW202213407A/zh unknown
-
2022
- 2022-04-11 JP JP2022064905A patent/JP7103543B1/ja active Active
-
2023
- 2023-07-03 US US18/346,538 patent/US20230343481A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6331522A (ja) | 1986-07-25 | 1988-02-10 | Kao Corp | 吸湿剤 |
JPH11213756A (ja) * | 1998-01-28 | 1999-08-06 | Hitachi Chem Co Ltd | 導電性ペースト組成物及びこれを用いた電子部品 |
JP2000133043A (ja) * | 1998-10-22 | 2000-05-12 | Three Bond Co Ltd | 接続抵抗値を改善する導電性組成物 |
WO2003035739A1 (fr) * | 2001-10-19 | 2003-05-01 | Hitachi Chemical Co., Ltd. | Composition de resine electroconductrice et composantes electroniques faisant appel a cette composition |
JP2004168966A (ja) * | 2002-11-22 | 2004-06-17 | Hitachi Chem Co Ltd | 導電性樹脂組成物及びこれを用いた電子部品 |
JP2009295602A (ja) | 2006-08-22 | 2009-12-17 | Murata Mfg Co Ltd | 積層型電子部品、および積層型電子部品の製造方法。 |
JP2014135463A (ja) * | 2013-01-09 | 2014-07-24 | Samsung Electro-Mechanics Co Ltd | 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法 |
WO2016104232A1 (ja) | 2014-12-26 | 2016-06-30 | ハリマ化成株式会社 | 導電性ペースト |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220122776A1 (en) * | 2020-10-21 | 2022-04-21 | Tdk Corporation | Electronic component |
US11646160B2 (en) * | 2020-10-21 | 2023-05-09 | Tdk Corporation | Electronic component |
US20220199328A1 (en) * | 2020-12-18 | 2022-06-23 | Samsung Electro-Mechanics Co., Ltd. | Multilayered electronic component and method of manufacturing the same |
US11842853B2 (en) * | 2020-12-18 | 2023-12-12 | Samsung Electro-Mechanics Co., Ltd. | Multilayered electronic component and method of manufacturing the same |
WO2023119843A1 (ja) * | 2021-12-22 | 2023-06-29 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ素子および固体電解コンデンサ |
Also Published As
Publication number | Publication date |
---|---|
EP4144801A1 (en) | 2023-03-08 |
JP7078194B2 (ja) | 2022-05-31 |
TW202213407A (zh) | 2022-04-01 |
CN115516589A (zh) | 2022-12-23 |
JPWO2021220976A1 (ja) | 2021-11-04 |
JP7103543B1 (ja) | 2022-07-20 |
US20230170105A1 (en) | 2023-06-01 |
JP2022106752A (ja) | 2022-07-20 |
KR20230006863A (ko) | 2023-01-11 |
US20230343481A1 (en) | 2023-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021220976A1 (ja) | 導電性樹脂組成物及び電子部品の製造方法 | |
JP5569747B2 (ja) | 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト | |
JP6094597B2 (ja) | 積層セラミック電子部品 | |
KR101191503B1 (ko) | 도전성 수지 조성물 및 칩형 전자부품 | |
JP2012174797A5 (ja) | ||
JP7075397B2 (ja) | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 | |
JP5675161B2 (ja) | 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 | |
JP4930808B2 (ja) | 導電性ペースト | |
JP5877239B2 (ja) | 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 | |
WO2021220975A1 (ja) | 電子部品の製造方法 | |
WO2023080027A1 (ja) | 熱硬化型導電性樹脂組成物及び電子部品の製造方法 | |
JP7213050B2 (ja) | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 | |
CN118176260A (zh) | 热固化型导电性树脂组合物和电子部件的制造方法 | |
CN118176261A (zh) | 热固化型导电性树脂组合物、电子部件的制造方法 | |
WO2023080028A1 (ja) | 熱硬化型導電性樹脂組成物、電子部品の製造方法 | |
WO2023218872A1 (ja) | ポリマー型導電性ペースト、導電膜、及び、固体電解コンデンサ素子 | |
JP4622974B2 (ja) | 導電性ペースト、積層セラミック電子部品及びその製造方法 | |
JP2022133621A (ja) | 導電性ペーストおよびその利用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21797474 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2022504007 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20227040843 Country of ref document: KR Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2021797474 Country of ref document: EP Effective date: 20221201 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |