TWI253457B - Electroconductive resin composition and electronic parts using the same - Google Patents

Abstract

An electroconductive resin composition which comprises a silver-plated cooper powder (a1) having an aspect ratio of 1 to 20, an electroconductive powder containing a silver powder (A1), a thermoplastic resin (B1) having one or more functional groups selected from the group consisting of an amide group, an ester group, an imide group and en ether group, and an organic solvent (C); an electroconductive resin composition which comprises a silver-plated cooper powder (a2) having cooper exposed on a part of the surface thereof, an electroconductive powder (A2) containing a silver powder, the above thermoplastic resin (B1), and an organic solvent (C); an electroconductive resin composition which comprises the electroconductive powder (A1), a thermoplastic resin (B2) selected from the group consisting of a polyamide silicone resin, a polyamideimide silicone resin and a polyimide silicone resin, and an organic solvent (C); and an electroconductive resin composition which comprises the above electroconductive powder (A2), the above thermoplastic resin (B2) and an organic solvent (C).

Description

1253457 Μ ___ Β7 — — — — I — , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Note on the back side. In the field of general electronic components, a paste-like resin composition obtained by kneading a conductive material such as a metal in a resin is used for circuit or electrode formation. Among them, silver is the most representative conductive material. However, when the voltage is applied under high humidity conditions, ionization is very easy, and there is a phenomenon of silver migration called migration. Further, when the migration occurs, a short circuit between the electrodes occurs, which is a cause of a decrease in the moisture resistance of the electronic component. It has been reviewed that nickel powder, palladium powder or copper powder is added in place of silver powder, or various additives are added. However, in any case, it is expected to improve the resistance of the electrode material and the like. A prior art for preventing migration of a solid electrolytic capacitor has been disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. The invention provides a conductive powder (A 1 ) containing silver-plated copper powder (a 1 ) having an aspect ratio of 1 to 20 and silver powder, in the first aspect of the invention. And a heat-resistant resin (B1) having one or more functional groups selected from the group consisting of a mercapto group, an anthracene group, a quinone imine group, and an ether group, and a conductive resin composition of the organic solvent (C) (hereinafter referred to as It is "composition K"). This paper scale applies to Chinese National Standard (CNS) Α4 specification (210Χ297 mm) -4 - 1253457 A7 B7 V. Invention description (2) - - 1 1 Ι^ϋ -I- -i ill e ί·1· I ( Please read the following notes on the back side and fill out this page. The second aspect of the present invention provides a conductive powder (A2) containing silver-plated copper powder (a2) having a copper exposed portion on the surface and a silver powder, and having a guanamine A conductive resin composition (b 1 ) of the organic solvent (C) and a conductive tree composition of the organic solvent (C) selected from the group consisting of a base group, an ester group, an oxime imine group, and an ether group (hereinafter referred to as "the composition" L"). According to a third aspect of the present invention, there is provided a conductive powder (A丨) comprising a silver-plated copper powder (a 1 ) having an aspect ratio of 1 to 2 Å and a silver powder, and a polyamine polyoxyalkylene or a polyamide A thermoplastic resin (B2) selected from the group consisting of an imine polyoxyalkylene and a polyamidene polyoxyalkylene group, and a conductive resin composition of an organic solvent (C) (hereinafter referred to as "composition material"). According to a fourth aspect of the present invention, there is provided a conductive powder (Α2) comprising a silver-plated copper powder (a2) having a copper exposed portion on a surface thereof, and a silver powder, and a polyamine polyoxyalkylene or a polyamidimide poly A thermoplastic resin (B2) selected from the group consisting of a siloxane and a polyamidene polysiloxane group, and a conductive resin composition (hereinafter referred to as "composition N") of the organic solvent (C). According to a fifth aspect of the present invention, there is provided an electronic component comprising a conductor layer formed by using the conductive resin composition (compositions K, L, Μ, N) of the present invention. EMBODIMENT OF THE INVENTION The conductive resin composition of the present invention is a paste-like resin composition, and will be referred to as "composition" or "paste" in the following description. The composition is a conductive powder (A1) containing silver-plated copper powder (a 1 ) and silver powder having an aspect ratio of 1 to 20, and having a mercaptoamine group, an ester group, and a quinone imine. Standard (CNS) A4 specification (2丨〇><297mm) -5- 1253457 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (3) selected from the base and ether group A composition of a thermoplastic resin (B1) having a functional group or more and an organic solvent (C). When a scaly conductive powder is used, when it is applied to a member having a complicated shape (polyhedron), the edge coating property is insufficient, and the resistance force is increased and the resistance between the surfaces is deviated, so that the electronic component is liable to cause electrical property defects. And reduce the dimensional accuracy of the resin exterior. In particular, when a cathode of a solid electrolytic capacitor using a valve action metal is used for the anode, the leakage current (LC) of the product tends to increase. In contrast, the composition K has good coatability and good electrical conductivity after drying, and the resulting coating film has excellent stability (migration resistance) and dimensional accuracy (edge wrapping property) under high temperature and high humidity. Therefore, the use of the composition K can provide an electronic component having excellent moisture resistance and dimensional accuracy. For example, when the composition K is used for cathode formation, a solid electrolytic capacitor having good moisture resistance and low leakage can be provided. The composition L is a conductive powder (A2) containing a silver-plated copper powder (a2) having a copper exposed portion on the surface and a silver powder, and has a mercapto group, an ester group, a quinone imine group, and an ether group. A thermoplastic resin (B 1 ) having one or more functional groups and a composition of the organic solvent (C) are selected. At present, a general conductive powder is a copper powder. At this time, although the resistance 値 is superior to the use of the nickel powder or the palladium powder, the viscosity of the paste increases with the oxidation or coagulation of the copper powder, and there is a problem of stability over time. Further, when the conductive paste using silver powder is welded, the resin for bonding with a soldering function is thermally decomposed, so that the coating film portion is defective and cannot be sufficiently joined. In addition, the conductive paste which previously used silver powder and copper powder reacts with oxygen contained in the air and the resin for bonding, and forms an oxide film on the surface, so it is not suitable for soldering (please read the back side first) Note: Please fill in this page. This paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) -6 - 1253457 A7 B7 V. Invention description (4) (Please read the notes on the back and fill in the form) Page). In contrast, the paste viscosity of the composition L has excellent stability over time, so that a coating film which can be welded can be formed. Therefore, the use of the composition L can provide an electronic component having excellent solder heat resistance. For example, a composition can be used for forming a cathode, and a solid electrolytic capacitor having excellent solderability and excellent solder heat resistance can be provided. The composition is a conductive powder (A 1 ) containing silver-plated copper powder (al) and silver powder having an aspect ratio of 1 to 20, and polyamine polyoxyalkylene, polyamidoximine polyoxyl A composition of a thermoplastic resin (B2) selected from the group consisting of an alkane and a polyamidene polyoxyalkylene group, and an organic solvent (C). At present, a thermosetting resin is widely used as a paste for bonding, but the film thickness and toughness of the obtained coating film are inferior, and the impact resistance after forming a circuit is inferior. Further, when the paste is used for an electrode of a solid electrolytic capacitor, the strength and toughness of the coating film are poor, and the overvoltage load characteristics are insufficient. On the other hand, since the composition can form a dry coating film having excellent coating film strength and toughness, it is particularly useful for providing electronic parts such as solid electrolytic capacitors excellent in overvoltage load. The printed composition N of the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs contains conductive powder (A2) containing silver-plated copper powder (a2) having a copper exposed portion on the surface and silver powder, and polyamine polyoxyalkylene. A composition of a thermoplastic resin (B2) selected from the group consisting of a polyamidoximine polyoxyalkylene and a polyamidene polyoxyalkylene group, and an organic solvent (C). When the thermosetting resin is used as a paste for adhesion, the obtained coating film is inferior in flexibility. Therefore, when it is used in a curved substrate forming circuit or the like, the coating film is cracked due to a large bending rate, which causes a short circuit problem. On the other hand, since the composition N can form a dry coating film excellent in flexibility, it is particularly useful for providing electronic parts such as solid electrolytic capacitors excellent in thermal shock resistance. -7 - The paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 1253457 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (5) composition K and composition A conductive powder (A 1 ) containing silver-plated copper ( a 1 ) having an aspect ratio of 1 to 20 and silver powder is used. The aspect ratio means the long diameter to short diameter ratio (long diameter/short diameter) of the particles of the silver plated copper powder. In the present invention, the silver-plated copper powder particles are uniformly mixed in a curable resin having a low viscosity, and after standing, the particles are precipitated and the resin is cured, and then the vertical direction of the obtained cured product is cut and observed by a microscope observation section. The particle shape, and the average length of the long diameter/short diameter of at least one hundred particles is obtained as an aspect ratio. The term 'short diameter' refers to the distance between two parallel lines of the shortest interval when two parallel lines are used to clamp the outside of the particles appearing in the section. Further, the long diameter means a distance between two parallel lines of the longest interval when the parallel lines of two parallel lines perpendicular to the short diameter are caught by the outer side of the particle, and the rectangular shape formed by the four lines is just enough to accommodate the particles. The specific method used in the present invention will be described later. The silver-plated copper powder (a 1 ) refers to a conductive powder in which part or all of the copper powder is coated with silver. For example, silver powder is coated on a matte copper powder by a method such as a substitution plating method, a plating method, or an electroless plating method. Among them, a coating method using a substitution plating method in which the adhesion between copper powder and silver is high and the running cost is low is preferable. In the composition K, the silver coating amount of the silver-plated copper powder (a 1 ) is not particularly limited, and the conductivity and the migration resistance are preferably 0.5 to 50 parts by weight, more preferably 1.0 to 100 parts by weight of copper. 35 parts by weight, particularly preferably 1.5 to 25 parts by weight. The aspect ratio of the mineral silver copper powder (a 1 ) may be from 1 to 20 in terms of the coating properties of the paste. When the aspect ratio exceeds 20, the applicability of the paste is deteriorated, and particularly when the cathode of the solid electrolytic capacitor is used, the edge wrapping property of the element is lowered to increase the leakage current. Considering the conductivity of the film, etc., the length and width are preferably 1.5 to 18 (please read the note on the back and fill out this page). The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -8- 1253457 A7 B7 5. Invention description (6), more preferably 2.5 to 12. The average particle diameter of the silver-plated copper powder (al) is preferably from 0·2//m to 2〇//m, more preferably l/, in terms of dispersibility, flatness, edge wrapping property and film conductivity. /m to 12//m, especially preferably to 8//m. When the average particle diameter is less than 0.2/m, the paste tends to aggregate, and when it exceeds 20/m, the edge wrapping property and electrical resistance are lowered. The average particle diameter can be measured by a laser scattering type flow distribution measuring device. In the composition, the silver-plated copper powder (a 1 ) may have an aspect ratio of 1 to 20. When the aspect ratio is more than 20, the coating property of the paste and the strength and toughness of the conductive coating film are lowered, and particularly when used as a cathode of a solid electrolytic capacitor, the overvoltage load characteristic is deteriorated, and the impedance is lowered. The cause. Considering the conductivity of the coating film, the length and width are preferably from 1.5 to 18, more preferably from 2.5 to 12. The silver coating amount of the bismuth silver-copper powder (a 1 ) is not particularly limited, and the conductivity and migration resistance are preferably 0.5 to 50 parts by weight, more preferably 1.0 to 35 parts by weight, per 100 parts by weight of copper. More preferably, it is 1.5 to 25 parts by weight. When the amount of silver coating is less than 1 part by weight, the electrical conductivity is lowered, and when it exceeds 30 parts by weight, the overvoltage load characteristics of the capacitor are lowered. The average particle diameter of the silver-plated copper powder (al) is preferably from 0.2/m to 20 //m, more preferably from 1/m to 12/, considering the dispersibility, viscosity, workability and film conductivity of the paste. /m, more preferably up to 8//m. When the average particle diameter is less than 0.2/m, the paste tends to aggregate, and when it exceeds 20/m, the coating property and electrical resistance are lowered. The average particle diameter can be measured by a laser scattering type flow distribution measuring device. The silver powder contained in the conductive powder (A 1 ) is not particularly limited, and a shape such as a scaly shape, a spherical shape or a block shape which is generally used can be used. Considering conductivity, coating and edge wrapping, it is preferred that the scaly and spherical medium particle size is 0.2. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) f Please read the back of the note first. Matters to fill out this page} • Sisters · - Department of Economics, Intellectual Property Bureau, Staff Consumer Cooperatives Printed - 9- 1253457 A7 ____ B7 V. Inventions (7) // m to 12 // m, especially good for 1 μ m to 8 // m. (Please read the precautions on the back and fill out this page.) The ratio of silver-plated copper powder (a 1 ) to silver powder (weight ratio) in conductive powder (A 1 ) is not particularly limited. For silver-plated copper powder (al)丨The silver powder ratio of 00 parts by weight is preferably 25 parts by weight or more from the viewpoint of conductivity of the coating film, and is preferably 400 parts by weight or less, more preferably 42.8%, from the viewpoint of leakage current or overvoltage load characteristics of the capacitor. 23 3.3 parts by weight, particularly preferably 66.6 to 150 parts by weight. In the composition L and the composition ν, a conductive powder (Α2) containing silver-plated copper powder (a2) having a copper exposed portion and a silver powder was used. The silver-plated copper powder (a2) is a part of a copper alloy powder (i.e., silver-plated copper powder) which is exposed and has a silver-coated surface. When a part of the copper of the silver-plated copper powder is not exposed and the entire surface is covered with silver, the weldability of the composition is deteriorated, and the thermal flushing property of the composition N is deteriorated. Further, the silver powder is used for improving conductivity, and the composition containing no silver powder is not suitable for the conductive layer. Printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs. The copper powder used in the silver-plated copper powder (a2) may be any shape such as a spherical shape, a scale shape, a block shape or a broken shape, and is preferably a copper powder. The copper exposed area of the silver-plated copper powder (a2) is preferably from 10 to 70%, more preferably from 10 to 50, in terms of stability of the viscosity of the paste, weldability, partial oxidation, conductivity, thermal flushing, and the like. %, especially good 10 to 30%. The area of copper exposure can be determined by measuring the difference between the surface area of the silver and the surface area of the copper powder. The silver-plated copper powder (a2) can be obtained by coating silver on a copper-like copper powder by a method such as a substitution plating method, an electroplating method, or an electroless plating method. Among them, it is better to cover the plating method which can improve the adhesion of copper powder and silver and the lower running cost. The silver coating on the surface of the copper powder enhances the stability of the bone viscosity, weldability, cost, conductivity, etc., preferably 100 to 10 parts by weight of the copper powder. The paper scale applies to the Chinese national standard (CNS). A4 size (210X29? mm) 1253457 A7 B7 V. Description of the invention (8) 25 wt%, particularly preferably 10 to 23 wt%. (Please read the precautions on the back and fill in this page.) The silver powder contained in the conductive powder (A2) is not particularly limited, and the scaly, spherical, and block shapes generally used can be used. Considering conductivity, coating and edge wrapping, it is better to have a spherulitic or spherical medium particle size of 0.2 // m to 1 2 // m, especially preferably 1 // m to 8 // m. The mixing ratio of the silver-plated copper powder (a2) to the silver powder is not particularly limited, and the conductivity is considered. The silver powder ratio of the silver-plated copper powder (a2) is preferably from 25 parts by weight to 266 parts by weight, more preferably 66 parts by weight to 150 parts by weight. When the powder indirect contact of the silver-plated copper powder (a2) is reduced, the resistance of the resulting coating film is easily increased. Further, in order to increase the contact area of the silver-plated copper powder to improve the electrical conductivity, it is preferable to apply a silver-plated copper powder (a2) to cause the particle shape to be flattened. The average particle diameter of the silver-plated copper powder (a2) is not particularly limited, and the coating property, dispersion stability, and the like of the paste are preferably from 1 to 20 // m, preferably from 1 to 10 // m. The average particle diameter can be measured by a laser scattering type flow distribution measuring device. When the composition K and the composition of the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs are used as a resin for bonding, the use of a mercapto group or ester is used in terms of adhesion, dispersibility of the material, solubility in an organic solvent, and the like. A thermoplastic resin (B 1 ) in which one or more functional groups are selected from the group consisting of a quinone imino group and an ether group. The thermoplastic resin (B 1 ) may be used in combination of plural kinds. The thermoplastic resin (B 1 ) is not particularly limited, but an aromatic ring is preferred from the viewpoint of heat resistance and the like. In view of the solubility of the organic solvent (C), it is preferred to have an ether bond. For example, the main chain has a phenyl ether (phenylene oxide) bond and a guanamine bond, and the main chain has a stretch paper. The Chinese National Standard (CNS) A4 specification (2丨) 〇><297 mm) -11 - 1253457 A7 B7 V. INSTRUCTION DESCRIPTION (9) Polyether phenyl ether quinone imine of an ether bond and a quinone bond, a phenyl ether bond and a hydrazine in the main chain a poly(phenyl ether) amidoxime imine of an amine bond and a quinone bond, a polyphenyleneamine having a phenyl group bond and a guanamine bond in the main chain, a phenyl group bond and a quinone bond in the main chain a polyphenylene quinone imine, a polyphenylene fluorinated imine having a phenylene bond and a guanidine bond in the main chain, and a benzene dimethyl bond and a guanamine bond in the main chain Benzyl decylamine, polyphenylene quinone imine having a benzene dimethyl bond and a quinone bond in the main chain, polyphenyl having a benzene dimethyl bond, a guanamine bond and a quinone bond in the main chain It is preferred to use one or more of dimethylammonium imine or the like. Further, an ester bond, a sulfide bond or the like may be further contained, or a benzene ring may be substituted with an arbitrary substituent. Specifically, the thermoplastic resin (B 1 ) is preferably a resin having a repeating unit represented by the following general formula (I) or (Π). Further, a resin having a repeating unit of (I) and (II) at the same time is preferred. General formula (I):

R3

Y, (I) (Please read the note on the back and then fill out this page) - Install · Order · Ministry of Economic Affairs Zhizhi Property Bureau employee consumption cooperative printing (in the formula 'R1, R2, R3 and R4 are each independently hydrogen , low-grade courtyard base, low-grade courtyard oxygen or halogen atom; X1 is a single bond, -〇-, -S-, -C〇-, -S〇2-, -SO-, Η

X Η R5 IC - or R6 R5 and R6 are each independently hydrogen, lower alkyl, trifluoromethyl chloromethyl or this paper scale applicable to China National Standard (CNS) A4 specification (210X297 mm) -12- 1253457 A7 B7 V. Description of the invention (phenyl; γ is -NH-C-Ar1 - C-NH- 〇II c 〇〇II II cc -NH-C-Ar N - A \/ 〇c II 〇 or N Ar° N-\/\/ GC II II 〇〇; Ar1 is an aromatic divalent group; Ar2 is an aromatic trivalent group; Ar3 is an aromatic tetravalent group)

General (II

(II) (Please read the notes on the back and fill out this page) (wherein R7, R8 and R9 are each independently a lower alkyl group, a lower alkoxy group or a halogen atom; and s, t and u are each independently a substituent number Then, an integer of 4; when R7, R8, and R9 are each a plural bond, they may be the same or different; X2 and X3 are each independently -〇- or

R10—C-I11R Printed by the Consumers' Cooperative of the Intellectual Property Office of the Ministry of Economic Affairs; R1() and R11 are each independently a hydrogen atom, a lower alkyl group, a trifluoromethyl group, a trichloromethyl group or a phenyl group; γ is the same as the above general formula ( I)) The general formulae (I) and (II) are preferably a lower alkyl group, a lower alkoxy group, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. The phenyl groups of R5, R6, R1Q and R11 of the general formulae (I) and (()) may be unsubstituted or substituted by arbitrary substituents such as methyl, ethyl or sulfo groups. The paper size is applicable to the Chinese national standard (〇奶) 八4 specification (210><297 mm)'' -13- 1253457 five A7 B7, invention description (11) general formula (Ο shows that the repeat unit is preferably , as in the following general formula (III, the benzene ring is bonded to each other at the 1,4 - position. R3

R'

R

-Y - (ΠΙ) R4 The repeating unit represented by the general formula (II) is similarly preferably 'as defined in the following general formula (IV), and the benzene ring is bonded to each other at the 1,4-position.

Y— (IV) (Please read the precautions on the back and fill out this page) • Packing · The thermoplastic resin (B1) having the above repeated unit can be the acid component (S) described below, ie, aromatic dicarboxylic acid An aromatic tricarboxylic acid, an aromatic tetracarboxylic acid or a reactive acid derivative thereof is obtained by reacting a diamine as described below. Further, the acid component and the diamine may be used in combination of plural kinds. In the repeating unit represented by the general formulae (I) and (III), the diamine is preferably, for example, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2- Bis[3-methyl-4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-methyl-4-(4-aminophenoxy)phenyl]butane 2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]butane, 2,2-bis[3,5-dimethyl-4-(4-amino) Phenoxy)phenyl]butane, 2,2-bis[3' 5-dibromo-4-(4-aminophenoxy)phenyl]butane, 1,1,1,3,3, 3-hexafluoro-2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]propane, 1,1-bis[4-(4-aminophenoxy)benzene Cyclohexane, 1,1-bis[4-(4-aminophenoxy)phenyl]cyclopentane, bis[4-(4-aminophenoxy)phenyl], , Ιτ Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Printed on this paper scale Applicable to China National Standard (CNS) Α4 Specifications (210Χ297 mm) -14- 1253457 A7 B7 V. Invention Description (θ (Please read the back note first and then fill in This page is bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(3-aminophenoxy)phenyl], 4,4, carbonyl One or more kinds of (p-phenylphenyloxy)diphenylamine and 4,4,-bis(4-aminophenoxy)biphenyl are formed, and 2,2-bis[4 - (4 - Aminophenoxy)phenyl]propane is particularly preferred. In the repeating units represented by the formulae (Π) and (IV), the diamine is preferably, for example, 1,3-bis(3-aminophenoxy). Benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4,-[1,3-phenylene bis( 1-methylethylidene)]diphenylamine, 4,4'-[1,4-phenylenebis(1-methylethylidene)]diphenylamine, 3,3'-[1,3-stretch One or more kinds of phenylbis(1-methylethylidene)]diphenylamine are formed. The employees of the Intellectual Property Bureau of the Ministry of Economics, which form the general formula (I), (II), (III), and (IV) When the consumer cooperative prints the position, in addition to the above diamines, 4,4·-diaminodiphenyl ether, 4,41-diaminodiphenylmethane, 4,4,-diamino group can be used. -3,3,,5,5,-tetramethyl-phenyl, 4' 4^-amino-3,3',5,5-tetramethyldiphenylmethane, 4,4 ·-Diamino-3,3,,5,5,-tetraethyl Phenyl ether, 2,2,-[4,4'-diamino-3,3',5,5, tetramethyldiphenyl]propane, m-phenylenediamine, p-phenylenediamine, 3,3 Diaminodiphenyl, piperazine 'hexamethyldiamine, heptamethyldiamine, tetramethylamine, p-xylylenediamine, m-xylenediamine, xylenediamine One or more kinds of 3-methyl t-methyldiamine and 1,3-bis(3-aminopropyl)tetramethyldioxane. The aromatic dicarboxylic acid is a carboxylic acid in which two carboxyl groups are bonded to an aromatic ring. The aromatic tricarboxylic acid is a carboxylic acid in which an aromatic ring is bonded to three carboxyl groups, and it is preferred that two of the three carboxyl groups are bonded to the adjacent carbon atom. The aromatic tetracarboxylic acid is an aromatic ring bonded with 4 krafts of citric acid, and 2 of the 4 thiol groups are bonded to the adjacent paper. The Chinese National Standard (CNS) A4 specification (210X297) PCT 1 1253457 Α7 Β7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (carbon atom is preferred. The aromatic ring can be introduced into the hetero atom (aromatic heterocyclic ring), or through the alkyl group, oxygen The aromatic ring may be bonded to a single bond, a carbonyl group, etc. The aromatic ring may contain a substituent which is not related to a condensation reaction such as an alkoxy group, an allyloxy group, an alkylamino group or a halogen. For example, terephthalic acid, isophthalic acid, 4,4'-diphenyl ether dicarboxylic acid, 4,4, diphenyl terephthalic acid, 4,4·-diphenyldicarboxylic acid, 1 5 - naphthalene dicarboxylic acid, etc., but preferably available and inexpensive terephthalic acid and isophthalic acid. The reactive derivative of the aromatic dicarboxylic acid means the dihydrogenation of the aforementioned aromatic dicarboxylic acid Or dibromide, diester, etc. The aromatic tricarboxylic acid is preferably, for example, trimellitic acid, 3,3',4-benzophenone tricarboxylic acid, , 2,3,4'-diphenyltricarboxylic acid, 2,3,6-pyridinetricarboxylic acid, 3,3,4'-benzoanilide tricarboxylic acid, 1,4,5-naphthalene tris And 2'-chloro-3,4,4'-benzoquinone dicarboxylic acid, etc. The reactive derivative of the aromatic tricarboxylic acid means an anhydride, a halide, an ester, and an anthracene of the aromatic tricarboxylic acid. Amine, ammonium salt, etc. Specific examples are, for example, trimellitic anhydride, trimellitic anhydride monochloride, 1, 4-dicarboxy-3-N,N-dimethylaminomethylhydrazine, i,4-dimethyl ester- 3-carboxybenzene, 1,4-dicarboxy-3-phenoxycarbonylbenzene, 2,6-dicarboxy-3-carbomethoxypyridine, 1,6-dicarboxy-5-aminocarbazinyl, the aforementioned aromatic An ammonium salt formed by a tricarboxylic acid salt, an ammonia, a dimethylamine or a trimethylamine, etc., wherein an easily obtained and inexpensive trimellitic anhydride and a trimellitic anhydride monochloride are preferred. For example, pyromellitic acid, 3,3,4,4'-benzophenone tetracarboxylic acid, 3,3',4,4'-biphenyltetracarboxylic acid, 1, 2,5,6-naphthalene Tetracarboxylic acid, 2,3,anthracene,7-naphthalenetetracarboxylic acid, 2,3,5,indole-omega tetracarboxylic acid, 1,4 Note on this page. This paper size applies to Chinese National Standard (CNS) Α4 specification (210Χ297 mm) -16- 1253457 Α7 Β7 5. Invention description (5,8-naphthalenetetracarboxylic acid, 3,4, 9,10-Camel tetracarboxylic acid, 4,4,-sulfonate, bismuth, bis, _3,3",4,4"-tetradecanoic acid, ρ-biphenyl-3,3M ? 4 j 4, _ tetracarboxylic acid, 4,4'-oxydicyric acid, i, i, 1,3,3,3-hexafluoro, 2 (please read the back of the note first, then fill out this page), 2-bis(2,3-dicarboxyphenyl)propane, 2,2-bis(2,3-dicarboxyphenyl)propyl, 2,2-bis(3,4-diphenyl)propyl Home, 1,1,1,3,3,3, hexafluoro-2,2'-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane, etc. The reactive derivative of the aromatic tetracarboxylic acid means an acid dianhydride, a halide, an ester, a decylamine or an ammonium salt of the above aromatic tetracarboxylic acid. The amount of the acid component (S) formed by the aromatic dicarboxylic acid, the aromatic tricarboxylic acid, the aromatic tetracarboxylic acid or a reactive derivative thereof is based on the molecular weight, mechanical strength, and heat resistance of the obtained polymer. The total amount of the diamines i 00 mol% is preferably from 80 to 120 mol%, particularly preferably from 95 to 1.5 mol. /〇. When the composition Μ and the composition N are used as a resin for bonding, the heat resistance and the low modulus of elasticity of the formed coating film are improved, and the thermoplastic tree used (Β 2 ) is a polyamine polycondensation. Oxygen resin, polyamidoximine resin and polyamidene polyoxyl resin are selected. The thermoplastic resin (Β 2 ) can be used in combination of plural kinds. The thermoplastic resin (Β 2 ) printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs is not particularly limited. For example, an acid such as an aromatic dicarboxylic acid, an aromatic tricarboxylic acid, an aromatic tetracarboxylic acid or a reactive derivative thereof may be used. The composition is obtained by polycondensation of a diamine which is an essential component of an amine-based polyoxan. The diamine-based polyoxane used is preferably, for example, the Chinese National Standard (CNS) Α4 specification (210Χ297 mm) -17- 1253457 A7 B7. The invention description (1)

Yl I N H2

H2 N 1Y— 2I-2 Y—s—V (wherein Y is a divalent hydrocarbon group, γ2 is a monovalent hydrocarbon group, and further, two γ1s may be the same or different, and plural Υ may be the same or different, m is i is an integer shown above). The divalent hydrocarbon group represented by Y1 is, for example, an alkylene group having 1 to 1 Å, a substituted or unsubstituted phenyl group, and the like, and a monovalent hydrocarbon group represented by Y2, for example, an alkyl group having 1 to 1 Å, a substitution or The unsubstituted phenyl group or the like, m is preferably an integer of from 1 to 1 Å. The diaminopolyoxyalkylene oxide may be used singly or in combination of two or more. The other diamine which can be used in common with the above diamine-based polyoxane is not particularly limited, but it is preferable to use an aromatic diamine from the viewpoints of resistance to a resin, solubility to an organic solvent, and solubility. In order to use a polyphenylene ether diamine containing a pendant phenyl ether in the main chain. Specifically, it is preferred to use the aromatic diamine represented by the following general formula (VI). H2n, (please read the precautions on the back and fill out this page) Packing and Booking I·Line Printed by the Intellectual Property Office of the Ministry of Economic Affairs

In nh2 (VI), R1, R2, R3 and R4 are each independently hydrogen, an alkyl group having 1 to 4 carbon atoms, an alkoxy group of 1 to 4 or a halogen atom; χ1 is a single bond, -〇-, _s_, -co· SOo- > -SO- ' This paper scales the appropriate standard (CNS) A4 specifications (2lGX 297 mm) -18- 1253457 A7 B7 V. Invention description (β

R5 and R6 are each independently hydrogen, a lower alkyl group having 1 to 4 carbon atoms, a trifluoromethyltrichloromethyl group, a substituted or unsubstituted phenyl group). The polyphenylene diamine of the general formula (VI) is preferably bonded to the benzene ring at the Μ-position as shown by the following general formula VII). Η2ν

(Please read the precautions on the back and fill out this page.) (VII) The Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, printed the aromatic diamine (e 1 ) with an ether bond as shown in general formula (VII). - bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]propane, 2,2- Bis[4_(4-aminophenoxy)phenyl]butane, 2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]butane, 2,2- Bis[3,5-dimethyl-4-(4-aminophenoxy)phenyl]butane, 2,2-bis[3,5-dibromo-4-(4-aminophenoxy) Phenyl]butane, 1,1,1,3,3,3-hexafluoro-2,2-bis[3-methyl-4-(4-aminophenoxy)phenyl]propane, 1 , 1_double μ-Η-aminophenoxy)phenyl]cyclohexane, 1, 1-bis[4-(4-aminophenoxy)phenyl]cyclopentane, bis[4-( 4-aminophenoxy)phenyl], bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(3-aminophenoxy)phenyl], 4 And 4'-carbonylbis(P-phenylene)diphenylamine, 4,4'-bis(4-aminophenoxy)biphenyl, etc., which may be used singly or in combination. Among them, 2,2-bis[(4-aminophenoxy)phenyl]propene is preferred. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X 297 mm) -19- 1253457 A7 B7 V. Description of invention (1 is in addition to the above (el) aromatic diamine (e2) such as 1,3- Bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-[ 1,3-phenylphenylbis(1-methylethylidene)]diphenylamine, 4,4,-[1,4-phenylphenylbis(1-methylethylidene)]diphenylamine, 3, 3,-[1,3-phenylenebis(1-methylethylidene)]diphenylamine, 4,4,-diaminophenyl ether, 4,4·-diaminodiphenylmethane, 4,4,diamino-3,3,5,5|_tetramethyldiphenyl ether, 4,4,diamino-3,3,5,5,4-tetramethyldiphenyl Methane, 4,4'-diamino-3,3',5,5'-tetraethyldiphenyl ether, 2,2-[4,4'-diamino-3,3,,5, 5'-tetramethyldiphenyl]propane, m-phenylenediamine, p-phenylenediamine, 3,3·-diaminodiphenyl milling, hydrazine-xylylenediamine, toluenediamine, p-xylene Diamines, etc., can be used alone or in combination. In addition to the above (el) and (e2) , that is, an aliphatic or alicyclic diamine (e3) such as piperazine, hexamethylenediamine, heptamethylamine, tetramethylammonium, 3-methylthenemethyldiamine, etc. Further, when the thermoplastic resin (B2) is synthesized, the acid component which reacts with the diamine having the above-mentioned diamine polysiloxane as an essential component may be used for the above synthetic resin (B 1 ). The acid component (S). The amount of the acid component (S) formed by the aromatic dicarboxylic acid, the aromatic tricarboxylic acid, the aromatic tetracarboxylic acid or a reactive derivative thereof is the molecular weight of the obtained polymer. From the viewpoints of mechanical strength, heat resistance and the like, the total amount of the diamine is preferably 100 mol%, and the total amount is 80 to 120 mol%, particularly preferably 95 to 105 mol%. In the composition K, conductivity The mixing ratio of the powder C AD and the thermoplastic resin (B 1 ) is not limited. However, from the viewpoint of the conductivity of the formed coating film, etc., the component (B1) of the component (A1) is preferably 2 to 1 part by weight. 25 parts by weight, this paper size applies to Chinese National Standard (CNS) Α4 specifications (210Χ 297 mm) —.---.---^---- (Please read the notes on the back first) Fill in this page), 1Τ Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -20- 1253457 A7 __B7_ V. Invention Description (1 bow is preferably 4 to 14 parts by weight. Composition (Μ), conductive powder (A1 The mixing ratio with the thermoplastic resin ((2) is not limited, but it is preferably 2 to 25 parts by weight based on 100 parts by weight of the (Α2) component, from the viewpoint of coating film strength, toughness, and electrical conductivity. It is preferably 4 to 14 parts by weight. In the composition, the mixing ratio of the conductive powder (Α2) and the thermoplastic resin (Β2) is not limited, but the (Β2) component of the (Α2) component is 100 parts by weight in terms of flexibility, conductivity, and the like of the coating film. It is preferably 2 to 25 parts by weight, more preferably 4 to 14 parts by weight. The organic solvent (C) used for the composition Κ, L, Μ, Ν, for example, an aromatic solvent such as benzene, toluene or xylene; ketone such as acetone, methyl ethyl ketone, methyl isobutyl ketone or cyclohexanone Solvent; diethyl ether, isopropyl ether, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl Ether solvent such as ethyl ether; ethyl acetate-η-propyl ester, isopropyl acetate, η-butyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate , ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether An ester solvent such as acetate, propylene glycol monoethyl ether acetate or r-butyrolactone; a guanamine solvent such as dimethylformamide, dimethylacetamide or N-methylpyrrolidone. The solvent is used as a resin to dissolve the resin or to adjust the viscosity of the paste, and may be used singly or in combination of two or more. The amount of the organic solvent (C) added is based on the solubility of the resin, the viscosity of the paste, the dispersibility of the conductive powder, and the film formation property. For the thermoplastic resin (please read the back of the back sheet and fill out this page). Ordered by the Ministry of Economic Affairs, Intellectual Property Bureau, Staff and Consumer Cooperatives, printed on this paper scale, applicable to China National Standard (CNS) A4 specification (210X297 mm) -21 - 1253457 A7 B7 V. Invention description (1 bow iOO weight is generally 75 to 46 〇 0 parts by weight, preferably I25 to 3 〇 60 parts by weight. (Please read the following notes on the back side and fill out this page.) For the components containing the above-mentioned additives, for example, a lycra machine, a 3-seater roller machine, a ball mill, or the like can be used. A dispersing machine or the like is obtained by kneading and dispersing the respective components. Further, in order to improve the dispersibility and coatability of the conductive powder (dipping material), a dispersing agent or a coupling agent may be added. The dispersing agent used is preferably, for example, a carbon number of 16. a saturated fatty acid such as palmitic acid or stearic acid of 20; an unsaturated fatty acid such as oleic acid or linoleic acid having a carbon number of 16 to 18; and a metal salt such as sodium, potassium, calcium, zinc or copper of the saturated/unsaturated fatty acid; 1 or more. The amount of the agent added is preferably from 0.2 to 240 parts by weight, more preferably from 2 to 120, per 100 parts by weight of the resin, from the viewpoints of the dispersibility of the conductive powder, the conductivity of the coating film, and the adhesion between the coating film and the substrate. The Ministry of Economic Affairs, Intellectual Property Office, Staff Consumer Cooperative, printing coupling agents such as vinyl methoxy decane, vinyl triethoxy decane, vinyl tris (/3 - methoxy ethoxy) decane, / 3 -(3,4-epoxycyclohexyl)ethyltrimethoxydecane, r-glycidoxypropyltrimethoxydecane, r-glycidoxypropyltrimethoxydecane, r-ring Oxypropoxypropylmethyldiethoxydecane, N-/3-(aminoethyl)-r-aminopropylmethyldimethoxydecane, r-aminopropyltriethoxy a decane coupling agent such as decane, N-phenylaminopropyl.trimethoxydecane or r-mercaptopropyltrimethoxydecane, or a titanate coupling agent, an aluminate coupling agent, yttrium aluminate A coupling agent or the like is preferably added in an amount of not less than 3 parts by weight based on 1 part by weight of the thermoplastic resin. The composition of the present invention is suitable for a conductor layer of various electronic parts. For example, conductive circuit or electrode material. This paper scale applies to Chinese National Standard (CNS) A4 specification (210X29? mm) -22- 1253457 A7 B7 V. Invention description (2() (Please read the note on the back and fill in The electronic component of the present invention has a conductor layer formed by using the composition of the present invention. Various electronic components such as an aluminum electrolytic capacitor, a giant solid electrolytic capacitor, a ceramic capacitor, etc. using the composition as an electrode material; The plate is printed with various substrates which form a conductive circuit from the composition of the present invention; a conductive circuit formed by the composition of the present invention is used as a 1C card or the like for an antenna circuit. The composition of the present invention is also applicable to a cathode material of a solid electrolytic capacitor in which a valve acts as a metal. Preferably, the electronic component of the present invention is a solid electrolytic capacitor comprising a dielectric layer formed of a valve metal and a cathode layer comprising a dielectric oxide film, a solid electrolyte layer, and a conductor layer formed using the composition of the present invention. The solid electrolytic capacitor 10 of the example shown in FIG. 1 is printed by the Intellectual Property Office of the Intellectual Property Office of the Ministry of Economic Affairs, and includes an anode substrate 2 in which the anode wire 1 is buried, and a dielectric oxygen film (anodized film) sequentially formed on the anode substrate 2. 3) and a solid electrolyte layer (semiconductor layer) 4, and a capacitor element of the cathode 5 composed of the carbon layer 51 and the conductor layer 52. The valve action metal used in the anode substrate 2 is preferably molybdenum, aluminum, titanium, tantalum or the like. The shape of the anode base 2 is preferably a foil shape, a plate shape or a rod shape. The anode base 2 is formed by a method in which the valve metal powder is compression-molded in the form of an anode wire 1 in which a ruthenium wire or the like is embedded, and then heated at 2000 ° C for 10 minutes in a vacuum to obtain a sintered body. Then, a voltage is applied to the obtained sintered body (anode base 2) in a chemical solution such as nitric acid or phosphoric acid, and a dielectric oxide film 3 such as Ta2?3 is formed on the surface of the anode base 2 after the formation. The oxide film is preferably a layer formed by an oxide of the anode base metal itself, but may be a dielectric oxygen sheet different from the anode substrate. The Chinese National Standard (CNS) A4 specification (210×297 mm) ~ ' 1253457 A7 B7 V. INSTRUCTIONS (21) (Please read the notes on the back and fill out this page). After the dielectric oxide film is formed, the sintered body is immersed in a semiconductor mother liquid such as a manganese nitrate solution, and after being impregnated with a liquid, it is thermally decomposed by 2 〇〇 to 3 5 〇 π and formed into a sintered body (sinter surface) to be oxidized. A solid electrolyte layer 4 mainly composed of a manganese layer. After the thermal decomposition, it is reformed to repair the dielectric oxide film 3 at the time of sintering, and if necessary, repeat the immersion, firing and reforming steps of 5 to 10 times or more to form the solid electrolyte layer 4 having a desired thickness. Further, as the solid electrolyte layer, a TCNQ (7,7,8,-tetracyano D-quinoline dimethyl hydrazine) complex called an organic semiconductor or a polypyrrole, a polythiophene or a polyaniline of a conductive polymer can be used. Formed. After the solid electrolyte layer 4 is formed, a carbon paste is applied, and after drying, a cathode layer 5 - a portion of the carbon layer 5 1 is formed, and then a conductor layer (silver layer or silver paste layer) of another portion of the cathode layer is formed thereon by using the composition of the present invention. 5 2. The lead frame 7 for taking out the cathode is connected to the obtained conductive layer 52' by soldering or a conductive adhesive 6 or the like, and the anode lead drawn from the sintered body 2 is welded to the lead frame 7 or the like. Finally, it is sealed by an external resin by a resin dipping method, a resin molding method, or the like. The obtained solid electrolytic capacitor is generally 2 to 7111111, 苋 1.25 to 4.3 mm, and 1.2 to 2.8 mm. Printed by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumers' Cooperatives. The present invention will now be described in more detail by way of examples. Further, the measurement methods and evaluation methods of the various characteristics in the examples are as follows. [Aspect ratio] 2 g of a main component (N 〇.丄〇_ 8130) 8 g of a low-viscosity epoxy resin (manufactured by Kura Co., Ltd.) and a curing agent (ν〇·10-8132) were mixed, and 2 g of the powder for measurement was added. 'When fully dispersed, defoaming at 30 ° C vacuum, 3 (standing at TC for 1 〇 hours to make the paper size applicable to China National Standard (CNS) A4 specification (210X 297 mm) -24-1253457 A7 B7 V. DESCRIPTION OF THE INVENTION (2 bow precipitation, resin hardening. Thereafter, the obtained cured product is cut in the vertical direction.) The cross section is observed 1000 times with a microscope, and the long diameter/short diameter of 150 particles appearing in the cross section is obtained, and then averaged.値 is the aspect ratio. [Average particle size] The average particle size of the powder is measured by a Masdar granulator (manufactured by Maruman Co., Ltd.) [Copper exposure area] Five silver-plated copper powder particles are randomly taken out. Observed by a scanning-type Auger electron spectroscopic analyzer, and quantitative analysis of precious metal (silver) and non-precious metal (copper) by Auger image, after calculating the copper occupancy rate, the average enthalpy of five measurements was used as the copper exposed area ( %). [paste viscosity] The temperature in the constant temperature layer is set to 25 °C, using the east The E-type viscometer of the meter is measured by 3° cone, and the viscosity of the paste is measured after the start of measurement to 1 minute (please read the note on the back and fill in the page) -------m --. ....I------ n :―I·- -装·

1T Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing [Change in viscosity of paste] The viscosity of the obtained paste was placed in a thermostat at 30 ° C for 6 months. [Volume Resistivity] The volume resistivity of the dried coating film obtained by using the paste was measured by a double bridge resistance measuring instrument (Model 2769 manufactured by Yokogawa Electric Co., Ltd.). This paper scale applies to China National Standard (CNS) Α4 specification (210X 297 mm) -25- 1253457 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (2 bow [migration characteristics] using volume resistivity determination After drying the coating film, after forming a 2 mm-interval electrode in the center of the dried coating film, pure water was applied to cover all the electrodes, and then 7 V was applied to both ends to evaluate the time until the measured silver moved to the short circuit between the electrodes. [Missing property] The lmmx lmmx 1.5mm cube-shaped giant sintered body was immersed in the measurement paste, and after drying, the obtained element was externally sealed with a transparent epoxy resin, and allowed to stand at room temperature for 10 hours to be hardened. After that, the center of the long side of the cube was cut by a diamond cutter, and it was honed by sandpaper and honing particles, and used as an evaluation component. The state of the paste of the four corners of the evaluation component was observed by an electron microscope. Evaluation A: Good, edge portion The coating film thickness is 1 // m or less, and C: there is a defect portion at the edge portion. [Coating film strength] After drying at 1 80 ° C for 1 hour by a coater, a film thickness of 5 0 / is formed on the Teflon plate. / m Silver film. The film was peeled off from a Teflon plate to prepare a test piece having a width of 5 mm X 40 mm. Then, a tensile tester (manufactured by Imada, Ltd.: tensile compression tester SL-200 1 ) was used to measure the film. Strength [Flexibility of coating film] (Please read the notes on the back and fill in this page)

, 1T This paper scale applies to China National Standard (CNS) Α 4 specifications (210Χ297 mm) -26 - 1253457 A7 B7 V. Invention Description ((Please read the back note first and then fill in this page) Put the paste in 2 Width Applying on a PET film having a thickness of 125/m, a width of 1 cm, and a length of 10 cm, drying at 180 ° C for 1 hour, repeating the other end of the contact surface of one end of the film, and then contacting the other end of the back surface to measure a few times. Cracking of the coating film [Capacitor characteristics] The characteristics of the giant capacitor were measured in accordance with JIS C 5 102-1994 (Test method for fixed capacitors for electronic equipment). The equivalent in-line resistance (ESR) was measured by an LCR meter. (LC): After making a giant capacitor using a measuring paste for a conductor layer, it was measured at 85 ° C using a data micro-amperometer (Ademan test; R8340A), and placed at 1000 ° C for an interval of 1000 hr and 2000 hr. It is measured by an LCR meter (4284A) manufactured by Haleton Co., Ltd. Cap (electrostatic capacity) is measured by LCR (Hybridon 4284A). [Overvoltage load characteristics of capacitor] After applying an overvoltage to the constant voltage of a giant capacitor, Capacitor characteristics were measured to confirm the number of damages of the capacitor. Printed by the Ministry of Economic Affairs, Intellectual Property Office, and the Consumer Cooperatives [welding adhesiveness] The aluminum plate with a width of lcm, a length of 2 cm, and a thickness of 0.5 mm was immersed in a lcm measuring paste and then taken out for baking. The machine was dried at 1 80 ° C for 1 hour to be used as an evaluation sample. The evaluation sample was immersed in a flux and then immersed in a solder bath at each set temperature to observe the subsequent state of the solder. Evaluation A: Solder coating area More than 80%, B: 50% or more and less than 80% 'C: 30% or more and low-27- This paper scale applies to China National Standard (CNS) A4 specification (210X 297 mm) 1253457 A7 B7 V. DESCRIPTION OF THE INVENTION (2 present in 50%, D: less than 30%. [Welding adhesion test conditions] Welding temperature 230 ° C, 260 ° C, 290 ° C 3 2 0 ° C immersion time 2 seconds use Solder bath (Sn:Pb) 6:4 9:1 Use flux rosin JIS K5902 Level 1 No. 1 30vol ° / 〇 solvent isopropyl alcohol 7Gvg1% (Please read the back of the note before you fill out this page) • Install · [Solder heat resistance of capacitor] After measuring the giant capacitor immersed in the solder bath for 10 seconds Capacity change rate: solder bath temperature: 23 CTC, 26 (TC, 29 CTC. [Heat-resistant heat-resistance of capacitor] The tantalum capacitor was placed in a hot-dip tester, and the characteristics of the capacitor were taken out after 1 000 cycles. The hot-pressing condition was -5 (TC to 80 ° C. Namely, after standing in a tank at -50 ° C for 30 minutes, it was placed in a tank of 80 ° C for 3 minutes within 3 minutes, and then transferred into a tank of -50 ° C in 3 minutes, which was regarded as 1 cycle. <Synthesis Example 1 of Thermoplastic Resin (B1)&gt; The diamine was dissolved in BAPP (2,2-bis[4-(4-aminophenoxy)phenyl]propane) 100 g (0.24 mol) under nitrogen. N-methyl-2-pyrrolidone in a 1 liter four-necked flask equipped with a thermometer, a stirrer, a nitrogen inlet tube and a cooling tube. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇X29&lt;7厘) ~~ The Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives printed 1253457 Ministry of Economic Affairs Intellectual Property Bureau employees consumption cooperatives printed A7 ____ B7 five, invention description (θ 4 0 0 g. Cool the resulting solution to -1 〇 ° After c, 49.5 g (0.24 mol) of isophthalic acid dichloride was added at a solution temperature of not more than 5 t, and then 56.6 g of propylene oxide was added. After stirring at room temperature for 3 hours, the reaction liquid was poured into pure. The polymer is separated in water, dried and then dissolved in N-methyl-2-pyrrolidone, and then the resulting solution is poured into pure water to purify the polyamine polymer. <Chemical Resin (B1) Synthesis Example 2&gt;®Hot under 'will-^ female 2' 2 -bis[4-(4-aminophenoxy)phenyl]propyl) 205g (500 millimolar) In equipped with a thermometer, a stirrer, a nitrogen inlet tube and a cooling tube within three-liter four-mouth diethylene glycol dimethyl ether η 17 7g. After the resulting solution was cooled to -10 ° C, 105.3 g of trimellitic anhydride monochloride was added at a solution temperature not exceeding _ 5 ° C, and then 87 g of propylene oxide was added. After stirring at room temperature for 3 hours, the viscosity of the reaction liquid was raised to obtain a transparent liquid, and then 841 g of diethyl dimethyl ether dimethyl ether was added thereto, followed by stirring for 1 hour. Thereafter, acetic anhydride I28 g and pyridine pyridine 64 g were added, and stirring was continued at 60 ° C for a day and night. The obtained reaction liquid was poured into 250 g of methanol to separate the polyamidoximine, and after drying, it was dissolved in n,N-dimethylformamide, and then it was put into methanol to obtain a polyamidoximine polymer. The product. &lt;Synthesis Example 1 of Thermoplastic Resin (B2)&gt; Under a nitrogen gas, 2,2-bis[4-(4-aminophenoxy)phenyl]propane 6 5.6 g (160 mmol) was used for the diamine. The general formula (V) shows a diamine oxirane (manufactured by Shin-Etsu Chemical Co., Ltd., X-22-161B; - (v), m = 38, Y, -C3H6-, Y, -CH3) 64g (40 millimoles) (Morby is 80% by mole / 20 (please read the back note first and then fill out this page) This paper size applies to the Chinese National Standard (CNS) A4 specification (21〇X297 mm) 29- 1253457 Α7 Β7 5. Inventive Note (27) Mohr was dissolved in 3,5 g of diethylene glycol dimethyl ether in a four-necked flask equipped with a thermometer, a stirrer, a nitrogen introduction tube, and a cooling tube. (Please read the precautions on the back and fill out this page.) After cooling the solution to -10 ° C, do not exceed _5t: γ at the solution temperature and add 40.6g (200 millimoles) of isophthalic acid dichloride. Further, 23.2 g of propylene oxide was added, and then 96 g of diethylene glycol dimethyl ether was added thereto, and the mixture was stirred at room temperature for 3 hours, and then the reaction liquid was poured into methanol to separate the polymer, and then dissolved in dimethyl after drying. The carbamide is then added to methanol to refine the polyamine polyoxyalkylene copolymer. &lt;Synthesis Example 2 of Thermoplastic Resin (B2)&gt; 174.3 g (425 mmol) of 2,2-bis[4-(4-aminophenoxy)phenyl]propene was used as the diamine under nitrogen. Diaminopropyltetramethyldioxane 18.6§ (manufactured by Shin-Etsu Chemical Co., Ltd., LP7 1 00) (75 millimoles) (85 molars per mole ratio / 15 moles) dissolved in preparation There were 1177 g of diethylene glycol dimethyl ether in a four-necked flask of a thermometer, a stirrer, a nitrogen introduction tube, and a cooling tube. Printing by the Intellectual Property Office of the Ministry of Economic Affairs, the Consumer Cooperatives, after cooling the obtained solution to -10 °C, adding 105.3 g (500 mmol) of trimellitic anhydride monochloride at a solution temperature not exceeding -5 °C, and then adding the ring. Oxypropane 87g. After stirring at room temperature for 3 hours, the viscosity of the reaction liquid was increased to form a transparent liquid, and then 84 g of diethylene glycol dimethyl ether was added. After stirring for 1 hour, 128 g of acetic anhydride and 64 g of pyridine were added, and the mixture was stirred at 6 (TC) for a day and night. The obtained reaction liquid was poured into a large amount of a mixed solvent of η-hexane/methanol = 1/1 (weight ratio) to obtain a polymer. After separation, after drying, it is redissolved in hydrazine and hydrazine-dimethylformamide, which is then added to methanol to refine the polyamidoamine polyoxyalkylene copolymer and then dried under reduced pressure. China National Standard (CNS) Α4 Specifications (210X297 mm) -30- 1253457 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperative Printed 5, Invention Description (2芍&lt;Prepared Example of Silver-plated Copper Powder (al)&gt; Washed with dilute hydrochloric acid and pure water, the spherical copper powder with an average particle diameter of 5.1 from m (manufactured by Nippon Spray Processing Co., Ltd., trade name SFR_Cu) contains 80 g of AgCN and 75 g of NaCN per 1 liter of water. The silver plating liquid is substituted for the spherical copper powder by a silver content of 15% by weight, and then washed with water and dried to obtain a silver-plated copper powder. The obtained silver-plated copper powder is 7550 g and the oxidation pin ball having a diameter of 5 mm is 3 kg. Put into a 2 liter ball mill container, after 40 minutes of rotation, the average aspect ratio is 1.3 and the long diameter average Silver-plated copper powder with a diameter of 5.5//m. &lt;Preparation of silver-plated copper powder (a2)&gt; Spherical copper with an average particle diameter of 5.1 // m obtained by spraying with dilute hydrochloric acid and pure water After the powder (manufactured by Nippon Spray Processing Co., Ltd., trade name: SFR_Cu), the spherical copper powder is replaced with 20% by weight of silver in an amount of 20% by weight of AgCN, and the amount of silver is 20% by weight per 1 liter of water. The silver-plated copper powder was obtained by adding 750 g of the obtained silver-plated copper powder and 3 kg of zirconia balls having a diameter of 5 mm into a 2-liter ball mill vessel, and after 40 minutes of rotation, a silver-plated copper powder having an average particle diameter of 8.1 // m was obtained. EMBODIMENT EXAMPLE K 1 According to the production example of the above-mentioned silver-plated copper powder (a 1 ) according to the ratio shown in Table 1 (please read the note on the back side and then fill in the page) - Pack - Order

This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) 1253457 A7 B7 V. Invention Description (Choose (please read the back note first and then fill this page) silver-plated copper powder and silver powder SF # 7 scaly zp average particle size 6.8 // m) 22.2 parts by weight of the polyamidamide polymer obtained by the synthesis of the above thermoplastic resin (B 1 ), diethylene glycol dimethyl ether 222.2 weight The varnish obtained by dissolving was dispersed by a disperser for 2 minutes to obtain a composition (paste) K. After defoaming the obtained paste, a certain amount was applied to a glass slide by screen printing (coating area: Lcmx 7.5 cm, coating thickness: 40 ± 10 0 / m), and drying in a batch drying oven at 180 ° C for 1 hour to obtain a dried coating film. The volume resistivity and migration characteristics of the obtained dried coating film were measured. The obtained paste was used to make a giant capacitor, and then the equivalent in-line resistance and leakage current were measured, and the edge wrapping property was evaluated. Example K2 The spherical copper powder obtained by the spray method had an average particle diameter of 5.9 // m, and was silver plated. The copper powder has an aspect ratio of 1.5 and an average particle size of 6.7. // m, other than the same embodiment K 1. Example K3 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed in addition to the spray method of the spherical copper powder average particle size of 5.9 / m, ball mill turnaround time For 60 minutes, the silver-plated copper powder has an aspect ratio of 2.5 and an average particle diameter of 8.0 // m, and the same as in the example K 1. Example K4 The average particle diameter of the spherical copper powder obtained by the spray method For 4.2 // m, the ball mill has a turnaround time of 1 20 minutes, the silver-plated copper powder has an aspect ratio of 12 and a flat paper scale for the Chinese National Standard (CNS) A4 specification (210X297 mm) -32- 1253457 A7 B7 V. Inventive Note (39 The average particle size is 7.2 // m, other examples are the same as in Example 1. (Please read the back note first and then fill in this page) Example K5 In addition to the spherical copper produced by the spray method The average particle size of the powder is 3.5 mM, the rotation time of the ball mill is 180 minutes, the aspect ratio of the silver-plated copper powder is 20, and the average particle diameter is 6.2 // m, and the other embodiment K 1 is implemented. Example K6 The spherical copper powder prepared by the spray method has an average particle diameter of 0.1 // m, and the silver-plated copper powder has an aspect ratio of 3.2 and The average particle size of the spherical copper powder prepared by the spray method is 〇. 6 // m, the length and width of the ore silver copper powder, except that the average particle diameter is 0.2//m. The ratio is 3 and the average particle size is 1.0 // m, and the other is the same as the embodiment K 1. Example K8 The Ministry of Economic Affairs Intellectual Property Office employee consumption cooperative prints the average particle size of the spherical copper powder obtained by the spray method. 1 . 〇# m ' The silver-plated copper powder has an aspect ratio of 3.1 and an average particle diameter of 1.5 megameters, and the other embodiment K 1 . Example K9 The average particle size of the spherical copper powder prepared by the spray method is 5. 5 # m ' -33- The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1253457 A7 B7 Ministry of Economy Intellectual Property Bureau employee consumption cooperative printing 5, invention description (31) silver-plated copper powder aspect ratio of 3.1 and average particle size of 8.0 / m, the same as the embodiment K 1 . Example K 1 0 The spherical copper powder obtained by the spray method has an average particle diameter of 8.2 // m, and the silver-plated copper powder has an aspect ratio of 3.2 and an average particle diameter of 12 @ m. Example K1. Example K 1 1 The spherical copper powder obtained by the spray method has an average particle diameter of 1 3.6 // m, the silver-plated copper powder has an aspect ratio of 3.0 and an average particle diameter of 2 0 // m, and the like. Same as Example κ 1. Example κ 1 2 The spherical copper powder prepared by the spray method has an average particle diameter of 4.6 // m, the silver substitution amount to the spherical copper powder is 0.5% by weight, and the silver-plated copper powder has an aspect ratio of 3 5 and the average particle size is 6,7 #:^, other examples are the same as Κ 1. Example K13 The spherical copper powder obtained by the spray method has an average particle diameter of 3.8 // m, the silver substitution amount to the spherical copper powder is 1.Q% by weight, and the silver-plated copper powder has an aspect ratio of 3 1 and the same as the average particle diameter of 5.3 v, other examples κ 1. Example K14 (Please read the note on the back and then fill out this page) Packing · This paper scale applies to China National Standard (CNS) M specification (2丨(1)97公羡-34- 1253457 A7 B7 V. Invention Description (Please Read the note on the back and fill in this page. The average particle size of the spherical copper powder prepared by the spray method is 3 6 # m, and the silver substitution amount of the spherical copper powder is 1.5% by weight. The aspect ratio is 3.5 and the average particle diameter is 5.2 // m, and other examples are the same as κ 1. Example K 1 5 The spherical copper powder obtained by the spray method has an average particle diameter of 4.3 #m, The substitution amount of silver for the spherical copper powder is 25% by weight, the aspect ratio of the silver-plated copper powder is 3, 4, and the average particle diameter is 6.2 //, and other examples are the same as κ 1. Example κ 1 6 The spherical copper powder obtained by the spray method has an average particle diameter of 5. 〇# m, the substitution amount of silver for the spherical copper powder is 35 wt%, and the aspect ratio of the silver-plated copper powder is 3.8 and average. The particle size is 7.5 // m, and the other is the same as the embodiment K 1. Example Κ 1 7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative prints spherical copper powder prepared by spray method The average particle diameter was 4.7 #m, the substitution amount of silver for the spherical copper powder was 50% by weight, the aspect ratio of the silver-plated copper powder was 4. 〇 and the average particle diameter was 7.1 v❿, and the same as in the example K1. Example 8 1 8 The spherical copper powder obtained by the spray method has an average particle diameter of 5.9 // m, the silver substitution amount for the spherical copper powder is 20% by weight, and the silver-plated copper powder has an aspect ratio of 2.5 and The average particle size is 8.0# m, and the shape of silver powder (Teli Chemical TCG-1) is spherical and the average particle size is 2.0 // m. Others are the same as in the example Κ 1. The paper scale applies to the Chinese National Standard (CNS). A4 size (210X297 mm) -35- 1253457 A7 Γ--s - JL7_ V. Description of invention (3 present embodiment κ 1 9 (please read the note on the back and then fill out this page) In addition to the spray method The average particle size of the spherical copper powder is 5.9 # m, the substitution amount of silver for the spherical copper powder is 2% by weight, the aspect ratio of the silver-plated copper powder is 2 · 5 and the average particle diameter is 8. 〇β In addition, the other examples are the same as κ 1. Example K20 The spherical copper powder prepared by the spray method has an average particle diameter of 5.9 # m, and the silver substitution amount to the spherical copper powder is 2% by weight. The silver-plated copper powder has an aspect ratio of 2.5 and an average particle diameter of 8. 〇#❿, other examples κ 1. Example K21 The average particle diameter of the spherical copper powder prepared by the spray method is 5.9 / / m, the silver substitution amount of the spherical copper powder is 20% by weight, the aspect ratio of the ore silver copper powder is 2.5, and the average particle diameter is 8,0 // m, and the same as the embodiment K 1. Example K22 The Ministry of Economic Affairs' Intellectual Property Office employee consumption cooperative printed the spherical copper powder prepared by the spray method with an average particle size of 5.9 // m, and the spherical copper powder with a silver substitution of 2% by weight, silver-plated copper powder. The aspect ratio was 2.5 and the average particle diameter was 8. 〇//111, which was the same as in Example 5:1. Example K23 The spherical copper powder prepared by the spray method has an average particle diameter of 5.9 // m, and the silver substitution amount of the spherical copper powder is 20% by weight, and the aspect ratio of the silver-plated copper powder is the paper scale. Applicable to China National Standard (CNS) A4 specification (210X297 mm) -36- 1253457 A7 B7 V. Description of invention (2.5 and average particle size is 8. 〇em, other with the same embodiment K 1. Example K24 Read the note on the back and fill in this page. The average particle size of the spherical copper powder prepared by the spray method is 5.9 # m, and the silver substitution amount of the spherical copper powder is 20% by weight. The broad ratio was 2.5 and the average particle diameter was 8. 〇# ;^, otherwise the same as Example K 1. Example K25 The polyamidoximine polymer obtained in Synthesis Example 2 except the above thermoplastic resin (B 1 ) was used. The spherical copper powder obtained by the spray method has an average particle diameter of 5.9 // m, the silver substitution amount to the spherical copper powder is 15% by weight, and the silver-plated copper powder has an aspect ratio of 2.5 and an average particle diameter. The same as Example 8.0 except that it was 8.0 / / m. Example K26 Polyamine obtained by the synthesis example 2 of the above thermoplastic resin (B1) The yttrium imine polymer, the spherical copper powder prepared by the spray method has an average particle diameter of 4.4/m, the silver substitution amount to the spherical copper powder is 15% by weight, and the silver-plated copper powder has an aspect ratio of 3.2. And the average particle size is 6.5 // m, other examples are the same as the K1 ° Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing comparison example K 1 The average particle size of the spherical copper powder obtained by the spray method is 13.8 # m The substitution amount of silver for the spherical copper powder is 15% by weight, the rotation time of the ball mill is 240 minutes, the aspect ratio of the silver-plated copper powder is 25, and the average particle diameter is 26 #1, which is the same as the embodiment K1. The paper scale applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) _ 1253457 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 ____ B7 V. Invention description (3 bow comparison example K2 In addition to using the above thermoplastic resin (B 1 The polyamidoximine polymer obtained in Synthesis Example 2, the spherical copper powder obtained by the spray method has an average particle diameter of 1 3.8 // m, and the silver substitution amount to the spherical copper powder is 15 weight. %, the ball mill has a rotation time of 240 minutes, and the silver-plated copper powder has an aspect ratio of 25 and an average particle diameter. The same as Example K1 except for 26 / / m. Comparative Example K3 The same as Example K1 except that the spherical copper powder (Mitsui metal ore with MFP 11 10 average particle diameter 1.1 A m ) was substituted for the silver-plated copper powder. Comparative Example K4 was the same as Example K1 except that no silver powder was contained. Comparative Example K5 was the same as Example K1 except that silver-plated copper powder was not contained. The results obtained are shown in Table K1 and Table K2. Silver-copper powder (a2) silver-plated copper powder obtained in the production example (copper exposed area: 20%) 118.8 parts by weight and silver powder (SF #7 scaly average particle size 6.8 // m manufactured by Cousteau) 79.2 parts by weight To the 2.2 parts by weight of the polyamine polymer 2 obtained in Synthesis Example 1 of the thermoplastic resin (B 1 ), two are added (please read the back of the back sheet and fill in this page) ---------I ! -- In 111- ; ---binding

This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) -38 - 1253457 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed A7 ____ B7 V. Invention description (3 present ethylene glycol dimethyl ether 2 22.2 The lacquer obtained by dissolving in a weight fraction was dispersed in a dispersing machine for 20 minutes to obtain a composition (paste) L having a viscosity of 2000 mPa·s. After the obtained paste was defoamed, a certain amount was applied to the glass by a screen printing method. On-chip (coating area: lcm x 7.5 cm, coating thickness: 40 ± 10 / zm), and drying in a batch drying oven at 180 ° C for 1 hour to obtain a dried coating film. The volume resistivity of the obtained dried coating film was measured. In order to determine the change of the viscosity of the paste over time, a part of the paste was transferred into a 500 ml poly vessel, placed in a high temperature bath at 30 ° C, and the viscosity was measured again after 6 months to calculate the rate of change. Solder joints. In addition, the paste was used as the cathode to make the heat resistance of the group. The example L2 The ball mill rotation time was 60 minutes except for the silver-plated copper powder. The copper exposed area is 30%, and its The same as Example L1. Example L3 The same as Example L1 except that the silver substitution amount in the production of the silver-plated copper powder was 15% by weight, and the copper exposed area of the obtained silver-plated copper powder was 40%. Except for the silver ball-making copper powder, the ball mill rotation time is 80 minutes, and the copper exposed area of the obtained silver-plated copper powder is 60%. Others are the same as the embodiment L3. Example L5 (Please read the back note first and then fill in the page) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -39- 1253457 Α7 Β7 5. Inventive Note (3) Polyimine oxime obtained in Synthesis Example 2 except the above thermoplastic resin (B 1 ) In addition to the imine polymer, the same as the same example L2. (Please read the back note first and then fill out this page) Comparative Example L 1 In addition to the silver-plated copper powder, the silver substitution amount is 3 〇 by weight, the ball mill turning time For 20 minutes, the copper exposed area of the obtained silver-plated copper powder was 0%, and the same as in the same example L 1. Comparative Example L 2 except that silver-plated copper powder was not used, and the amount of silver powder was 198 parts by weight, the same as in the same example L 1. The comparative example is prepared by the spray method. The spherical copper powder replaces the silver-plated copper powder, and the other is the same as the embodiment L 1. The above results are shown in Table L 1. Example Μ 1 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printed silver-plated copper powder (a 1 (1) 8.8 parts by weight of silver-plated copper powder and silver powder (SF# 7 scaly average particle diameter 6.8/m) obtained by the production example, 79.2 parts by weight, and a synthetic example of the thermoplastic resin (B2) 1 2 parts by weight of the obtained polyamidamine polyoxyalkylene copolymer was added to a enamel paint obtained by dissolving 222.2 parts by weight of diethylene glycol dimethyl ether, and dispersed for 20 minutes in a dispersing machine to obtain a viscosity of 2000 mPa·s. Composition (paste) Μ. After degassing the obtained cream '-40- This paper scale is applicable to China National Standard (CNS) Α4 specification (210Χ297 mm) 1253457 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing 5, invention description (No. 3 using the screen version) A certain amount of the coating method was applied to a glass slide (coating area: lcmx 7.5 cm, coating thickness: 40 soil 10 // m), and dried in a batch drying oven at 180 ° C for 1 hour to obtain a dried coating film. The volume resistivity of the obtained dried coating film was measured, and the obtained film was used to prepare a sample for measuring the strength of the coating film, and the film strength was measured. Further, a giant capacitor (4 V constant voltage) was prepared using the paste as a cathode, and the test was started. Capacitor characteristics, and confirming the damage of the capacitor. Example M2 The ball mill rotation time was 80 minutes except for the production of the ore-copper copper powder. The aspect ratio of the obtained silver-plated copper powder was 6.8, and the same as in the example M1. In addition to the silver-plated copper powder, the ball mill rotation time is 1 20 minutes' The obtained silver-plated copper powder has an aspect ratio of 12, and the same as in the same embodiment M1. Example M4 except for the production of silver-plated copper powder The mill rotation time was 150 minutes, and the obtained silver-plated copper powder had an aspect ratio of 19.3, which was the same as in Example M1. Examples of the polyamidoximine obtained by the synthesis of the above thermoplastic resin (B2) In addition to the alkane copolymer, the same as the same example M2. (Please read the back note first and then fill out this page) - Pack.

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This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) 1253457 Α7 Β7 V. Invention description (3 bow comparison example Μ 1 In addition to making silver-plated copper powder, the ball mill rotation time is 18 〇 minutes, the resulting plating The aspect ratio of the silver-copper powder is 2 3 . In addition, the same as in the example Μ 1. (Please read the note on the back side and then fill out this page) Comparative Example M2 In addition to the synthesis example using the above thermoplastic resin (Β 1 ) The obtained polyamine polymer was substituted for the polyamine polyoxalate copolymer, and the other example M2 〇 Comparative Example Μ 3 except for the silver-plated copper powder replaced by the silver powder having an aspect ratio of 3.5, the same example Μ 1. Comparative Example 4 except that silver-plated copper powder was replaced by copper powder of aspect ratio 1, the same example

Ml. Comparative Example M5 Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the Consumers' Cooperative, in addition to epoxy resin (Mitsui Chemical Co., Ltd., trade name 140C), 60 parts by weight, aliphatic diglycidyl ether (asahi Chemical Industry Co., Ltd., commodity ED-5 03 ) 40 parts by weight, 2P4MHZ (Shikoku Chemical Co., Ltd., azolidine) 3 parts by weight and diamine diamine (Wako Pure Chemical Industries Co., Ltd.) 3 parts by weight of substituted polyamine polyfluorene Other than the oxyalkylene copolymer, the same as in the example M2. The results obtained are shown in Table 1. -42 - This paper size is applicable to China National Standard (CNS) Α4 specification (21〇&gt;&lt;297 mm) 1253457 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperative Printed V. Invention Description (Example N 1 Silver-plated copper powder (a2) silver-plated copper powder (copper exposed area of 30%) 1 1S. 8 parts by weight and silver powder (SF #7 scaly average particle size 6.8 // m made by Cousteau) 79.2 parts by weight of a phthalocyanine obtained by dissolving 222.2 parts by weight of diethylene glycol dimethyl ether added to 22.2 parts by weight of the polyamidamine polyoxyalkylene copolymer obtained in Synthesis Example 1 of the above thermoplastic resin (B2). After dispersing for 20 minutes in a dispersing machine, a composition (paste) N having a viscosity of 2000 mPa·s was obtained. After defoaming the obtained paste, a certain amount was applied to a glass slide by screen printing (coating area: lcmx 7.5 cm, coating) Thickness: 40 ± 10 / / m), and then dried in a batch drying oven at 180 ° C for 1 hour to obtain a dried coating film. The volume resistivity of the obtained dried coating film was measured. Further, the flexibility of the obtained paste was measured. The paste composition is a cathode for making a giant capacitor, and then measuring the thermal flushing property. Leakage current (LC ) of the capacitor after the test. Example N2 The same procedure as in Example N 1 except that the polyamidoximine polyoxyalkylene copolymer obtained in Synthesis Example 2 of the thermoplastic resin (B2) was used. N3 In addition to the polyamidoximine polyoxyalkylene copolymer obtained in Synthesis Example 2 of the thermoplastic resin (B2), the silver substitution amount in the production of the silver-plated copper powder was 15% by weight, and the rotation time of the ball mill was 80 minutes. The copper exposed copper powder has an exposed area of 50%, and the other is the same as the embodiment N1. (Please read the back note first and then fill in the page) - Install _

This paper scale applies to Chinese National Standard (CNS) A4 specification (2丨0'〆297 mm) -43- 1253457 A7 B7 V. Invention description (41) Comparative example N 1 (Please read the notes on the back and fill in the form) Page) The silver substitution amount was 30% by weight in the preparation of the silver-plated copper powder. The turning time of the ball mill was 20 minutes, and the copper exposed area of the obtained silver-plated copper powder was 〇%. Comparative Example N2 40 parts by weight of an epoxy resin (manufactured by Mitsui Chemicals Co., Ltd., trade name: 140C), 40 parts by weight of an aliphatic diglycidyl ether (manufactured by Asahi Kasei Co., Ltd., trade name: ED-5 03), 2P4MHZ (manufactured by Shikoku Kasei Co., Ltd., azole) 3 parts by weight and diamine diamine (Wako Pure Chemical Industries, Ltd.) 3 parts by weight of a substituted polyamine polyoxyalkylene copolymer, other examples N1. The results obtained are shown in Table N1. The application disclosed in this specification, with the special wishes of 2001-3 22 320, which were applied for on October 19, 2001, and the special wishes of the company, No. 200 1-322321, applied on October 19, 2001, and October 31, 2001. It is related to the subject matter described in Japanese Patent Application No. 2001-333650, the entire disclosure of which is hereby incorporated by reference. Printed by the Ministry of Economic Affairs, Intellectual Property Office, Employees' Consumer Cooperatives In addition to the above, the above embodiments may be modified or modified without departing from the novel and advantageous features of the present invention. Therefore, the scope of the application includes all amendments and changes. This paper scale applies to China National Standard (CNS) A4 specification (210 X 297 mm) -44- 1253457 A7 B7 V. Invention Description (叼 K1] Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed Table Silver Plated Copper Powder aspect ratio silver-plated copper powder (parts by weight) Silver powder (parts by weight) Resin (parts by weight) Organic solvent (parts by weight) Example K1 1.3 100 100 22.2 222.2 Example K2 1.5 100 100 22.2 222.2 Example K3 2.5 100 100 22.2 222.2 Example K4 12 100 100 22.2 222.2 Example K5 20 100 100 22.2 222.2 Example K6 3.2 100 100 22.2 222.2 Example K7 3 100 100 22.2 222.2 Example K8 3.1 100 100 22.2 222.2 Example K9 3.1 100 100 22.2 222.2 Example K10 3.2 100 100 22.2 222.2 Example K11 3 100 100 22.2 222.2 Example K12 3.5 100 100 22.2 222.2 Example K13 3.1 100 100 22.2 222.2 Example K14 3.5 100 100 22.2 222.2 Example K15 3.4 100 100 22.2 222.2 Example K16 3.8 100 100 22.2 222.2 Example K17 4 100 100 22.2 222.2 Example K18 2.5 100 100 22.2 222.2 Example K19 2.5 100 25 13.8 222.2 Example K20 2.5 100 42.8 15.9 222.2 Example K21 2.5 100 66.6 18.5 222.2 Example K22 2.5 100 150 27.8 222.2 Example K23 2.5 100 233.3 37 222.2 Example K24 2.5 100 400 55.6 222.2 Example K25 2.5 100 100 22.2 222.2 Example K26 3.2 100 100 22.2 222.2 Comparative Example K1 25 100 100 22.2 222.2 Comparative Example K2 25 100 100 22.2 222.2 Comparative Example K3 1 (copper powder) 1 (copper powder) 100 22.2 222.2 Comparative Example K4 1.3 200 0 22.2 222.2 Comparative Example K5 - 0 200 22.2 222.2 This paper scale applies to Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the notes on the back and fill out this page) -45- 1253457

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(Please read the notes on the back and fill out this page) • Install · Book 1253457 A7 B7 V. Invention Description (4 Printed by the Intellectual Property Office of the Ministry of Economic Affairs, Employees' Consumption Cooperatives [η撇] Prepared Polyamide Polyamine Polyamide Amine Polyamide Polyamide Amidoxime Polyamide Polyamide Polyamine S — 嘈 歌 song and ^ i η _ 坳娣 If you know 290 °C rH τ—Η CO r—i CN1 〇〇260 ° C ι &lt; r-Ή CNl uo τ—Η 〇CSI CSI rH r—Η τ—Η rH 〇〇welding adhesion ____________ 320 °C pq PQ PQ o PQ 1 1 Q 290 °C PQ PQ PQ PQ PQ 1 1 Q 260 °C PQ C &lt; PQ &lt; U 1 Q 230 °C &lt;&lt;&lt;&lt; PQ &lt; UQ Volume resistivity (Ω · cm) 3.5x10—5 4.5xl0—5 5.1χ10&quot;5 5.5xl0&quot ;5 4.7χ10&quot;5 2.5χ10—5 2.1χ10&quot;5 1 8.2x10-4 Paste stability viscosity increase rate (%) Bu Bu Bu Bu copper exposed area (%) ο 〇 Only copper powder 〇Η Implementation Example LI Example L2 Example L3 Example L4 Example L5 Comparative Example L1 Comparative Example L2 Comparative Example L3

Ffil—V (Please read the note on the back and fill out this page) -Installation · The size of the paper is applicable to the Chinese National Standard (CNS) Α4 specification (210'乂297 mm) - 47- 1253457 A7 B7 Ministry of Economics Intellectual Property Bureau employee consumption cooperative printing 5, invention description (岣τ—Η o ο 〇〇〇Cvl CO VD oo inch&gt; o ο 〇〇〇T—Η y~i cn inch ® £ ® I ijiiml IvP \ &lt; o ο 〇〇〇τΗΗ rΗΗ CNl CO 〇〇o ο 〇〇〇Ο Ο o τ—Η cn ss I® pr &gt; o ο 〇〇〇ο Ο o Ο 〇oo CN1 cn 〇 U UO CNl Cvl On οό § uS Ό CO CO VO 〇6 劁z if wing g UTi U&quot;i U&quot;&gt; ITi to inch 1 o 1 ο 1 ο 1 〇1 〇1 ο 1 ο 1 o 1 ο 1 〇If · XX r —Η X τ—Η X Η X Η X r—Η X rH X τ—Η X ▼.....i X 驷am igpn inch ΟΟ CO oo 〇4 οα r—( CO oo uo ΟΟ 00 1 Saki CSI 'sd CNl 〇6 击打打馨 € crocodile sniper €€ Φ 迦加crx? Secret 秘秘秘秘秘秘 m Secret Μ 狴m 狴 洒 洒 w w CN 〇〇 On 〇〇CO CNI 〇〇£ S _ 1/Ί 鹪Ur&gt; CO T—Η r—Η CN1 cn inch 1—Η CN| CO inch un s S Γ—! -Η 孽 孽 孽 孽 孽 闺镒镒镒镒镒 ⁄ ⁄ U U U U U U U U λ λ λ λ J J J J J Read the notes on the back and fill out this page.) The paper size is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ 297 mm).

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7 B 49 V. INSTRUCTIONS (The Ministry of Economic Affairs, Intellectual Property Office, Staff and Consumers Cooperative, Printed Giant Capacitor, Thermal Crush Test LC(pA) 30(8) Cycle 10 or less 10 or less 10 or less 8 CO 5000 2000 Cycle 10 or less 10 or less 10 or less Τ-Η 1000 1000 cycles 10 or less 10 or less 10 or less 〇Flexibility test 10,000 times or more 10,000 times or more 1 time or more 10,000 times or more cn Volume resistivity 〇• G 4.0χ10'5 4.3χ10'5 6·2χ10·5 2.0 Χ10'5 ι.Οχίσ4 Resin Polyamine Polyoxyalkylene Copolymer Polyamidimide Polyoxane Copolymer Polyamidoquinone Polyoxane Copolymer Polyamine Polyoxane Copolymer Ring Oxygen resin copper exposed area 〇 Example N1 Example N2 Example Ν 3 Comparative Example 比较 1 Comparative Example Ν 2 (Please read the back note and then fill out this page)

LP Packing. The standard paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -49- 1253457 A7 B7 V. Description of the Invention (Simplified illustration of Figure 1 is an embodiment of the electronic component of the present invention. A schematic cross-sectional view of an example of a solid electrolytic capacitor. Main component comparison table 1 anode wire 2 anode substrate 3 dielectric oxide film 4 solid electrolyte layer 5 cathode layer 6 conductive adhesive 7 wire frame 8 exterior resin 10 solid electrolytic capacitor 51 carbon layer 52 Conductor layer (please read the precautions on the back and fill out this page) Packing · Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed Paper Size Applicable to China National Standard (CNS) A4 Specification (210X297 mm) -50-

Claims (1)

VI. Application for Patent Scope 91] 24 1 02 Patent Application Revision of Chinese Patent Application Scope Amendment of the Republic of China 93 Years] January 12 Revision 1. A conductive resin composition containing an aspect ratio] to 20 a silver-plated copper powder (a 1 ) and a conductive powder (A 1 ) of silver powder, and a thermoplastic resin having a functional group selected from the group consisting of a mercapto group, an ester group, a quinone imine group, and an ether group ( B 1 ), and an organic solvent (C). 2. A conductive resin composition comprising a conductive powder (A2) containing a silver-plated copper powder (a2) having a copper exposed portion on a surface thereof, and a silver powder, and having a mercapto group, an ester group, and a ruthenium group A thermoplastic resin (B 1 ) having one or more functional groups selected from the group consisting of an amine group and an ether group, and an organic solvent (C). 3. The conductive resin composition according to claim 1 or 2, wherein the thermoplastic resin (B 1 ) is a polyphenylene ether oxime, a polyphenylene phenyl sulfoxide, a polyphenylene ether Amidoxime, polyphenyleneamine, polyphenyleneimine, polyphenylene phthalimide, polyphthalene decylamine, polyphenylene quinone imine, and polyphenylene Selected from the group of dimethyl amidoxime imines. 4. The conductive resin composition according to claim 1 or 2, wherein the thermoplastic resin (B 1 ) has the following general formula (I): I^-- (Read the first note on the back and fill in the form) Page) *11 r line (In the formula: R], R2, R3 and IT are each independently hydrogen, lower alkyl, lower alkane. The paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) 1253457 A8 B8 C8 D8 VI. Application Patent range oxy or halogen atom; X 噫 single bond C 〇 -, -S 〇 2, _S 〇 - H \ / H or Rd I - Ο 甴 甴 6, wherein R 5 and R 6 are each independently hydrogen, lower alkyl Or phenyl; Y is fluoromethylchloromethyl-NH-C-Ar-C-ΝΗ--NH-C-II 〇〇II cΛ^, N-C II 〇 or 〇〇II丨丨cc/\/ 3\ -N Ar'3 N-\/\/ cc II II 〇〇 (please read the first note on the back of the page and fill in this page) - install -------- order --- where Ar1 is Aromatic 2-valent group; Ar2 is an aromatic trivalent group; Ar3 is an aromatic 4-valent group) •• Repeated units shown by the line, and the following general formula (II): (9) (wherein R7, Rs&amp; R9 are each independently a lower alkyl group, a lower alkoxy group or a halogen atom; and s, t and u are each independently an integer representing from the number of substituents to 4; and R7, Rs and R9 each have When multiple keys are used, they may be the same or different; X 2 and X 3 are applicable to China National Standard (CNS) A4 specification (2]0Χ297 mm) 1253457 A8 B8 C8 D8 RIC-R ", patent application scope Each is independently -0- or Wherein 1^° and 11]1 are each independently a hydrogen atom, a lower alkyl group, a trifluoromethyl group, a trichloromethyl group or a phenyl group; Y is at least as defined in the above general formula (I) One of the resins. 5. A conductive resin composition comprising a conductive powder (A 1 ) comprising silver-plated copper powder (a 1 ) having an aspect ratio of 1 to 20 and silver powder, and polyamine polyoxyl resin, poly The thermoplastic resin (B2) selected from the group consisting of amidoxime polyoxyl resin and a polyamidene polyoxyl resin group, and an organic solvent (C). 6. A conductive resin composition comprising a conductive powder (A 2 ) comprising a silver-plated copper powder (a 2 ) having a copper exposed portion on a surface thereof, and a silver powder, and a polyamine polyoxyl resin, a poly The thermoplastic resin (B2) selected from the group consisting of amidoxime polyoxyl resin and a polyamidene polyoxyl resin group, and an organic solvent (C). 7. The conductive resin composition according to claim 2 or 6, wherein the silver-plated copper powder (a2) has an exposed area of copper of 10 to 70%. 8. A giant electrolytic capacitor which is formed on an anode substrate formed by a giant body to form a conductive film containing a giant oxide film, a solid electrolyte layer, and using any one of the patent applications, items 2, 5 and 6. A cathode layer containing a conductor layer formed of a resin composition. ------------- ---:___. ^ -___ This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) ~ Gutter (please read the back of the note first) Matters to fill out this page) Ministry of Economic Affairs, Intellectual Property Bureau, employee consumption, itri printing