JP2815555B2 - 温度センサのサーミスタと電気導線との接合体の形成方法 - Google Patents
温度センサのサーミスタと電気導線との接合体の形成方法Info
- Publication number
- JP2815555B2 JP2815555B2 JP7188216A JP18821695A JP2815555B2 JP 2815555 B2 JP2815555 B2 JP 2815555B2 JP 7188216 A JP7188216 A JP 7188216A JP 18821695 A JP18821695 A JP 18821695A JP 2815555 B2 JP2815555 B2 JP 2815555B2
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- injection
- temperature sensor
- forming
- joined body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/22—End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4423985.8 | 1994-07-07 | ||
DE4423985A DE4423985C2 (de) | 1994-07-07 | 1994-07-07 | Verfahren zur Herstellung einer feuchtigkeitsdichten Verbindung einer elektrischen Leitung mit einem Thermistor eines Temperatursensors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0869904A JPH0869904A (ja) | 1996-03-12 |
JP2815555B2 true JP2815555B2 (ja) | 1998-10-27 |
Family
ID=6522563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7188216A Expired - Fee Related JP2815555B2 (ja) | 1994-07-07 | 1995-06-30 | 温度センサのサーミスタと電気導線との接合体の形成方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0691705B1 (zh) |
JP (1) | JP2815555B2 (zh) |
AT (1) | ATE225087T1 (zh) |
DE (2) | DE4423985C2 (zh) |
TW (1) | TW387640U (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19631376C1 (de) * | 1996-08-02 | 1997-11-20 | Siemens Matsushita Components | Verfahren zum Herstellen eines feuchtedichten Temperatursensors |
NL1004802C2 (nl) * | 1996-12-17 | 1998-06-18 | Bms Electronics B V | Werkwijze voor het vervaardigen van een stekker aan een uiteinde van een kabel alsmede een dergelijke stekker. |
DE10044460B4 (de) * | 1999-09-08 | 2008-07-31 | Tyco Electronics Amp Gmbh | Baueinheit und Verfahren zur Herstellung derselben |
DE10340551A1 (de) * | 2003-09-01 | 2005-04-14 | Siemens Ag | Sensorkopf |
DE10340636B3 (de) * | 2003-09-03 | 2005-01-13 | Epcos Ag | Verfahren zur Herstellung eines feuchtedichten Fühlers |
DE10356880B4 (de) * | 2003-12-03 | 2011-04-21 | Sontec Sensorbau Gmbh | Verfahren zur Herstellung eines flüssigkeits-, gas- und dampfdichten elektrischen und/oder optischen Bauelements |
US7128467B2 (en) | 2004-03-18 | 2006-10-31 | General Electric Company | Thermistor probe assembly and method for positioning and moisture proofing thermistor probe assembly |
DE102008029192A1 (de) | 2008-03-13 | 2009-09-24 | Epcos Ag | Fühler zum Erfassen einer physikalischen Größe und Verfahren zur Herstellung des Fühlers |
DE102012218206A1 (de) * | 2012-10-05 | 2014-04-10 | Zf Friedrichshafen Ag | Kabelverbindungs- und/oder Kabelzweigmuffe und Verfahren zur Herstellung einer Kabelverbindungs- und/oder Kabelzweigmuffe |
JP6623889B2 (ja) * | 2016-03-29 | 2019-12-25 | 三菱マテリアル株式会社 | リード線封止電子部品及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4032214A (en) * | 1976-04-21 | 1977-06-28 | Schlumberger Technology Corporation | Cable-termination assemblies and methods for manufacturing such assemblies |
DE8120039U1 (de) * | 1981-07-09 | 1982-12-16 | Robert Bosch Gmbh, 7000 Stuttgart | "Anschlußleitung für ein elektrisches Gerät" |
DE3625265A1 (de) * | 1986-07-25 | 1988-02-04 | Basf Ag | Umhuellte passive keramische bauelemente fuer die elektronik |
GB2207297B (en) * | 1987-07-11 | 1991-07-31 | Stc Plc | Encapsulated electronic components |
JPH02227624A (ja) * | 1989-02-28 | 1990-09-10 | Nippondenso Co Ltd | 温度センサ |
JPH06132335A (ja) * | 1992-10-16 | 1994-05-13 | Hitachi Cable Ltd | リードフレームインサート射出成形品の製造方法 |
JP2658772B2 (ja) * | 1992-11-16 | 1997-09-30 | 日立電線株式会社 | 温度センサの封止構造及び封止方法 |
-
1994
- 1994-07-07 DE DE4423985A patent/DE4423985C2/de not_active Expired - Fee Related
-
1995
- 1995-05-31 TW TW086208730U patent/TW387640U/zh unknown
- 1995-06-30 AT AT95110297T patent/ATE225087T1/de not_active IP Right Cessation
- 1995-06-30 JP JP7188216A patent/JP2815555B2/ja not_active Expired - Fee Related
- 1995-06-30 DE DE59510387T patent/DE59510387D1/de not_active Expired - Lifetime
- 1995-06-30 EP EP95110297A patent/EP0691705B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0869904A (ja) | 1996-03-12 |
TW387640U (en) | 2000-04-11 |
DE4423985A1 (de) | 1996-01-11 |
EP0691705B1 (de) | 2002-09-25 |
DE59510387D1 (de) | 2002-10-31 |
ATE225087T1 (de) | 2002-10-15 |
DE4423985C2 (de) | 2002-04-04 |
EP0691705A1 (de) | 1996-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |