JP2591630B2 - 集積回路を有するデータキャリア及びその製造方法及びその製造装置 - Google Patents

集積回路を有するデータキャリア及びその製造方法及びその製造装置

Info

Publication number
JP2591630B2
JP2591630B2 JP62293870A JP29387087A JP2591630B2 JP 2591630 B2 JP2591630 B2 JP 2591630B2 JP 62293870 A JP62293870 A JP 62293870A JP 29387087 A JP29387087 A JP 29387087A JP 2591630 B2 JP2591630 B2 JP 2591630B2
Authority
JP
Japan
Prior art keywords
module
film
substrate
data carrier
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62293870A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63212594A (ja
Inventor
ハーギーリ−テーラニ ヤーヤ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEE AA OO G FUYUURU AUTOMATSUIOON UNTO ORUGANIZATSUIOON MBH
Original Assignee
GEE AA OO G FUYUURU AUTOMATSUIOON UNTO ORUGANIZATSUIOON MBH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6314346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2591630(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by GEE AA OO G FUYUURU AUTOMATSUIOON UNTO ORUGANIZATSUIOON MBH filed Critical GEE AA OO G FUYUURU AUTOMATSUIOON UNTO ORUGANIZATSUIOON MBH
Publication of JPS63212594A publication Critical patent/JPS63212594A/ja
Application granted granted Critical
Publication of JP2591630B2 publication Critical patent/JP2591630B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
JP62293870A 1986-11-20 1987-11-20 集積回路を有するデータキャリア及びその製造方法及びその製造装置 Expired - Lifetime JP2591630B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863639630 DE3639630A1 (de) 1986-11-20 1986-11-20 Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
DE3639630.3 1986-11-20

Publications (2)

Publication Number Publication Date
JPS63212594A JPS63212594A (ja) 1988-09-05
JP2591630B2 true JP2591630B2 (ja) 1997-03-19

Family

ID=6314346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62293870A Expired - Lifetime JP2591630B2 (ja) 1986-11-20 1987-11-20 集積回路を有するデータキャリア及びその製造方法及びその製造装置

Country Status (7)

Country Link
US (2) US4897534A (https=)
EP (2) EP0554916B1 (https=)
JP (1) JP2591630B2 (https=)
AT (2) ATE100615T1 (https=)
DE (3) DE3639630A1 (https=)
ES (2) ES2106906T3 (https=)
HK (1) HK62395A (https=)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
GB8901189D0 (en) * 1989-01-19 1989-03-15 Avery W & T Limited Portable electronic token
GB2225283A (en) * 1988-10-07 1990-05-30 De La Rue Co Plc Laminated IC card
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
DE3912891A1 (de) * 1989-04-19 1990-11-08 Siemens Ag Montagevorrichtung zur kontaktierung und zum einbau eines integrierten schaltkreissystems fuer eine wertkarte
EP0417887B1 (en) * 1989-09-09 1995-06-14 Mitsubishi Denki Kabushiki Kaisha IC card
DE4007221A1 (de) * 1990-03-07 1991-09-12 Gao Ges Automation Org Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.
US6067062A (en) * 1990-09-05 2000-05-23 Seiko Instruments Inc. Light valve device
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
JPH07182471A (ja) * 1991-01-10 1995-07-21 Nec Corp Ｉｃカード
FR2677785A1 (fr) * 1991-06-17 1992-12-18 Philips Composants Procede de fabrication d'une carte a microcircuit.
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
DE4126874C2 (de) * 1991-08-14 1997-05-22 Orga Kartensysteme Gmbh Datenträger mit integriertem Schaltkreis
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
DE4142410C2 (de) * 1991-12-20 2000-11-09 Gao Ges Automation Org Vorrichtung zum Herstellen von flachen Kunststoff-Formstücken, beispielsweise Ausweiskarten durch Spritzgießen
HK1007815A1 (en) * 1993-03-18 1999-04-23 Nagraid S.A. Method for producing a card with at least one electronic component, and card thereby obtained
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein
US5477611A (en) * 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
DE9422424U1 (de) * 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chipkarte mit einem elektronischen Modul
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
EP0786357A4 (en) * 1994-09-22 2000-04-05 Rohm Co Ltd CONTACTLESS CHIP CARD AND METHOD FOR PRODUCING THE SAME
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
DE19502398A1 (de) * 1995-01-26 1996-08-01 Giesecke & Devrient Gmbh Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
FR2731538B1 (fr) * 1995-03-08 1997-04-11 Solaic Sa Procede pour fixer a un corps de carte electronique un module comportant un microcircuit et carte electronique comportant un module fixe selon ce procede
DE19509233A1 (de) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
FR2735257B1 (fr) * 1995-06-09 1997-08-29 Solaic Sa Carte laminee a circuit integre
FR2735284B1 (fr) * 1995-06-12 1997-08-29 Solaic Sa Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce
JP4015717B2 (ja) * 1995-06-29 2007-11-28 日立マクセル株式会社 情報担体の製造方法
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
DE19535324C1 (de) * 1995-09-22 1997-01-23 Siemens Ag Chipkarte
DE19535989C3 (de) * 1995-09-27 2003-03-27 Siemens Ag Chipmodul
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US5703350A (en) * 1995-10-31 1997-12-30 Lucent Technologies Inc. Data carriers having an integrated circuit unit
DE19541039B4 (de) * 1995-11-03 2006-03-16 Assa Abloy Identification Technology Group Ab Chip-Modul sowie Verfahren zu dessen Herstellung
FR2744270A1 (fr) * 1996-01-30 1997-08-01 Solaic Sa Carte a memoire et procede de fabrication d'une telle carte
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
FR2769130B1 (fr) * 1997-09-30 2001-06-08 Thomson Csf Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede
DE19805031C2 (de) * 1998-02-09 2002-06-13 Peter Kammer Verfahren und Vorrichtung zum Herstellen von Chipkarten
US6161761A (en) * 1998-07-09 2000-12-19 Motorola, Inc. Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly
JP2000099678A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd Ｉｃカード及びその製造方法
FR2789505B1 (fr) * 1999-02-08 2001-03-09 Gemplus Card Int Procede de fabrication de support de memorisation portable de type carte a puce
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
FR2794264B1 (fr) * 1999-05-27 2001-11-02 Gemplus Card Int Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte
FR2795203B1 (fr) * 1999-06-15 2001-08-31 Gemplus Card Int Module comportant au moins une puce et son interface de communication, objet comportant un module et procede de realisation desdits modules
DE19929912A1 (de) * 1999-06-29 2001-01-18 Orga Kartensysteme Gmbh Trägerelement für einen IC-Baustein
FR2799857A1 (fr) * 1999-10-14 2001-04-20 Gemplus Card Int Procede pour le renforcement d'un module de circuit integre de carte a puce
FI112288B (fi) 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
FI112121B (fi) * 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
FR2817832A1 (fr) * 2000-12-12 2002-06-14 Schlumberger Systems & Service Supports d'informations en forme de plaques emballes en lot, procede et installation d'emballage
EP1350233A4 (en) * 2000-12-15 2005-04-13 Electrox Corp PROCESS FOR THE PRODUCTION OF NOVEL COST-EFFECTIVE HIGH FREQUENCY IDENTIFICATION DEVICES
DE10109993A1 (de) * 2001-03-01 2002-09-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Moduls
DE10111028A1 (de) * 2001-03-07 2002-09-19 Infineon Technologies Ag Chipkartenmodul
FI117331B (fi) 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
JP2003037124A (ja) * 2001-07-24 2003-02-07 Dainippon Printing Co Ltd 半導体パッケージの製造方法
DE10145752B4 (de) * 2001-09-17 2004-09-02 Infineon Technologies Ag Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist
US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
DE10297316T5 (de) * 2001-10-09 2004-12-09 Tessera, Inc., San Jose Gestapelte Baugruppen
DE10216652A1 (de) * 2002-04-15 2003-10-23 Orga Kartensysteme Gmbh Spritzgussverfahren zur Herstellung einer Chipkarte und nach diesem Verfahren hergestellte Chipkarte
JP4194298B2 (ja) * 2002-05-17 2008-12-10 キヤノン株式会社 情報記憶媒体、ユニット、プロセスカートリッジ、現像カートリッジおよび電子写真画像形成装置
EP1376462A1 (en) * 2002-06-19 2004-01-02 SCHLUMBERGER Systèmes Method for manufacturing a tape
US20040105244A1 (en) * 2002-08-06 2004-06-03 Ilyas Mohammed Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
GB2397272B (en) * 2003-01-15 2006-11-15 Hewlett Packard Co Secure physical documents and methods and apparatus for publishing and reading them
US7712675B2 (en) * 2003-01-15 2010-05-11 Hewlett-Packard Development Company, L.P. Physical items for holding data securely, and methods and apparatus for publishing and reading them
DE10327746A1 (de) * 2003-06-18 2005-01-05 Giesecke & Devrient Gmbh Verfahren zum Fixieren einer Beschichtung auf einem Trägerband
DE10361538A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper
JP4334335B2 (ja) * 2003-12-24 2009-09-30 三洋電機株式会社 混成集積回路装置の製造方法
US20150287660A1 (en) 2007-01-05 2015-10-08 Semiconductor Energy Laboratory Co., Ltd. Laminating system, ic sheet, scroll of ic sheet, and method for manufacturing ic chip
EP1655691A1 (en) * 2004-11-08 2006-05-10 Axalto SA A smart card micro-electronic module manufacturing method
US20060232589A1 (en) * 2005-04-19 2006-10-19 Microsoft Corporation Uninterrupted execution of active animation sequences in orphaned rendering objects
KR100651563B1 (ko) * 2005-07-07 2006-11-29 삼성전기주식회사 전자부품이 내장된 배선기판의 제조방법
US8267327B2 (en) * 2007-02-17 2012-09-18 Qsecure, Inc. Payment card manufacturing technology
EP2034429A1 (en) * 2007-09-05 2009-03-11 Assa Abloy AB Manufacturing method for a card and card obtained by said method
DE102009023405A1 (de) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9358722B2 (en) 2012-09-18 2016-06-07 Assa Abloy Ab Method of protecting an electrical component in a laminate
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
FR2999753B1 (fr) * 2012-12-13 2015-02-13 Oberthur Technologies Procede de fabrication par lamination en continu de cartes a microcircuit du type a contact
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
WO2015059915A1 (ja) * 2013-10-22 2015-04-30 凸版印刷株式会社 Ｉｃモジュール及びｉｃカード、ｉｃモジュール基板
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
CN105184357B (zh) * 2015-10-09 2018-01-19 青岛融佳安全印务有限公司 一种社会保障复合卡
FR3047101B1 (fr) 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
DE102016107031B4 (de) 2016-04-15 2019-06-13 Infineon Technologies Ag Laminatpackung von Chip auf Träger und in Kavität, Anordnung diese umfassend und Verfahren zur Herstellung
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
FR3065057A1 (fr) * 2017-04-11 2018-10-12 Valeo Vision Dispositif lumineux avec contact electrique entre la glace et le boitier
WO2019045638A1 (en) * 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd INTEGRATED CIRCUIT MODULES AND INTELLIGENT CARDS INCORPORATING THEM
JP1647726S (https=) * 2018-02-01 2019-12-09
US11200386B2 (en) * 2018-09-27 2021-12-14 Apple Inc. Electronic card having an electronic interface
USD930000S1 (en) 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
JPS6056573U (ja) * 1983-09-28 1985-04-20 共同印刷株式会社 Ｉｄカ−ド
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
DE3420051A1 (de) * 1984-05-29 1985-12-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers
JPS60252992A (ja) * 1984-05-30 1985-12-13 Toshiba Corp Ｉｃカ−ド
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
CH661808A5 (fr) * 1985-01-21 1987-08-14 Lupa Finances Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique.
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
US4717438A (en) * 1986-09-29 1988-01-05 Monarch Marking Systems, Inc. Method of making tags
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben

Also Published As

Publication number Publication date
US5055913A (en) 1991-10-08
EP0554916B1 (de) 1997-08-06
US4897534A (en) 1990-01-30
DE3788856D1 (de) 1994-03-03
EP0268830A3 (en) 1989-03-08
HK62395A (en) 1995-05-05
EP0554916A2 (de) 1993-08-11
EP0554916A3 (https=) 1994-03-23
ATE156613T1 (de) 1997-08-15
ATE100615T1 (de) 1994-02-15
ES2106906T3 (es) 1997-11-16
DE3639630A1 (de) 1988-06-01
JPS63212594A (ja) 1988-09-05
EP0268830A2 (de) 1988-06-01
ES2049724T3 (es) 1994-05-01
EP0268830B1 (de) 1994-01-19
DE3752101D1 (de) 1997-09-11

Similar Documents

Publication Publication Date Title
JP2591630B2 (ja) 集積回路を有するデータキャリア及びその製造方法及びその製造装置
US4966857A (en) Data carrier having an integrated circuit and a method for producing same
US4754319A (en) IC card and method for manufacturing the same
TW571610B (en) Circuit substrate, battery set, and manufacturing method of circuit substrate
JP3238094B2 (ja) パターンを有するストリップの連続組み立て方法によって得られる集積回路マイクロモジュール
EP1104017B1 (en) Method of flip-chip mounting a semiconductor chip to a circuit board
US5081520A (en) Chip mounting substrate having an integral molded projection and conductive pattern
KR100321399B1 (ko) 반도체웨이퍼의 제조방법, 반도체칩의 제조방법 및 ｉｃ카드
CA2051836C (en) Personal data card construction
GB2209404A (en) Optical writing heads
JP4271038B2 (ja) スマートラベルウェブおよびその製造方法
UA57006C2 (uk) Модуль інтегральної схеми
CN102483812B (zh) 非接触通信媒体
KR19990076679A (ko) 비접촉식 기술에서 사용하기 위한 칩카드의 제조방법
JP5708069B2 (ja) Ｉｃ付冊子カバーの製造方法
JP4170491B2 (ja) 接触型非接触型共用ｉｃカードの製造方法
JP2006510130A (ja) ホイル積層を通じたｉｃカードの製造方法
JPH10512380A (ja) チップモジュール
JP3126782B2 (ja) 薄型半導体装置の製造方法
JP3483352B2 (ja) 非接触ｉｃカード
RU2173476C2 (ru) Модуль интегральной схемы
JPH05175201A (ja) 転写バンプ実装装置および転写バンプ実装方法
KR0152576B1 (ko) 센터 패드를 갖는 적층칩 패키지
KR930024544A (ko) 박형 반도체장치, 그것을 이용한 모듈구조체 및 그 반도체장치의 기판 실장방법
JPH0522953B2 (https=)