JPH10512380A - チップモジュール - Google Patents
チップモジュールInfo
- Publication number
- JPH10512380A JPH10512380A JP9513054A JP51305497A JPH10512380A JP H10512380 A JPH10512380 A JP H10512380A JP 9513054 A JP9513054 A JP 9513054A JP 51305497 A JP51305497 A JP 51305497A JP H10512380 A JPH10512380 A JP H10512380A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- chip module
- carrier tape
- card
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Credit Cards Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.チップカードのカード本体(7)に組み込むためのチップモジュールであ って、 ─フレキシブルなキャリヤテープ(2)が設けられており、 ─該キャリヤテープ(2)の片側の面に被着された面状の金属接点(10)が設 けられており、 ─キャリヤテープ(2)の、前記金属接点(10)とは反対の側の面に被着され た少なくとも1つの電子構成素子(3)が設けられており、該電子構成素子(3 )が金属接点(10)に電気的に接続されており、 ─キャリヤテープ(2)に設けられた所定の面を介してチップモジュールがカー ド本体(7)に結合可能である 形式のものにおいて、 電子構成素子(3)とキャリヤテープ(2)との間に断熱層が設けられている ことを特徴とする、チップカードのカード本体に組み込むためのチップモジュー ル。 2.前記断熱層(9)がポリイミドから成っている、請求項1記載のチップモ ジュール。 3.ポリイミド層が10μmの厚さを有している、請求項2記載のチップモジ ュール。 4.チップカードのカード本体(7)に組み込むためのチップモジュールであ って、 ─フレキシブルなキャリヤテープ(2)が設けられており、 ─該キャリヤテープ(2)の片側の面に被着された面状の金属接点(10)が設 けられており、 ─キャリヤテープ(2)の、前記金属接点(10)とは反対の側の面に被着され た少なくとも1つの電子構成素子(3)が設けられており、該電子構成素子(3 )が金属接点(10)に電気的に接続されており、 ─キャリヤテープ(2)に設けられた所定の面を介してチップモジュールがカー ド本体(7)に結合可能である 形式のものにおいて、 金属接点(10)の面に切欠き(11)が設けられており、該切欠き(11) が、金属接点(10)の外側範囲に環状に載置される中空ポンチ(1)から、中 央に組み付けられた電子構成素子(3)に向かう方向で流れる熱流を遮断するよ うになっていることを特徴とする、チップカードのカード本体に組み込むための チップモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19535989A DE19535989C3 (de) | 1995-09-27 | 1995-09-27 | Chipmodul |
DE19535989.5 | 1995-09-27 | ||
PCT/DE1996/001725 WO1997012341A1 (de) | 1995-09-27 | 1996-09-12 | Chipmodul |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10512380A true JPH10512380A (ja) | 1998-11-24 |
JP3199747B2 JP3199747B2 (ja) | 2001-08-20 |
Family
ID=7773352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51305497A Expired - Lifetime JP3199747B2 (ja) | 1995-09-27 | 1996-09-12 | チップモジュール |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP0852774B1 (ja) |
JP (1) | JP3199747B2 (ja) |
KR (1) | KR100438876B1 (ja) |
CN (1) | CN1153174C (ja) |
AT (1) | ATE176537T1 (ja) |
DE (2) | DE19535989C3 (ja) |
ES (1) | ES2128872T3 (ja) |
IN (1) | IN188648B (ja) |
RU (1) | RU2145732C1 (ja) |
UA (1) | UA44809C2 (ja) |
WO (1) | WO1997012341A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19602436B4 (de) * | 1996-01-24 | 2006-09-14 | Infineon Technologies Ag | Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens |
DE19731737A1 (de) * | 1997-07-23 | 1998-09-17 | Siemens Ag | Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper |
DE102005032489B3 (de) * | 2005-07-04 | 2006-11-16 | Schweizer Electronic Ag | Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren |
DE102006060411B3 (de) * | 2006-12-20 | 2008-07-10 | Infineon Technologies Ag | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
DE102007048237A1 (de) * | 2007-10-08 | 2009-04-09 | Giesecke & Devrient Gmbh | Chipmodul für Chipkarte |
DE102013106181A1 (de) * | 2013-06-13 | 2014-12-18 | Bundesdruckerei Gmbh | Chipkarte und Verfahren zum Herstellen einer Chipkarte |
CN112216622B (zh) * | 2019-07-10 | 2022-09-30 | 广东精毅科技股份有限公司 | 一种用冷胶粘贴芯片的装置及其工作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0128822B1 (fr) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2617668B1 (fr) * | 1987-07-03 | 1995-07-07 | Radiotechnique Compelec | Dispositif comportant un circuit electronique monte sur un support souple et carte souple le comprenant |
FR2626846B1 (fr) * | 1988-02-04 | 1990-06-15 | Saint Gobain Vitrage | Dispositif de manutention d'articles en feuilles |
FR2639763B1 (fr) * | 1988-11-29 | 1992-12-24 | Schlumberger Ind Sa | Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede |
FR2645680B1 (fr) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | Encapsulation de modules electroniques et procede de fabrication |
DE4232625A1 (de) * | 1992-09-29 | 1994-03-31 | Siemens Ag | Verfahren zur Montage von integrierten Halbleiterschaltkreisen |
DE4325458A1 (de) * | 1993-07-29 | 1995-02-09 | Orga Bond Technik Gmbh | Trägerelement für einen IC-Baustein |
DE4325712C2 (de) * | 1993-07-30 | 1996-03-21 | Siemens Ag | Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen |
DE4427309C2 (de) * | 1994-08-02 | 1999-12-02 | Ibm | Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
-
1995
- 1995-09-27 DE DE19535989A patent/DE19535989C3/de not_active Expired - Fee Related
-
1996
- 1996-08-27 IN IN1524CA1996 patent/IN188648B/en unknown
- 1996-09-12 JP JP51305497A patent/JP3199747B2/ja not_active Expired - Lifetime
- 1996-09-12 ES ES96929186T patent/ES2128872T3/es not_active Expired - Lifetime
- 1996-09-12 CN CNB961972394A patent/CN1153174C/zh not_active Expired - Lifetime
- 1996-09-12 KR KR10-1998-0702027A patent/KR100438876B1/ko not_active IP Right Cessation
- 1996-09-12 RU RU98107842A patent/RU2145732C1/ru not_active IP Right Cessation
- 1996-09-12 EP EP96929186A patent/EP0852774B1/de not_active Expired - Lifetime
- 1996-09-12 AT AT96929186T patent/ATE176537T1/de not_active IP Right Cessation
- 1996-09-12 WO PCT/DE1996/001725 patent/WO1997012341A1/de active IP Right Grant
- 1996-09-12 UA UA98031575A patent/UA44809C2/uk unknown
- 1996-09-12 DE DE59601281T patent/DE59601281D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
UA44809C2 (uk) | 2002-03-15 |
WO1997012341A1 (de) | 1997-04-03 |
RU2145732C1 (ru) | 2000-02-20 |
IN188648B (ja) | 2002-10-26 |
DE59601281D1 (de) | 1999-03-18 |
ATE176537T1 (de) | 1999-02-15 |
CN1198229A (zh) | 1998-11-04 |
JP3199747B2 (ja) | 2001-08-20 |
EP0852774B1 (de) | 1999-02-03 |
DE19535989C2 (de) | 1997-07-17 |
ES2128872T3 (es) | 1999-05-16 |
EP0852774A1 (de) | 1998-07-15 |
KR100438876B1 (ko) | 2004-07-16 |
DE19535989C3 (de) | 2003-03-27 |
KR19990063588A (ko) | 1999-07-26 |
CN1153174C (zh) | 2004-06-09 |
DE19535989A1 (de) | 1997-04-03 |
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