FR2789505B1 - Procede de fabrication de support de memorisation portable de type carte a puce - Google Patents

Procede de fabrication de support de memorisation portable de type carte a puce

Info

Publication number
FR2789505B1
FR2789505B1 FR9901454A FR9901454A FR2789505B1 FR 2789505 B1 FR2789505 B1 FR 2789505B1 FR 9901454 A FR9901454 A FR 9901454A FR 9901454 A FR9901454 A FR 9901454A FR 2789505 B1 FR2789505 B1 FR 2789505B1
Authority
FR
France
Prior art keywords
storage medium
smart card
portable storage
card portable
manufacturing smart
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9901454A
Other languages
English (en)
Other versions
FR2789505A1 (fr
Inventor
Philippe Patrice
Olivier Brunet
Didier Elbaz
Bernard Calvas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9901454A priority Critical patent/FR2789505B1/fr
Priority to PCT/FR2000/000151 priority patent/WO2000048250A1/fr
Priority to AU30590/00A priority patent/AU3059000A/en
Priority to CN00803573A priority patent/CN1384979A/zh
Priority to EP00900651A priority patent/EP1153432A1/fr
Publication of FR2789505A1 publication Critical patent/FR2789505A1/fr
Application granted granted Critical
Publication of FR2789505B1 publication Critical patent/FR2789505B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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FR9901454A 1999-02-08 1999-02-08 Procede de fabrication de support de memorisation portable de type carte a puce Expired - Fee Related FR2789505B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9901454A FR2789505B1 (fr) 1999-02-08 1999-02-08 Procede de fabrication de support de memorisation portable de type carte a puce
PCT/FR2000/000151 WO2000048250A1 (fr) 1999-02-08 2000-01-24 Procede de fabrication de support de memorisation portable de type carte a puce
AU30590/00A AU3059000A (en) 1999-02-08 2000-01-24 Method for the production of a chip-card type portable storage medium
CN00803573A CN1384979A (zh) 1999-02-08 2000-01-24 用于生产芯片卡便携存储介质的方法
EP00900651A EP1153432A1 (fr) 1999-02-08 2000-01-24 Procede de fabrication de support de memorisation portable de type carte a puce

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9901454A FR2789505B1 (fr) 1999-02-08 1999-02-08 Procede de fabrication de support de memorisation portable de type carte a puce

Publications (2)

Publication Number Publication Date
FR2789505A1 FR2789505A1 (fr) 2000-08-11
FR2789505B1 true FR2789505B1 (fr) 2001-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR9901454A Expired - Fee Related FR2789505B1 (fr) 1999-02-08 1999-02-08 Procede de fabrication de support de memorisation portable de type carte a puce

Country Status (5)

Country Link
EP (1) EP1153432A1 (fr)
CN (1) CN1384979A (fr)
AU (1) AU3059000A (fr)
FR (1) FR2789505B1 (fr)
WO (1) WO2000048250A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10208168C1 (de) * 2002-02-26 2003-08-14 Infineon Technologies Ag Datenträgerkarte
FR2846446B1 (fr) * 2002-10-28 2005-02-18 Oberthur Card Syst Sa Carte a puce comportant un composant debouchant et un procede de fabrication
TWI557853B (zh) * 2014-11-12 2016-11-11 矽品精密工業股份有限公司 半導體封裝件及其製法

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2684471B1 (fr) * 1991-12-02 1994-03-04 Solaic Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
DE19713641A1 (de) * 1997-04-02 1998-10-08 Ods Gmbh & Co Kg Minichipkarte sowie Verfahren zu ihrer Herstellung

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FR2789505A1 (fr) 2000-08-11
WO2000048250A1 (fr) 2000-08-17
CN1384979A (zh) 2002-12-11
EP1153432A1 (fr) 2001-11-14
AU3059000A (en) 2000-08-29

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