CN1384979A - 用于生产芯片卡便携存储介质的方法 - Google Patents
用于生产芯片卡便携存储介质的方法 Download PDFInfo
- Publication number
- CN1384979A CN1384979A CN00803573A CN00803573A CN1384979A CN 1384979 A CN1384979 A CN 1384979A CN 00803573 A CN00803573 A CN 00803573A CN 00803573 A CN00803573 A CN 00803573A CN 1384979 A CN1384979 A CN 1384979A
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- Prior art keywords
- chip
- storage medium
- join domain
- cavity
- integrated circuit
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- H—ELECTRICITY
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR99/01454 | 1999-02-08 | ||
FR9901454A FR2789505B1 (fr) | 1999-02-08 | 1999-02-08 | Procede de fabrication de support de memorisation portable de type carte a puce |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1384979A true CN1384979A (zh) | 2002-12-11 |
Family
ID=9541732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00803573A Pending CN1384979A (zh) | 1999-02-08 | 2000-01-24 | 用于生产芯片卡便携存储介质的方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1153432A1 (fr) |
CN (1) | CN1384979A (fr) |
AU (1) | AU3059000A (fr) |
FR (1) | FR2789505B1 (fr) |
WO (1) | WO2000048250A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105702658A (zh) * | 2014-11-12 | 2016-06-22 | 矽品精密工业股份有限公司 | 半导体封装件及其制法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10208168C1 (de) | 2002-02-26 | 2003-08-14 | Infineon Technologies Ag | Datenträgerkarte |
FR2846446B1 (fr) * | 2002-10-28 | 2005-02-18 | Oberthur Card Syst Sa | Carte a puce comportant un composant debouchant et un procede de fabrication |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2684471B1 (fr) * | 1991-12-02 | 1994-03-04 | Solaic | Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue. |
DE19713641A1 (de) * | 1997-04-02 | 1998-10-08 | Ods Gmbh & Co Kg | Minichipkarte sowie Verfahren zu ihrer Herstellung |
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1999
- 1999-02-08 FR FR9901454A patent/FR2789505B1/fr not_active Expired - Fee Related
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2000
- 2000-01-24 WO PCT/FR2000/000151 patent/WO2000048250A1/fr not_active Application Discontinuation
- 2000-01-24 CN CN00803573A patent/CN1384979A/zh active Pending
- 2000-01-24 AU AU30590/00A patent/AU3059000A/en not_active Abandoned
- 2000-01-24 EP EP00900651A patent/EP1153432A1/fr not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105702658A (zh) * | 2014-11-12 | 2016-06-22 | 矽品精密工业股份有限公司 | 半导体封装件及其制法 |
CN105702658B (zh) * | 2014-11-12 | 2019-04-05 | 矽品精密工业股份有限公司 | 半导体封装件及其制法 |
Also Published As
Publication number | Publication date |
---|---|
WO2000048250A1 (fr) | 2000-08-17 |
FR2789505A1 (fr) | 2000-08-11 |
AU3059000A (en) | 2000-08-29 |
EP1153432A1 (fr) | 2001-11-14 |
FR2789505B1 (fr) | 2001-03-09 |
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