CN1384979A - 用于生产芯片卡便携存储介质的方法 - Google Patents

用于生产芯片卡便携存储介质的方法 Download PDF

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Publication number
CN1384979A
CN1384979A CN00803573A CN00803573A CN1384979A CN 1384979 A CN1384979 A CN 1384979A CN 00803573 A CN00803573 A CN 00803573A CN 00803573 A CN00803573 A CN 00803573A CN 1384979 A CN1384979 A CN 1384979A
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Prior art keywords
chip
storage medium
join domain
cavity
integrated circuit
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Pending
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CN00803573A
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English (en)
Chinese (zh)
Inventor
P·帕特里斯
O·布鲁尼特
D·埃尔巴兹
B·卡尔瓦斯
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Gemplus SA
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Gemplus SA
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Publication of CN1384979A publication Critical patent/CN1384979A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
CN00803573A 1999-02-08 2000-01-24 用于生产芯片卡便携存储介质的方法 Pending CN1384979A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR99/01454 1999-02-08
FR9901454A FR2789505B1 (fr) 1999-02-08 1999-02-08 Procede de fabrication de support de memorisation portable de type carte a puce

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Publication Number Publication Date
CN1384979A true CN1384979A (zh) 2002-12-11

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CN00803573A Pending CN1384979A (zh) 1999-02-08 2000-01-24 用于生产芯片卡便携存储介质的方法

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EP (1) EP1153432A1 (fr)
CN (1) CN1384979A (fr)
AU (1) AU3059000A (fr)
FR (1) FR2789505B1 (fr)
WO (1) WO2000048250A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105702658A (zh) * 2014-11-12 2016-06-22 矽品精密工业股份有限公司 半导体封装件及其制法

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Publication number Priority date Publication date Assignee Title
DE10208168C1 (de) 2002-02-26 2003-08-14 Infineon Technologies Ag Datenträgerkarte
FR2846446B1 (fr) * 2002-10-28 2005-02-18 Oberthur Card Syst Sa Carte a puce comportant un composant debouchant et un procede de fabrication

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Publication number Priority date Publication date Assignee Title
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2684471B1 (fr) * 1991-12-02 1994-03-04 Solaic Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
DE19713641A1 (de) * 1997-04-02 1998-10-08 Ods Gmbh & Co Kg Minichipkarte sowie Verfahren zu ihrer Herstellung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105702658A (zh) * 2014-11-12 2016-06-22 矽品精密工业股份有限公司 半导体封装件及其制法
CN105702658B (zh) * 2014-11-12 2019-04-05 矽品精密工业股份有限公司 半导体封装件及其制法

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WO2000048250A1 (fr) 2000-08-17
FR2789505A1 (fr) 2000-08-11
AU3059000A (en) 2000-08-29
EP1153432A1 (fr) 2001-11-14
FR2789505B1 (fr) 2001-03-09

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