JP2023539512A5 - - Google Patents
Info
- Publication number
- JP2023539512A5 JP2023539512A5 JP2023513933A JP2023513933A JP2023539512A5 JP 2023539512 A5 JP2023539512 A5 JP 2023539512A5 JP 2023513933 A JP2023513933 A JP 2023513933A JP 2023513933 A JP2023513933 A JP 2023513933A JP 2023539512 A5 JP2023539512 A5 JP 2023539512A5
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- film
- solvent
- overcoat
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063073047P | 2020-09-01 | 2020-09-01 | |
| US63/073,047 | 2020-09-01 | ||
| US17/125,609 | 2020-12-17 | ||
| US17/125,609 US11656550B2 (en) | 2020-09-01 | 2020-12-17 | Controlling semiconductor film thickness |
| PCT/US2021/040788 WO2022051025A1 (en) | 2020-09-01 | 2021-07-08 | Controlling semiconductor film thickness |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023539512A JP2023539512A (ja) | 2023-09-14 |
| JP2023539512A5 true JP2023539512A5 (https=) | 2024-03-28 |
| JP7688816B2 JP7688816B2 (ja) | 2025-06-05 |
Family
ID=80356605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023513933A Active JP7688816B2 (ja) | 2020-09-01 | 2021-07-08 | 半導体膜厚を制御する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11656550B2 (https=) |
| JP (1) | JP7688816B2 (https=) |
| KR (1) | KR20230058430A (https=) |
| TW (1) | TWI881160B (https=) |
| WO (1) | WO2022051025A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11776808B2 (en) * | 2020-03-17 | 2023-10-03 | Tokyo Electron Limited | Planarization of spin-on films |
| US20240085795A1 (en) * | 2022-09-13 | 2024-03-14 | Tokyo Electron Limited | Patterning a semiconductor workpiece |
| US12598747B2 (en) | 2022-11-01 | 2026-04-07 | Tokyo Electron Limited | Fabricating three-dimensional semiconductor structures |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050255410A1 (en) | 2004-04-29 | 2005-11-17 | Guerrero Douglas J | Anti-reflective coatings using vinyl ether crosslinkers |
| US20070138699A1 (en) | 2005-12-21 | 2007-06-21 | Asml Netherlands B.V. | Imprint lithography |
| JP2009042582A (ja) | 2007-08-10 | 2009-02-26 | Tokyo Ohka Kogyo Co Ltd | 微細パターン形成方法及び被覆膜形成用材料 |
| KR101439394B1 (ko) * | 2008-05-02 | 2014-09-15 | 삼성전자주식회사 | 산 확산을 이용하는 더블 패터닝 공정에 의한 반도체소자의 미세 패턴 형성 방법 |
| US20100015550A1 (en) * | 2008-07-17 | 2010-01-21 | Weihong Liu | Dual damascene via filling composition |
| JP5011345B2 (ja) * | 2009-05-15 | 2012-08-29 | 東京エレクトロン株式会社 | レジストパターンのスリミング処理方法 |
| US9081277B2 (en) * | 2010-12-24 | 2015-07-14 | Fujifilm Corporation | Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition |
| US8790867B2 (en) | 2011-11-03 | 2014-07-29 | Rohm And Haas Electronic Materials Llc | Methods of forming photolithographic patterns by negative tone development |
| US10090376B2 (en) | 2013-10-29 | 2018-10-02 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and methods of forming capacitor structures |
| KR20160083080A (ko) * | 2013-11-08 | 2016-07-11 | 도쿄엘렉트론가부시키가이샤 | 화학적 폴리싱 및 평탄화를 위한 방법 |
| JP6196739B2 (ja) * | 2014-01-28 | 2017-09-13 | 東京エレクトロン株式会社 | 原子層堆積を用いずに自己整合ダブルパターニングを行う方法 |
| KR102193680B1 (ko) * | 2014-08-14 | 2020-12-21 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| TWI582536B (zh) | 2014-10-31 | 2017-05-11 | 羅門哈斯電子材料有限公司 | 圖案形成方法 |
| KR102344900B1 (ko) * | 2015-04-12 | 2021-12-28 | 도쿄엘렉트론가부시키가이샤 | 오픈 피처 내에 유전체 절연 구조를 생성하기 위한 차감 방법 |
| US10338466B2 (en) * | 2015-04-13 | 2019-07-02 | Tokyo Electron Limited | System and method for planarizing a substrate |
| US10061199B2 (en) | 2015-06-24 | 2018-08-28 | Tokyo Electron Limited | Methods of forming a mask for substrate patterning |
| TWI707400B (zh) | 2016-02-24 | 2020-10-11 | 日商日產化學工業股份有限公司 | 使用含矽組成物之半導體基板之平坦化方法 |
| US9869933B2 (en) * | 2016-03-07 | 2018-01-16 | Rohm And Haas Electronic Materials Llc | Pattern trimming methods |
| WO2017197288A1 (en) | 2016-05-13 | 2017-11-16 | Tokyo Electron Limited | Critical dimension control by use of a photo agent |
| US10241411B2 (en) | 2016-10-31 | 2019-03-26 | Rohm And Haas Electronic Materials Llc | Topcoat compositions containing fluorinated thermal acid generators |
| US10684549B2 (en) | 2016-12-31 | 2020-06-16 | Rohm And Haas Electronic Materials Llc | Pattern-formation methods |
| US11248086B2 (en) | 2018-05-01 | 2022-02-15 | Tokyo Ohka Kogyo Co., Ltd. | Hard-mask forming composition and method for manufacturing electronic component |
| US11605538B2 (en) * | 2018-10-31 | 2023-03-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Protective composition and method of forming photoresist pattern |
| US11393694B2 (en) | 2018-11-13 | 2022-07-19 | Tokyo Electron Limited | Method for planarization of organic films |
| KR102890564B1 (ko) * | 2019-01-29 | 2025-11-24 | 램 리써치 코포레이션 | 기판들의 환경에 민감한 표면들을 위한 희생적 보호 층 |
| US20210294148A1 (en) * | 2020-03-17 | 2021-09-23 | Tokyo Electron Limited | Planarizing Organic Films |
| JP2022099428A (ja) * | 2020-12-23 | 2022-07-05 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 犠牲層の上部を除去する方法、それに用いられる犠牲溶液および酸性水溶液 |
-
2020
- 2020-12-17 US US17/125,609 patent/US11656550B2/en active Active
-
2021
- 2021-07-08 JP JP2023513933A patent/JP7688816B2/ja active Active
- 2021-07-08 WO PCT/US2021/040788 patent/WO2022051025A1/en not_active Ceased
- 2021-07-08 KR KR1020237009232A patent/KR20230058430A/ko active Pending
- 2021-08-30 TW TW110131993A patent/TWI881160B/zh active
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